Thermal Management Specifications

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Thermal Management Specifications

As an engineer, I want to design a thermal management system for a compact computer with a form factor similar to a Mac Mini, ensuring that the device operates within safe temperature ranges under typical load conditions.

Acceptance Criteria

• The system must be capable of dissipating heat generated by the CPU, GPU, SSD, and other components under peak load.
• The thermal solution should not exceed the sound level of 35 dBA at a distance of one meter under normal operation.
• The system should be able to operate safely and without thermal throttling in ambient temperatures up to 35°C.
• Any active cooling solutions (like fans) must have a minimum lifespan of 50,000 hours.
• The thermal design must fit within the physical constraints of the Mac Mini-like form factor without compromising performance.
• The materials used for thermal management must be compliant with RoHS (Restriction of Hazardous Substances) standards.
• The design should consider ease of maintenance and access to thermal management components.

graph LR
  A[CPU] -- Heat generation --> B((Cooling System))
  B -- Heat dissipation --> C{Chassis / External Environment}
  D[GPU] -- Heat generation --> B
  E[SSD] -- Heat generation --> B
  F[Other Components] -- Heat generation --> B

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