Changes that I apparently forgot to commit a while back.

README.txt

@@ -1,12 +1,35 @@
-Capacitive Soil Moisture Sensor v1.0
+Capacitive Soil Moisture Sensor v0.0
 ====================================
 
 http://www.deepdarc.com/soil-moisture-sensor/
 
 Created by Robert Quattlebaum <darco@deepdarc.com>
 
+## Important Notice ##
+
+This project is unreleased and under active development. It is not advisable
+to start building any significant number of these sensors until this project
+is officially released. However, if you would like to contribute to help
+speed this project along, any help is more than welcome.
+
+## Hardware Specifications ##
+
+### Capacitive Sensor ###
+
+ * Observed Precision: ±0.5% @ 3.3v, ±0.2% @ 5.0v
+ * Observed Accuracy: ±10%
+ * Raw Resolution: 16 Bits
+ * Calibrated Resolution: 10 Bits
+
+### Temperature Sensor ###
+
+ * Observed Precision: ±0.1°C
+ * Observed Accuracy: ±5.0°C
+ * Resolution: 12 Bits
+
 ## License
 
 Software is licensed for use under the GPLv2 (See COPYING-SW)
 
 Hardware is licensed for use under the CC-BY-SA-3.0 (See COPYING-HW)
+

eagle.epf

@@ -1,10 +1,20 @@
 [Eagle]
 Version="05 08 00"
 Platform="Mac OS X"
+Serial="62191E841E-LSR-WLM-1EL"
 Globals="Globals"
 Desktop="Desktop"
 
 [Globals]
 AutoSaveProject=1
+UsedLibrary="/Users/darco/Projects/eagle-lbr/SparkFun.lbr"
+
+[Win_1]
+Type="Control Panel"
+Loc="134 79 1267 540"
+State=2
+Number=0
 
 [Desktop]
+Screen="1440 900"
+Window="Win_1"

main.c

@@ -8,9 +8,8 @@
 **	Copyright (c) 2011 Robert S. Quattlebaum. All Rights Reserved.
 **
 **	This package is free software; you can redistribute it and/or
-**	modify it under the terms of the GNU General Public License as
-**	published by the Free Software Foundation; either version 2 of
-**	the License, or (at your option) any later version.
+**	modify it under the terms of the GNU General Public License
+**	version 2 as published by the Free Software Foundation.
 **
 **	This package is distributed in the hope that it will be useful,
 **	but WITHOUT ANY WARRANTY; without even the implied warranty of

notes.txt

@@ -98,5 +98,17 @@ to make sure that they don't let water seep in and start conducting. This has
 turned out to be a major pain. The design has already been updated to not
 have so many vias, but that doesn't fix the 40+ boards I already have.
 
+----
+
+FUSE SETTINGS:
+
+With Debug Wire:
+	EXTENDED: 0xFF
+	HIGH: 0x95
+	LOW: 0xE2
 
+W/Out Debug Wire:
+	EXTENDED: 0xFF
+	HIGH: 0xD5
+	LOW: 0xE2
 

protocol.txt

@@ -19,19 +19,46 @@ The recommended and default physical bus protocol is Fox-Bus™.
 
 ## IMPORTANT PATENT NOTICE ##
 
-THE PHYSICAL LAYER OF THE 1-WIRE® PROTOCOL IS PATENTED: USPAT#6,108,751
+THE PHYSICAL LAYER OF THE 1-WIRE® PROTOCOL IS PATENTED:
+
+	* USPAT#6,108,751
+	* USPAT#5,974,504
+	* USPAT#5,864,872
+	* USPAT#5,587,955
+	* USPAT#5,517,015
 
 MAXIM-IC, THE OWNER OF THIS PATENT, HAS EXPLICITLY STATED THAT THEY ARE
 UNABLE/UNWILLING TO GRANT ANY LICENSE FOR THE USE OF THE 1-WIRE PROTOCOL
-ON NON-MAXIM SLAVE DEVICES. AS SUCH, IF YOU CHOOSE TO USE OF THE 1-WIRE
-PHYSICAL PROTOCOL FOR THIS PROJECT, IT COULD EXPOSE YOU TO SUBSTANTIAL AND
-DEVISTATING CIVIL LIABILITY---EVEN FOR PERSONAL USE.
+ON NON-MAXIM SLAVE DEVICES. AS SUCH, IF YOU CHOOSE TO USE THE 1-WIRE PHYSICAL
+PROTOCOL FOR THIS PROJECT, IT COULD EXPOSE YOU TO SUBSTANTIAL AND DEVISTATING
+CIVIL LIABILITY---EVEN FOR PERSONAL USE.
 
 USE FOX-BUS™ INSTEAD. YOU HAVE BEEN WARNED.
 
+(THE 1-WIRE PROTOCOL WILL BE UNENCOMBERED BY PATENTS IN THE UNITED STATES NO
+SOONER THAN 2013-05-14)
+
+### 1-Wire Link-layer ###
+
+The earliest published reference to the link-layer of the 1-Wire protocol
+that I have found so far is in USPAT#5,517,015. In that patent, the link-layer
+protocol is not mentioned in the claims, even though it is described in the
+body of the patent. If it isn't claimed, it isn't covered. USPAT#5,809,518 comes
+close, but its claims are very narrow in scope. Even if those claims could be
+made to apply to this application, the patent was filed over one year after the
+filing date for USPAT#5,517,015---which originally published (but did not claim)
+the link-layer bus protocol for 1-Wire. From what I understand, under US patent
+law, an entity has one year after an invention is first published to file for a
+patent. That has clearly not happened in the case for the 1-Wire link-level
+protocol.
+
+Baring any discovery which would indicate otherwise I am assuming that the
+link-layer of the 1-Wire protocol is, for this application, not patent
+encumbered.
+
 # Link-layer Bus Protocol #
 
-The link-layer of the 1-Wire® protocol appears to *NOT* be patented. As such,
+Since link-layer of the 1-Wire® protocol appears to not be patented,
 the link-layer bus protocol used for this project is similar to that of
 1-Wire®. See any documentation of the 1-Wire® protocol for more details.