Skip to content
This repository has been archived by the owner on Oct 2, 2020. It is now read-only.

Add UFQFPN-28 #2445

Open
wants to merge 2 commits into
base: master
Choose a base branch
from
Open

Add UFQFPN-28 #2445

wants to merge 2 commits into from

Conversation

Antichees
Copy link

@Antichees Antichees commented Sep 1, 2020

datasheet
image
image

Package details (added by @cpresser)
image
image

@CLAassistant
Copy link

CLAassistant commented Sep 1, 2020

CLA assistant check
All committers have signed the CLA.

@myfreescalewebpage myfreescalewebpage added Addition Adds new footprint to library Pending reviewer A pull request waiting for a reviewer labels Sep 1, 2020
@cpresser
Copy link
Contributor

cpresser commented Sep 9, 2020

Hi and thanks for you contribution.
This is a footprint that should be generated by the Package_NoLead__DFN_QFN_LGA_SON generator.

It can already do the chamfered pads, but so far there is no support to make the chamfered pads slightly smaller as required here.

@Antichees Is you python-foo good enough for that? If not, I will try to find time to improve the generator so this footprint can be easily generatre.

@cpresser cpresser self-assigned this Sep 9, 2020
@cpresser cpresser removed the Pending reviewer A pull request waiting for a reviewer label Sep 9, 2020
@Antichees
Copy link
Author

Hi and thanks for you contribution.
This is a footprint that should be generated by the Package_NoLead__DFN_QFN_LGA_SON generator.

It can already do the chamfered pads, but so far there is no support to make the chamfered pads slightly smaller as required here.

@Antichees Is you python-foo good enough for that? If not, I will try to find time to improve the generator so this footprint can be easily generatre.

Hi
I will try, but it will hardly work.

@cpresser
Copy link
Contributor

cpresser commented Sep 9, 2020

I was just looking into the source so I can give you some hints.
Turns out, the feature is already there. I just was not aware of it. So no coding required. You just need to punch the correct numbers into the .yaml file.

 edge_heel_reduction: 0.05

image

@Antichees
Copy link
Author

I was just looking into the source so I can give you some hints.
Turns out, the feature is already there. I just was not aware of it. So no coding required. You just need to punch the correct numbers into the .yaml file.

 edge_heel_reduction: 0.05

image

@Antichees Antichees closed this Sep 13, 2020
@Antichees Antichees deleted the ST_UFQFPN-28 branch September 13, 2020 08:12
@Antichees Antichees restored the ST_UFQFPN-28 branch September 13, 2020 08:12
@Antichees Antichees reopened this Sep 13, 2020
@Antichees
Copy link
Author

I was just looking into the source so I can give you some hints.
Turns out, the feature is already there. I just was not aware of it. So no coding required. You just need to punch the correct numbers into the .yaml file.

 edge_heel_reduction: 0.05

image

Hi, i entered dimensions from the datasheet. but the footprint is different from the recommended one.

ST_UFQFPN-28_4x4mm_P0.5mm:
 device_type: 'UFQFPN'
 manufacturer: 'ST'
 #part_number: 'mpn'
 size_source: 'https://www.st.com/resource/en/datasheet/stm8l101k3.pdf#page=71'
 ipc_class: 'qfn' # 'qfn_pull_back'
 #ipc_density: 'least' #overwrite global value for this device.
 # custom_name_format:
 body_size_x:
   nominal: 4
 body_size_y:
   nominal: 4
 overall_height:
   minimum: 0.5
   nominal: 0.55
   maximum: 0.6

 lead_width:
   minimum: 0.18
   nominal: 0.25
   maximum: 0.30
 lead_len:
   minimum: 0.3
   nominal: 0.4
   maximum: 0.5

 pitch: 0.5
 num_pins_x: 7
 num_pins_y: 7
 edge_heel_reduction: 0.05
 chamfer_edge_pins: 0.2
 #pin_count_grid:
 #pad_length_addition: 0.5
 #suffix: '_Pad{pad_x:.2f}x{pad_y:.2f}mm_HandSolder'
 #include_suffix_in_3dpath: 'False'

