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USB_C_Receptacle_Nelton_5077CR-16-SMC2-BK-TR.kicad_mod
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USB_C_Receptacle_Nelton_5077CR-16-SMC2-BK-TR.kicad_mod
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(footprint "USB_C_Receptacle_Nelton_5077CR-16-SMC2-BK-TR" (version 20211014) (generator pcbnew)
(layer "F.Cu")
(tedit 62417079)
(descr "USB Type-C receptacle for USB 2.0 and PD, http://www.krhro.com/uploads/soft/180320/1-1P320120243.pdf")
(tags "usb usb-c 2.0 pd")
(attr smd)
(fp_text reference "REF**" (at 0 -6.3) (layer "F.SilkS")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp a144ce76-cc23-44fb-8108-bf18e64a4c3d)
)
(fp_text value "USB_C_Receptacle_Nelton_5077CR-16-SMC2-BK-TR" (at 0 5.1) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 0ca5cf76-e951-4e58-a402-14dc42a864b3)
)
(fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
(effects (font (size 1 1) (thickness 0.15)))
(tstamp 9189a13a-f353-4ddb-8257-370c54398cd0)
)
(fp_line (start 4.32 -2.8) (end 4.32 -1.5) (layer "F.SilkS") (width 0.12) (tstamp 177e7db1-b916-4e65-ace8-532e6e1f85db))
(fp_line (start -4.32 1.5) (end -4.32 2.6) (layer "F.SilkS") (width 0.12) (tstamp 7abeef8d-db92-4e88-b3d6-7c7e4efa4938))
(fp_line (start -4.32 -2.8) (end -4.32 -1.5) (layer "F.SilkS") (width 0.12) (tstamp 9513b845-7495-41b4-99da-c8a12a5f4b76))
(fp_line (start 4.32 1.5) (end 4.32 2.6) (layer "F.SilkS") (width 0.12) (tstamp bd122681-67e3-4c23-b564-57e345c7c818))
(fp_line (start -4.32 2.6) (end 4.32 2.6) (layer "F.SilkS") (width 0.12) (tstamp f40329f5-4d09-479c-8f81-97fdcd13c5cd))
(fp_rect (start -5.25 -5.6) (end 5.5 2.75) (layer "F.CrtYd") (width 0.12) (fill none) (tstamp fb4efd18-28c9-499c-9f48-5d7447461da3))
(pad "" np_thru_hole circle (at 2.89 -3.68) (size 0.65 0.65) (drill 0.65) (layers F&B.Cu *.Mask) (tstamp 4558f1f0-2fa3-46e1-a220-284fa2707bb5))
(pad "" np_thru_hole circle (at -2.89 -3.68) (size 0.65 0.65) (drill 0.65) (layers F&B.Cu *.Mask) (tstamp e13b4b37-788a-41d5-87ca-c66be43ee32d))
(pad "A1" smd roundrect (at -3.25 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 245fae56-8b58-4bd8-bbf1-36624dc3fa3e))
(pad "A4" smd roundrect (at -2.45 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 412cd3c1-0d89-4ca6-be0e-1b17d8471f5a))
(pad "A5" smd roundrect (at -1.25 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 93953890-acba-456b-bb6d-b1e79179ffa0))
(pad "A6" smd roundrect (at -0.25 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 6a642da3-3122-4031-a6e9-68498b0f5bb9))
(pad "A7" smd roundrect (at 0.25 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 01b9b129-063c-4bae-b620-9610006254cb))
(pad "A8" smd roundrect (at 1.25 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 46ecdf8a-0917-4257-a388-b77e7451dc23))
(pad "A9" smd roundrect (at 2.45 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp a35f3da7-7460-43f1-99b7-9ed521817778))
(pad "A12" smd roundrect (at 3.25 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 3795b0f1-50f9-473e-9d26-381fc08b3c2d))
(pad "B1" smd roundrect (at 3.25 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp c9e8a0db-2a60-41d9-b783-6c4e64a8fb5d))
(pad "B4" smd roundrect (at 2.45 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 51b193ee-c8c2-4ee6-8d8c-14b79a2c1520))
(pad "B5" smd roundrect (at 1.75 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 45f8f791-f545-4341-9848-fb81a03703a6))
(pad "B6" smd roundrect (at 0.75 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp efc27675-62a0-44de-8210-29c2190dd309))
(pad "B7" smd roundrect (at -0.75 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 96622dcb-c1cc-4b7d-8455-8cd0ce1e5c34))
(pad "B8" smd roundrect (at -1.75 -4.9) (size 0.3 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 09bb6e12-e7e5-4788-b43e-4cc6c50a557a))
(pad "B9" smd roundrect (at -2.45 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp 70539c09-2020-4a42-a156-43d1513170d0))
(pad "B12" smd roundrect (at -3.25 -4.9) (size 0.6 1.14) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25) (tstamp eda87c04-3a59-4e2c-a9bd-f59ed31672aa))
(pad "S1" thru_hole oval (at -4.32 0) (size 1.4 2.4) (drill oval 0.8 1.6) (layers *.Cu *.Mask) (tstamp 5991ca6f-c5c1-4692-8fe9-cf4b7ca50c4b))
(pad "S1" thru_hole oval (at -4.32 -4.18) (size 1 2.3) (drill oval 0.6 1.7) (layers *.Cu *.Mask) (tstamp 69c3dc88-a37e-49ef-ae4d-497d3191ad5b))
(pad "S1" thru_hole oval (at 4.32 -4.18) (size 1 2.3) (drill oval 0.6 1.7) (layers *.Cu *.Mask) (tstamp af5ae63f-ef36-487e-a6b8-831b84890f25))
(pad "S1" thru_hole oval (at 4.32 0) (size 1.4 2.4) (drill oval 0.8 1.6) (layers *.Cu *.Mask) (tstamp e783dde5-f762-4528-9b55-9220820b0b1c))
(model "${AKIYUKIKICAD3D}/CUI_DEVICES_UJC-HP-3-SMT-TR.step"
(offset (xyz 0 2.2 1.3))
(scale (xyz 1 1 1))
(rotate (xyz -90 0 0))
)
)