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Reflow Oven Controller for the TI MSP430 Launchpad
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README.md

README.md

Reflow Oven Controller for the TI MSP430 Launchpad

  • Built for the TI MSP430G2553 Microcontroller
  • Software Version: 1.5
  • Date: 06-09-2014
  • Code Author: Kristen Villemez, Juan Chong
  • Hardware Design: Juan Chong
  • Website: http://www.juanjchong.com/
  • Last Updated By: Juan Chong

Overview

This code is used to control a reflow oven. It allows for the option to change solder types (lead vs. lead-free) before the reflow process is started. Definitions for both profiles are included in this code. This code is designed to work with the Reflow Oven Controller BoosterPack designed by Juan Chong. It uses the MAX31855 thermocouple amplifier breakout board and library, and an on-board LCD screen for status display. A PID controller library is used to control a solid state relay which drives the heater elements in a toaster oven.

DISCLAIMER!

HIGH VOLTAGES AND CURRENTS ARE DANGEROUS! PLEASE UNDERSTAND THE RISKS OF WORKING WITH DANGEROUS HARDWARE BEFORE YOU BEGIN! USE COMMON SENSE WHEN WORKING WITH THIS PROJECT. USE OF THIS HARDWARE AND SOFTWARE IS AT YOUR OWN RISK, AND WE ARE NOT RESPONSIBLE OR LIABLE FOR ANY DAMAGE TO YOU OR YOUR SURROUNDINGS THAT MAY OCCUR OUT OF USE OF THIS AND RELATED MATERIALS!

THIS SOFTWARE IS MADE AVAILABLE "AS IS" WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF CONDITION, UNINTERRUPTED USE, MERCHANTABILITY, FITNESS FOR A PARTICULAR USE, OR NON-INFRINGEMENT.

Basic Use

When the controller is first started, it will display the splash screen and prompt the user to select a solder type - lead (Pb) or lead-free (NoPb). The default is lead solder. If the user wishes to run the lead-free profile, press the Solder Select button on the BoosterPack/Shield. Once you are ready to start the reflow process, press the Start Reflow button and wait for the system to run through the reflow profile.

Libraries

Attributions

Licenses

This hardware and software is released under:

Creative Commons Share Alike v3.0 License
http://creativecommons.org/licenses/by-sa/3.0/
A copy of this license can be found in the LICENSE file within this project.

You are free to use this code and/or modify it. All we ask is an attribution, including supporting libraries and their respective authors used in this software. If you would like to use this software and hardware for commercial purposes, please contact the author using the website listed above.

Revision History

1.0 - Initial release

1.1 - Fix bug where oven does not go into ERROR state when thermocouple communication is lost

1.2 - Optimized ISR tasks and LCD updating to avoid timing and memory issues.

1.3 - Added a step to ask the user whether the thermocouple has been placed on the PCB.

1.4 - Added a countdown to start reflow, fixed a bug where the oven keeps wanting to approach 50C after reflow, adjusted PID values, added asthetics to LCD, improved push button response, and cleaned up comments.

1.5 - Added error handling and guardbanding for probe measurements, added and updated comments, improved program flow and removed unused variables.

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