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Thermal Conductance Interface Conditions #10

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moosebuild opened this issue Dec 14, 2021 · 1 comment
Closed

Thermal Conductance Interface Conditions #10

moosebuild opened this issue Dec 14, 2021 · 1 comment
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c: heat conduction p: normal t: task Label for general tasks

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In GitLab by @cticenhour on Dec 14, 2021, 15:37

This issue is a reproduction of the archived freya#4 for SQA purposes. Please refer to that issue for any extended discussion that may exist beyond this description.

Reason

In order to realistically model SPS assemblies, both thermal and electrical conductance need to be properly handled at material interfaces.

Design

An electrical conductance condition already exists within ELK (ElectricalContactResistance), so a thermal conductance condition is needed. This is described in detail in Cincotti et al, Figure 4. A new InterfaceKernel for dissimilar materials would need to be made to duplicate the condition outlined there.

Impact

New capability.
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In GitLab by @sapitts on Jul 14, 2022, 16:13

mentioned in commit 2908ec2

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