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OpenEmbedded BSP Layer for the boards
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fboudra Merge pull request #316 from YoeDistro/yoe/mut
burn-boot: Add missing python to rdeps
Latest commit 425808f Aug 20, 2019
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conf layer.conf: Add warrior to compatible release series Apr 2, 2019
recipes-android/abootimg abootimg: tool to create fastboot images Jan 26, 2015
recipes-bsp burn-boot: Add missing python to rdeps Aug 17, 2019
recipes-connectivity/uim remove whitespaces Sep 16, 2016
recipes-graphics add hikey patch Apr 25, 2019
recipes-kernel linux-firmware: Relax package version match Jul 16, 2019
COPYING.MIT Add skeleton Jan 16, 2015



The official OpenEmbedded/Yocto Project BSP layer for the machines

The meta-96boards layer depends on:

URI: git://
layers: meta
branch: master

URI: git://
layers: meta-oe
branch: master

Please follow the recommended setup procedures of your OE distribution. For Angstrom that is, other distros should have similar online resources.


Please note that the support for Qualcomm based, such as the DragonBoard 410c, is done through the meta-qualcomm BSP layer: not meta-96boards.

Hikey kernel enables CONFIG_MODULE_SIG options which enforces that openssl dev package is installed on build host.

for debian-like systems

sudo apt-get install libssl-dev

fedora-like systems

sudo yum install openssl-devel


Please use github for pull requests:

Reporting bugs

The github issue tracker ( is being used to keep track of bugs.


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