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SSOP-18_4.4x6.5mm_P0.65mm_HandSolder.kicad_mod
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SSOP-18_4.4x6.5mm_P0.65mm_HandSolder.kicad_mod
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(module SSOP-18_4.4x6.5mm_P0.65mm_HandSolder (layer F.Cu) (tedit 5F7574F1)
(descr "SSOP18: plastic shrink small outline package; 18 leads; body width 4.4 mm (http://toshiba.semicon-storage.com/info/docget.jsp?did=30523&prodName=TBD62783APG)")
(tags "SSOP 0.65")
(solder_paste_ratio -0.05)
(attr smd)
(fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value SSOP-18_4.4x6.5mm_P0.65mm (at 0 4.2) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start -1.2 -3.25) (end 2.2 -3.25) (layer F.Fab) (width 0.1))
(fp_line (start 2.2 -3.25) (end 2.2 3.25) (layer F.Fab) (width 0.1))
(fp_line (start 2.2 3.25) (end -2.2 3.25) (layer F.Fab) (width 0.1))
(fp_line (start -2.2 3.25) (end -2.2 -2.25) (layer F.Fab) (width 0.1))
(fp_line (start -2.2 -2.25) (end -1.2 -3.25) (layer F.Fab) (width 0.1))
(fp_line (start -3.2 -3.06) (end -2.31 -3.06) (layer F.SilkS) (width 0.12))
(fp_line (start -2.31 -3.06) (end -2.31 -3.36) (layer F.SilkS) (width 0.12))
(fp_line (start -2.31 -3.36) (end 2.31 -3.36) (layer F.SilkS) (width 0.12))
(fp_line (start 2.31 -3.36) (end 2.31 -3.06) (layer F.SilkS) (width 0.12))
(fp_line (start -2.31 3.06) (end -2.31 3.36) (layer F.SilkS) (width 0.12))
(fp_line (start -2.31 3.36) (end 2.31 3.36) (layer F.SilkS) (width 0.12))
(fp_line (start 2.31 3.36) (end 2.31 3.06) (layer F.SilkS) (width 0.12))
(fp_line (start -3.7 -3.5) (end 3.7 -3.5) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.7 -3.5) (end 3.7 3.5) (layer F.CrtYd) (width 0.05))
(fp_line (start 3.7 3.5) (end -3.7 3.5) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.7 3.5) (end -3.7 -3.5) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(pad 1 smd roundrect (at -2.9 -2.6) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 2 smd roundrect (at -2.9 -1.95) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 3 smd roundrect (at -2.9 -1.3) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 4 smd roundrect (at -2.9 -0.65) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 5 smd roundrect (at -2.9 0) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 6 smd roundrect (at -2.9 0.65) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 7 smd roundrect (at -2.9 1.3) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 8 smd roundrect (at -2.9 1.95) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 9 smd roundrect (at -2.9 2.6) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 18 smd roundrect (at 2.9 -2.6) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 17 smd roundrect (at 2.9 -1.95) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 16 smd roundrect (at 2.9 -1.3) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 15 smd roundrect (at 2.9 -0.65) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 14 smd roundrect (at 2.9 0) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 13 smd roundrect (at 2.9 0.65) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 12 smd roundrect (at 2.9 1.3) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 11 smd roundrect (at 2.9 1.95) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(pad 10 smd roundrect (at 2.9 2.6) (size 1.4 0.4) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
(model ${KISYS3DMOD}/Package_SO.3dshapes/SSOP-18_4.4x6.5mm_P0.65mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)