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Add TSOP-I footprints #38

Merged
merged 5 commits into from
Aug 19, 2017
Merged

Add TSOP-I footprints #38

merged 5 commits into from
Aug 19, 2017

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evanshultz
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Merging footprints from SMD_Packages as mentioned at KiCad/SMD_Packages.pretty#20.

Datasheets:
http://www.fujitsu.com/downloads/MICRO/fma/pdfmcu/f32pm25.pdf
https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf

Note: There is already a TSOP-I-48 footprint here, but it uses extremely long pads that go under the part body. This is ill-advised since it can allow solder to flow under the part and push it up, preventing proper soldering. Also, the body dimensions on that part are YxX instead of the normal XxY. I'll delete that footprint as part of this PR if requested.

Image:
image

@evanshultz
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@jkriege2 And this one? Please read the note above.

@jkriege2
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Yes, please delete the old one ... also I made a PR to fix the one part that uses that old package (and renames the 3D model): KiCad/kicad-library#1549
please merge that, when I merge this!

Otherwise this looks fine and I would merge it!

JAN

@evanshultz
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@jkriege2 Thanks! Your PR looks good and is merged.

@jkriege2
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Hi could you please delete the old TSOP-I still in this PR? Then I'll merge.
JAN

@evanshultz
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@jkriege2 My mistake. Forgot about that part. Old footprint is now deleted.

@jkriege2
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Great!

Thanks,
JAN

@jkriege2 jkriege2 merged commit 70e183e into KiCad:master Aug 19, 2017
@evanshultz evanshultz deleted the tsop-i branch August 19, 2017 21:11
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2 participants