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Add MSOP-8 package w/ large thermal pad for Micrel MIC5355 #483

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May 2, 2018
Merged

Add MSOP-8 package w/ large thermal pad for Micrel MIC5355 #483

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3e0a9b8
Add MSOP-8 package w/ large thermal pad for Micrel MIC5355
awygle Apr 12, 2018
51079a6
Set both footprints to "Surface Mount".
awygle Apr 12, 2018
9489102
Fixed invalid pad name on paste layer.
awygle Apr 12, 2018
5c77bab
Added 3D model path
awygle Apr 12, 2018
a67ac52
Modified MSOP footprint to match datasheet more closely.
awygle Apr 14, 2018
446120d
Renamed DFN to MLF. Improved paste coverage. Some cleanup.
awygle Apr 21, 2018
4a09de6
Correct silkscreen position. Increase paste coverage for MLF. Remove DFN
awygle May 1, 2018
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45 changes: 45 additions & 0 deletions Package_DFN_QFN.pretty/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.kicad_mod
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(module MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm (layer F.Cu) (tedit 5AE805A8)
(descr "8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "DFN MLF 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm (at 0 2.55) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.61 1.61) (end 1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.105)))
)
(fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 1.5) (end -1.5 -0.75) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.75) (end -0.75 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.85 -1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 -1.61) (end 1.61 -1.35) (layer F.SilkS) (width 0.12))
(fp_line (start -1.85 -1.75) (end 1.85 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 -1.75) (end -1.85 1.75) (layer F.CrtYd) (width 0.05))
(pad 1 smd rect (at -1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers F.Cu F.Mask))
(pad "" smd rect (at 0 0.9) (size 1.5 0.4) (layers F.Paste))
(pad "" smd rect (at 0 -0.9) (size 1.5 0.4) (layers F.Paste))
(pad "" smd rect (at 0 0) (size 1.5 0.65) (layers F.Paste))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
48 changes: 48 additions & 0 deletions Package_DFN_QFN.pretty/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias.kicad_mod
View file
Open in desktop
Original file line number Diff line number Diff line change
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(module MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias (layer F.Cu) (tedit 5AE80613)
(descr "8-Pin ePad 3mm x 3mm MLF - 3x3x0.85 mm Body (see Microchip datasheet http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "DFN MLF 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm_ThermalVias (at 0 2.55) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.61 1.61) (end 1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.105)))
)
(fp_line (start -0.75 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 1.5) (end -1.5 -0.75) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.75) (end -0.75 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.85 -1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 1.75) (end 1.85 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.35) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 -1.61) (end 1.61 -1.35) (layer F.SilkS) (width 0.12))
(fp_line (start -1.85 -1.75) (end 1.85 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.85 -1.75) (end -1.85 1.75) (layer F.CrtYd) (width 0.05))
(pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers B.Cu))
(pad 1 smd rect (at -1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 1.36 0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 1.36 0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 7 smd rect (at 1.36 -0.325) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 8 smd rect (at 1.36 -0.975) (size 0.48 0.28) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 1.55 2.3) (layers F.Cu F.Mask))
(pad "" smd rect (at 0 0.9) (size 1.5 0.4) (layers F.Paste))
(pad 9 thru_hole circle (at 0 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at 0 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad "" smd rect (at 0 -0.9) (size 1.5 0.4) (layers F.Paste))
(pad "" smd rect (at 0 0) (size 1.5 0.65) (layers F.Paste))
(model ${KISYS3DMOD}/Package_DFN_QFN.3dshapes/MLF-8-1EP_3x3mm_P0.65mm_EP1.55x2.3mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
47 changes: 47 additions & 0 deletions Package_SO.pretty/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm.kicad_mod
