Therminator: Thermal Simulator for Portable Devices
Switch branches/tags
Nothing to show
Clone or download
Fetching latest commit…
Cannot retrieve the latest commit at this time.
Permalink
Failed to load latest commit information.
examples
src
LICENSE
Makefile
README

README

  _____  _                             _                _               
 |_   _|| |__    ___  _ __  _ __ ___  (_) _ __    __ _ | |_  ___   _ __ 
   | |  | '_ \  / _ \| '__|| '_ ` _ \ | || '_ \  / _` || __|/ _ \ | '__|
   | |  | | | ||  __/| |   | | | | | || || | | || (_| || |_| (_) || |   
   |_|  |_| |_| \___||_|   |_| |_| |_||_||_| |_| \__,_| \__|\___/ |_|   

Therminator: Thermal Simulator for Portable Devices
====================================================

CONTENTS
========
	1) License
	2) Change log
	3) Introduction
	4) Requirements
	5) Installation
	6) Usage
	7) Contact us
	8) Reference

1) License
============
Please refer to the LICENSE file.

2) Change Log
===============
    Date   | Version |    Details
---------------------------------------------------------------------------------
 9/24/2014 |  v1.00  | Initial release.
---------------------------------------------------------------------------------
11/13/2014 |  v1.01  | - Adding CUDA library path to Makefile for GPU processing
           |         | - Adding an assertion to check the components listed in
           |         |    the power trace file against the design file


3) Introduction
=================
Therminator
-----------
Therminator is a compact thermal modeling-based component-level thermal 
simulator that targets small form-factor mobile devices (such as 
smartphones). It produces temperature maps for all components, including 
the application processor, battery, display, and other key device components, 
as well as the skin of the device itself, with high accuracy and short runtime.

Therminator takes two input files as explained next. The specs.xml file 
describes the smartphone design, including components of interest and 
their geometric dimensions (length, width, and thickness) and relative 
positions. Therminator has a built-in library storing properties (i.e., 
thermal conductivity, density, and specific heat) of common materials that 
are used to manufacture smartphones. In addition, users can override
these properties or specify new materials through the specs.xml file. The
power.trace file provides the usage information (power consumption) of 
those components that consume power and generate heat, e.g., ICs, battery,
and display. The power.trace can be obtained through real measurements 
or other power estimation tools/methods. power.trace is a separate file 
so that one can easily interface a performance-power simulator with Therminator. 
Section (6) of this README file explains the syntax of input files.

More details about Therminator can be found in [1].

Developers
----------
Mohammad Javad Dousti <dousti@usc.edu>
Qing Xie <xqing@usc.edu>
Massoud Pedram <pedram@usc.edu>



4) Requirements
===============
- GNU build utilities (GCC 4+ and Make). 
  You are recommended to use Linux. In case you want to use Windows, make 
  sure to install MinGW or Cygwin.

- Install CULA Dense library along with an NVIDIA GPU with CUDA support (optional).
  Therminator allows a parallel computing feature that uses NVIDIA GPUs 
  to perform matrix computations. It is highly recommended to enable this 
  feature as it can significantly reduce the runtime. To utilize this feature, 
  you need to download the CULA Dense library from 
  http://www.culatools.com/downloads/dense/ 
  and install it on your machine. Next, open the Makefile in the Therminator package and
  change lines 7 and 8, so that INCLUDE and LIBRARIES variables point to the directory 
  where CULA is installed.
  
Note: Therminator can be run on Linux, Mac OS X and Windows given the above requirements 
      are properly installed. To install GCC on Windows, it is recommended to use MinGW
      which can be obtained from here.
      http://www.mingw.org
 
5) Installation
=================
1. Extract the downloaded terminator package.

2. Build Therminator with either of the following options:
	a) If you have CULA Dense library, you may enable the parallel computing feature by 
	using the following command:
	make SOLVER=GPU
	
	b) If you don't have CULA Dense library installed, use this command:
	make

3. To remove all of the built files, type:
	make clean


6) Usage
========
Directories
-----------
Therminator
|--src
    |-- header
        `-- *.h -> header files
    |-- libs
        `-- pugixml -> Light-weight, simple and fast XML parser for C++
    `-- *.cpp -> Therminator source code
|-- examples
    |-- package_*.xml -> design specification files
    |-- power_*.trace -> power trace files
    `-- Temperature_Results.txt -> Sample output file for the given GS4 and its power trace
|-- LICENSE -> license file
`-- README -> this file


Input files syntax
-------------------
1. Design specification file (specs.xml)
	a) Two example files (package_GS4.xml and package_MDP.xml) have been provided 
	along with the package of Therminator. You can basically follow them to specify 
	a design specification.
	
	b) The outer hierarchy is the device level description, where you can specify
	the overall dimensions of the device and the ambient temperature. Three sub-
	hierarchies are material, floorplan, and component.
	
	c) The material hierarchy specifies the material properties that are used
	to build the device. The current version of Therminator is concerned 
	with steady-state temperature maps, and thereby, only the thermal conductivity 
	information matters. The feature that captures transient temperatures will be 
	developed later.
	
