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ble_bondmngr_cfg.h
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ble_bondmngr_cfg.h
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/* Copyright (c) 2012 Nordic Semiconductor. All Rights Reserved.
*
* The information contained herein is property of Nordic Semiconductor ASA.
* Terms and conditions of usage are described in detail in NORDIC
* SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT.
*
* Licensees are granted free, non-transferable use of the information. NO
* WARRANTY of ANY KIND is provided. This heading must NOT be removed from
* the file.
*
*/
/** @cond To make doxygen skip this file */
/** @file
*
* @defgroup ble_sdk_app_proximity_bondmngr_cfg Proximity Bond Manager Configuration
* @{
* @ingroup ble_sdk_app_proximity
* @brief Definition of bond manager configurable parameters
*/
#ifndef BLE_BONDMNGR_CFG_H__
#define BLE_BONDMNGR_CFG_H__
/**@brief Number of CCCDs used in the proximity application. */
#define BLE_BONDMNGR_CCCD_COUNT 5
/**@brief Maximum number of bonded centrals. */
#define BLE_BONDMNGR_MAX_BONDED_CENTRALS 4
#endif // BLE_BONDMNGR_CFG_H__
/** @} */
/** @endcond */