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Open in desktop
Original file line number Diff line number Diff line change
@@ -0,0 +1,47 @@
(module MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm (layer F.Cu) (tedit 5AE803D9)
(descr "MME Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Microchip http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm (at 0 2.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 3.28 -1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.28 -1.75) (end -3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end -1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 -1.41) (end -3 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 -1.75) (end 3.28 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.61 -1.61) (end 1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 1.61) (end 1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.1)))
)
(pad 8 smd rect (at 2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 2.54 2.8) (layers F.Cu F.Mask))
(pad 7 smd rect (at 2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at 0 0) (size 2.4 0.65) (layers F.Paste))
(pad "" smd rect (at 0 1.025) (size 2.4 0.65) (layers F.Paste))
(pad "" smd rect (at 0 -1.025) (size 2.4 0.65) (layers F.Paste))
(model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)
52 changes: 52 additions & 0 deletions Package_SO.pretty/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm_ThermalVias.kicad_mod
View file
Open in desktop
Original file line number Diff line number Diff line change
@@ -0,0 +1,52 @@
(module MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm_ThermalVias (layer F.Cu) (tedit 5AE80424)
(descr "MME Package; 8-Lead Plastic MSOP, Exposed Die Pad (see Microchip http://ww1.microchip.com/downloads/en/DeviceDoc/mic5355_6.pdf)")
(tags "SSOP 0.65")
(attr smd)
(fp_text reference REF** (at 0 -2.55) (layer F.SilkS)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_text value MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm_ThermalVias (at 0 2.75) (layer F.Fab)
(effects (font (size 1 1) (thickness 0.15)))
)
(fp_line (start 1.5 1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 1.61) (end 1.61 1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 1.61) (end -1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.5 -0.5) (end -0.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 3.28 -1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -3.28 -1.75) (end -3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -1.61 -1.61) (end 1.61 -1.61) (layer F.SilkS) (width 0.12))
(fp_line (start -1.61 -1.61) (end -1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -1.5 1.5) (end -1.5 -0.5) (layer F.Fab) (width 0.1))
(fp_line (start -1.61 -1.41) (end -3 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 -1.75) (end 3.28 -1.75) (layer F.CrtYd) (width 0.05))
(fp_line (start -0.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1))
(fp_line (start 1.61 -1.61) (end 1.61 -1.41) (layer F.SilkS) (width 0.12))
(fp_line (start 1.61 1.61) (end 1.61 1.41) (layer F.SilkS) (width 0.12))
(fp_line (start -3.28 1.75) (end 3.28 1.75) (layer F.CrtYd) (width 0.05))
(fp_text user %R (at 0 0) (layer F.Fab)
(effects (font (size 0.7 0.7) (thickness 0.1)))
)
(pad 8 smd rect (at 2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 9 smd rect (at 0 0) (size 2.54 2.8) (layers F.Cu F.Mask))
(pad 7 smd rect (at 2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 3 smd rect (at -2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 2 smd rect (at -2.4 -0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 6 smd rect (at 2.4 0.325) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 4 smd rect (at -2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 1 smd rect (at -2.4 -0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad 5 smd rect (at 2.4 0.975) (size 1.26 0.4) (layers F.Cu F.Paste F.Mask))
(pad "" smd rect (at 0 0) (size 2.4 0.65) (layers F.Paste))
(pad "" smd rect (at 0 1.025) (size 2.4 0.65) (layers F.Paste))
(pad 9 thru_hole circle (at 0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at 0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad "" smd rect (at 0 -1.025) (size 2.4 0.65) (layers F.Paste))
(pad 9 thru_hole circle (at -0.5 0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 thru_hole circle (at -0.5 -0.5) (size 0.6 0.6) (drill 0.3) (layers *.Cu *.Mask))
(pad 9 smd rect (at 0 0) (size 2.54 2.8) (layers B.Cu))
(model ${KISYS3DMOD}/Package_SO.3dshapes/MSOP-8-1EP_3x3mm_P0.65mm_EP2.54x2.8mm.wrl
(at (xyz 0 0 0))
(scale (xyz 1 1 1))
(rotate (xyz 0 0 0))
)
)