	d) The floorplan hierarchy is an optional input that specifies the 
	floorplan of some selected components. For example, in package_GS4.xml
	file, a floor plan is specified for the Snapdragon_600 processor. The 
	purpose of this is to provide higher accuracy of temperature maps, given 
	more detailed information about processors, or other IC components.
	Note that the coordinates in the floorplan hierarchy is re-normalized such 
	that the left-bottom corner of the component is set to be (0,0).
	
	e) The component hierarchy specifies the components of interest. The properties 
	of each component include: 
		i) coordinates - numerical values. The coordinates (x, y, and z) are relative 
		to the left-bottom corner of the device.
		
		ii) dimensions -  numerical values. Length, width, and height of the component.
		
		iii) materials - The type of material shall be specified in the material
		hierarchy.
		
		iv) power gen - yes/no. This property indicates whether this component 
		consumes power and generates heat. If it is specified as yes, the power 
		consumption shall be provided in the power trace file.

		fill - some IC chips have a thermal pad pasted on it. If the value is set 
		as yes, Therminator will automatically calculates the free space above this 
		component, and fills the free space with material specified in filling_material.
		
		v) lateral_connectivity - Many materials are orthotropic (i.e., having 
		different thermal conductivity along x, y, and z directions.) This tells
		Therminator whether this component is orthotropic.
		
		vi) resolution - How many sub-components will Therminator divide this 
		component to. You can specify resolution in x, y, and z directions. An
		automated approach for determining the resolution will be developed later.
		
		vii) Note that, currently, users need to identify major free space manually
		and specify them as air blocks (ab). This will prevent singularity issue 
		when reversing the conduction matrix. Automatic gap-fill will be 
		developed in next release.
	
2. Power trace file
	This file specifies the power consumption of each component that is declared
	as 'yes' in its power gen property in the design specification file.
	a) If you did not enable the floorplan feature, then the number power 
	consumptions you provide here is the same as those components that consume 
	power in design specification file.
	
	b) If you enable the floorplan feature and the component consumes power, 
	you need to provide the power consumption for each component in the 
	floorplan. You can add column with name of 'floorplanname-componentname'.

Running Therminator
-------------------
usage: therminator -d <file> -p <file> -o <file>
Therminator produces accurate temperature maps given the power consumption
and physical characteristics.
 -h			Shows this help menu
 -d <file>	Input design specification file name
 -p <file>	Input power trace file
 -o <file>	Output file


Example Outputs
---------------
Therminator outputs the temperature (in Celsius) of each sub-component in the 
output results file. In case of multiple layers specified in the z-direction, 
results on the top have the highest z value.

For example, the provided design for Snapdragon_600 in the package_GS4.xml 
has the resolution of 6x6x3 (a total of 108 subcomponents). Running 

	$ ./therminator -d examples/package_GS4.xml -p examples/power_GS4.trace \
		-o Temperature_Results.txt

gives this output:

y
^			z = 3 (top layer)
|60.376		60.7172	61.0108	60.9561	60.8312	60.0348	
|60.9646	61.3455	61.6756	61.6117	61.4722	60.5633	
|61.3078	61.7083	62.0559	61.987	61.8393	60.8779	
|61.3934	61.7916	62.1365	62.0672	61.9197	60.9622	
|61.2314	61.6056	61.9277	61.8628	61.7237	60.8269	
|60.8264	61.1592	61.4399	61.3836	61.2596	60.4854	
|----------------------------------------------------> x
|					z = 2
|62.08		62.3741	62.6072	62.5708	62.4319	61.7898	
|62.5968	62.921	63.1801	63.1376	62.9835	62.2609	
|62.9024	63.2422	63.5144	63.4684	63.3058	62.5431	
|62.9796	63.3177	63.5877	63.5411	63.3786	62.6184	
|62.8445	63.164	63.4166	63.3724	63.2184	62.5039	
|62.5136	62.8031	63.0259	62.9867	62.8478	62.2204	
|----------------------------------------------------> x
|			z = 1  (bottom layer)
|61.9131	62.1597	62.3395	62.3151	62.1786	61.6693	
|62.3804	62.6498	62.8478	62.819	62.6683	62.101	
|62.6489	62.9304	63.1378	63.1064	62.9479	62.3507	
|62.7171	62.9973	63.203	63.1709	63.0122	62.4168	
|62.609		62.8749	63.0677	63.0367	62.8854	62.3235	
|62.3428	62.5869	62.7584	62.73	62.5923	62.0925	
-----------------------------------------------------> x


7) Contact us
===============
If you have any question, find any bug, or encounter any problem when using
Therminator, please contact Mohammad Javad Dousti <dousti@usc.edu> or Qing Xie 
<xqing@usc.edu>.


8) Reference
==============
[1] Qing Xie, Mohammad Javad Dousti, and Massoud Pedram, "Therminator: A
Thermal Simulator for Smartphones Producing Accurate Chip and Skin Temperature
Maps", in Proc. of the International Symposium on Low Power Electronics and 
Design (ISLPED), pp. 117-122, Aug, 2014.