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Merge pull request #483 from awygle/micrel_msop
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Add MSOP-8 package w/ large thermal pad for Micrel MIC5355
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@evanshultz
evanshultz committed May 2, 2018
2 parents 54064c1 + 4a09de6 commit f935bce
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45 changes: 45 additions & 0 deletions Package_DFN_QFN.pretty/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.kicad_mod
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(module MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm (layer F.Cu) (tedit 5AE805A8)
(descr "8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "DFN MLF 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm (at 0 2.55) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.61 1.61) (end 1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.105)))
)
(fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 1.5) (end -1.5 -0.75) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.75) (end -0.75 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.85 -1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 -1.61) (end 1.61 -1.35) (layer F.SilkS) (width 0.12))
(fp_line (start -1.85 -1.75) (end 1.85 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 -1.75) (end -1.85 1.75) (layer F.CrtYd) (width 0.05))
(pad 1 smd rect (at -1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers F.Cu F.Mask))
(pad "" smd rect (at 0 0.9) (size 1.5 0.4) (layers F.Paste))
(pad "" smd rect (at 0 -0.9) (size 1.5 0.4) (layers F.Paste))
(pad "" smd rect (at 0 0) (size 1.5 0.65) (layers F.Paste))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
48 changes: 48 additions & 0 deletions Package_DFN_QFN.pretty/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias.kicad_mod
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(module MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias (layer F.Cu) (tedit 5AE80613)
(descr "8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "DFN MLF 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias (at 0 2.55) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.61 1.61) (end 1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.105)))
)
(fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 1.5) (end -1.5 -0.75) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.75) (end -0.75 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.85 -1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 -1.61) (end 1.61 -1.35) (layer F.SilkS) (width 0.12))
(fp_line (start -1.85 -1.75) (end 1.85 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 -1.75) (end -1.85 1.75) (layer F.CrtYd) (width 0.05))
(pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers B.Cu))
(pad 1 smd rect (at -1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers F.Cu F.Mask))
(pad "" smd rect (at 0 0.9) (size 1.5 0.4) (layers F.Paste))
(pad 9 thru_hole circle (at 0 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at 0 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad "" smd rect (at 0 -0.9) (size 1.5 0.4) (layers F.Paste))
(pad "" smd rect (at 0 0) (size 1.5 0.65) (layers F.Paste))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
47 changes: 47 additions & 0 deletions Package_SO.pretty/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm.kicad_mod
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(module MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm (layer F.Cu) (tedit 5AE803D9)
(descr "MME Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Microchip http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm (at 0 2.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 3.28 -1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.28 -1.75) (end -3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end -1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 -1.41) (end -3 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 -1.75) (end 3.28 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.61 -1.61) (end 1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 1.61) (end 1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.1)))
)
(pad 8 smd rect (at 2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 2.54 2.8) (layers F.Cu F.Mask))
(pad 7 smd rect (at 2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at 0 0) (size 2.4 0.65) (layers F.Paste))
(pad "" smd rect (at 0 1.025) (size 2.4 0.65) (layers F.Paste))
(pad "" smd rect (at 0 -1.025) (size 2.4 0.65) (layers F.Paste))
(model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
52 changes: 52 additions & 0 deletions Package_SO.pretty/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm_ThermalVias.kicad_mod
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Original file line number Diff line number Diff line change
@@ -0,0 +1,52 @@
(module MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm_ThermalVias (layer F.Cu) (tedit 5AE80424)
(descr "MME Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Microchip http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm_ThermalVias (at 0 2.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 3.28 -1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.28 -1.75) (end -3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end -1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 -1.41) (end -3 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 -1.75) (end 3.28 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.61 -1.61) (end 1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 1.61) (end 1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.1)))
)
(pad 8 smd rect (at 2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 2.54 2.8) (layers F.Cu F.Mask))
(pad 7 smd rect (at 2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at 0 0) (size 2.4 0.65) (layers F.Paste))
(pad "" smd rect (at 0 1.025) (size 2.4 0.65) (layers F.Paste))
(pad 9 thru_hole circle (at 0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at 0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad "" smd rect (at 0 -1.025) (size 2.4 0.65) (layers F.Paste))
(pad 9 thru_hole circle (at -0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at -0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 smd rect (at 0 0) (size 2.54 2.8) (layers B.Cu))
(model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)

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