Phillip Pearson's KiCad footprint library.
Released under the MIT license; see the LICENSE file for details.
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TQFP packages have varying pin spacing, and the distance pins extend past the chip body is manufacturer-dependent. Xilinx and Atmel chips extend 1mm, so a 10x10mm chip measures 12x12mm including leads, but other chips extend 1.6mm. It's possible to solder a chip with pads that extend 0.5mm past the end of the leads, and pretty easy to solder when the pads extend 1mm past. I recommend 0.5mm extension for 0.8mm pitch pins, and 1mm extension for 0.5mm pitch pins.
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BGA packages are a great way to solder a ton of pins in a really short time... I much prefer soldering a 256-ball BGA to a 100-pin TQFP, and often the equivalent pin count BGA will have a wider pitch. Be very very careful about the footprint though: you probably want to use NSMD pads, which are about 80% of the diameter of the ball, however BGA packages of the same pitch often use different ball sizes. For example, a Xilinx CS144 chip has 0.8mm ball pitch and 0.4mm ball diameter, so 0.32mm pads will work. However a TI ZRD chip has 0.8mm ball pitch and 0.5mm ball diameter, so you need 0.4mm pads. This is why I don't have any generic BGA packages in here, but only manufacturer/package specific ones.