Here's what I got.
image

@cpresser
Copy link
Contributor

You are correct, the footprint is not the same as the recommended one.
That is because the generator builds them with IPC compliant values. Most of them are from ipc_definitions.yaml

# Flat No Lead (DFN/QFN) with toe fillet
#           | Minimum | Median    | Maximum |
#           | (Least) | (Nominal) | (Most)  |
#           | Density | Density   | Density | round
# Lead Part | Level C | Level B   | Level A |  to
# ----------+---------+-----------+---------+-
# Toe       | 0.2     | 0.3       | 0.4     | 0.05
# Heel      | 0.0     | 0.0       | 0.0     | 0.05
# Side      | -0.04   | -0.04     | -0.04   | 0.05
# Courtyard | 0.1     | 0.25      | 0.5     |

ipc_spec_flat_no_lead:
    least:
        toe: 0.2
        heel: 0.0
        side: -0.04
        courtyard: 0.1
    nominal:
        toe: 0.3
        heel: 0.0
        side: -0.04
        courtyard: 0.25
    most:
        toe: 0.4
        heel: 0.0
        side: -0.04
        courtyard: 0.5
    round_base:
        toe: 0.05
        heel: 0.05
        side: 0.05

The values in your .yaml file look correct. And since we trust the generator we also assume the footprint is correct.

There is also this KLC rule: https://kicad-pcb.org/libraries/klc/F2.3/ It allows to use a manufacturer specific footprint.
In this case I think we are better of with the generic footprint. This is a standard housing. Nothing special about it. So a IPC compliant footprint should be good.
However, since I am not an expert on that topic perhaps some other @KiCad/librarians can also add to this discussion.


In any case, please head over to the footprints-generator repo and open a PR for your .yaml file changes.The idea is that we want to be able to re-create all footprints should the IPC recommendations change. Link that new PR to this one.

@Antichees
Copy link
Author

Antichees commented Sep 13, 2020

Thanks for the answer.
I originally made a footprint by editing a component from the library.
Package_DFN_QFN\ST_UFQFPN-20_3x3mm_0.5mm

I was recommended to transfer the component using the script Package_NoLead__DFN_QFN_LGA_SON.
But in the repository, I did not find .yml file for ST_UFQFPN-20.
Does it mean that this footprint was not created by a script?

@cpresser
Copy link
Contributor

Oh FFS. I did edit your comment instead of quoting it. My bad. I will try to undo that.

I was recommended to transfer the component using the script Package_NoLead__DFN_QFN_LGA_SON.
But in the repository, I did not find .yml file for ST_UFQFPN-20.
Does it mean that this footprint was not created by a script?

Yes. It is an older, legacy part, copied over from the old v4 library.
I did verify that by looking at the git history of that file.
Also the description of the footprint does not mention the generator.
image

@Antichees
Copy link
Author

Oh FFS. I did edit your comment instead of quoting it. My bad. I will try to undo that.

I was recommended to transfer the component using the script Package_NoLead__DFN_QFN_LGA_SON.
But in the repository, I did not find .yml file for ST_UFQFPN-20.
Does it mean that this footprint was not created by a script?

Yes. It is an older, legacy part, copied over from the old v4 library.
I did verify that by looking at the git history of that file.
Also the description of the footprint does not mention the generator.
image

And as i understand it, in this case, binding to the manufacturer is not needed?
do i need to update an old component?

@cpresser
Copy link
Contributor

And as i understand it, in this case, binding to the manufacturer is not needed?

I agree.

do i need to update an old component?

No. Not at all.
But if you like, you can open another PR to add a generated UFQFPN-20.
That might also have some complicated side effects, since the vendor-specific ufqfpn is used by some symbols.
image

So its best to not touch it as part of this pull request. Lets keep it simple and do one thing at a time.

@Antichees
Copy link
Author

added PR

Sign up for free to subscribe to this conversation on GitHub. Already have an account? Sign in.
Labels
Addition Adds new footprint to library
Projects
None yet
Development

Successfully merging this pull request may close these issues.

None yet

4 participants