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Is this not supposed to have thermal vias, according to page 6 (and therefore get the file name ending '_ThermalVias') ? |
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I found a few concerns with this footprint (shown below). Also, I agree with @Misca1234 - it may be valuable to add a footprint with thermal vias.
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(module VSON-10-1EP_3x3mm_P0.5mm_EP2.1x1mm (layer F.Cu) (tedit 5B9F93A0) |
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The name should be VSON-10-1EP_3x3mm_P0.5mm_EP1x2.1mm - EP dimensions should be listed in X
,Y
order. Also, consider adding the component height of 1mm.
(fp_line (start 1.6764 1.6764) (end 1.6764 -1.6764) (layer F.SilkS) (width 0.12)) | ||
(fp_line (start 1.6764 -1.6764) (end -1.6764 -1.6764) (layer F.SilkS) (width 0.12)) | ||
(fp_line (start -0.8636 -1.8796) (end -1.8288 -1.8796) (layer F.SilkS) (width 0.12)) | ||
(fp_line (start -1.8796 -1.8796) (end -1.8796 -0.9652) (layer F.SilkS) (width 0.12)) |
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Silkscreen lines are overlapping copper pads, which is not permitted.
(fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer F.Fab) (width 0.1)) | ||
(fp_line (start -1.5 1.5) (end 1.5 1.5) (layer F.Fab) (width 0.1)) | ||
(fp_line (start 1.5 1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.1)) | ||
(fp_line (start 1.5 -1.5) (end -1.5 -1.5) (layer F.Fab) (width 0.1)) |
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It is recommended (in the KLC) to have a bevel of either 1mm or 25% of the shortest side of the part (whichever is less) on the fab layer to indicate pin 1, which is currently missing.
(fp_line (start -1.78 -1.78) (end -1.78 1.78) (layer F.CrtYd) (width 0.05)) | ||
(fp_line (start -1.78 1.78) (end 1.78 1.78) (layer F.CrtYd) (width 0.05)) | ||
(fp_line (start 1.78 1.78) (end 1.78 -1.78) (layer F.CrtYd) (width 0.05)) | ||
(fp_line (start 1.78 -1.78) (end -1.78 -1.78) (layer F.CrtYd) (width 0.05)) |
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The courtyard should provide mechanical and electrical clearance. Currently, the courtyard is not accounting for the copper pads on the sides of the part. The apparent clearance of 0.25mm from the body of the component should be used for the copper pads as well.
(pad 9 smd rect (at 1.4 -0.5) (size 0.8 0.27) (layers F.Cu F.Paste F.Mask)) | ||
(pad 10 smd rect (at 1.4 -1) (size 0.8 0.27) (layers F.Cu F.Paste F.Mask)) | ||
(pad 11 smd rect (at 0 0) (size 1 2.1) (layers F.Cu F.Paste F.Mask)) | ||
(model ${KISYS3DMOD}/Package_SON.3dshapes/VSON-10_3.0x3.0mm_Pitch0.5mm_EP2x1.2.wrl |
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The EP dimensions are incorrect, and in the wrong order. They should be: VSON-10-1EP_3x3mm_P0.5mm_EP1x2.1mm. This will require a change to the 3D model name in your other PR. Also, as above, consider adding the component height of 1mm.
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(module VSON-10-1EP_3x3mm_P0.5mm_EP2.1x1mm (layer F.Cu) (tedit 5B9F93A0) | |||
(descr http://rohmfs.rohm.com/en/techdata_basic/ic/package/vson010v3030_1-e.pdf) |
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I would recommend replacing the packaging datasheet (currently listed) with the full datasheet (found here). The packaging datasheet doesn't have any information about the actual package size, only the land pattern.
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Thank you for a lot of comments. I assign BT8314 datasheet to symbol but assign package datasheet to this footprint because I think that VSON package does not need to know BD8314 detail. |
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I agree that the BT8314 datasheet has more information than strictly required, but my understanding is that the datasheet linked in the footprint should contain enough information to create that footprint, which includes dimensions for the fabrication layer. The package datasheet doesn't contain any dimensional information for the package itself (width, length, height). It only contains information for the land pattern (footprint). The BT8314 datasheet contains the required information about package dimensions: I think that the BT8314 datasheet should be included in the symbol and footprint. It may be valuable to link to both datasheets. Other maintainers may have feedback on this. |
This part could easily be script generated by adding the size definition to this script: https://github.com/pointhi/kicad-footprint-generator/tree/master/scripts/Packages/Package_DFN_QFN |
@asukiaaa |
First, as I've noted elsewhere, the footprint name is wrong. The EP size is 1.2x2mm. Next, we will use a generic package drawing to reference in the datasheet if possible, and if not then a datasheet with the package drawing. In this case, I think we can use the datasheet. A quick Google search for "VSON010V3030" turns up https://d1d2qsbl8m0m72.cloudfront.net/en/techdata_basic/ic/package/vson010v3030_1-e.pdf, but that doesn't have the package drawing. (I believe this is what Dan mentioned above and called the "package datasheet".) And we would use an official URL from ROHM anyway. Because symbols are specific to a particular part, the datasheet should always be there. That all being said, rather than use the footprint supplied from a vendor we can generate a footprint according to IPC rules as Rene wrote above if we just have an adequately-dimensioned package drawing. In this case, I've made the footprints and attached them (with .txt extension added) using the YAML entry given below at kicad-footprint-generator\scripts\Packages\Package_DFN_QFN\size_definitions\dfn.yaml. While I took a look and they appear correct you should verify them as well. While making footprints manually is still OK, the IPC-compliant generator is best and the future direction of the KiCad footprint library.
Sorry @Misca1234 , I started this post a few hours ago and was just able to wrap it up now. VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm.kicad_mod.txt VSON-10-1EP_3x3mm_P0.5mm_EP1.2x2mm_ThermalVias.kicad_mod.txt |
@evanshultz @asukiaaa |
I pushed a script update to add this footprint at pointhi/kicad-footprint-generator#182. That shouldn't preclude you from playing with the scripts yourself and trying it out if you like. :) |
Thanks for the comments. I understand them.
It take me a long time to run script but I succeeded for FQN.
By the way, this PR is not needed now because other PR including this was created? |
I only created a PR for the script for this footprint. The footprint itself hasn't been added so you can replace the footprint you committed with the one I attached above it if you wish. Or if you prefer to close this PR I can submit the scripted footprint in a new one. Either way is OK with me. I'm just happy you were able to figure out how to run the script and generate footprints. I think you will find this is the most powerful way to generate new footprints of this type as you need them. If you have questions please ask! |
@asukiaaa
|
Thanks for the comment but I close this PR because other PR was created and merged. |
@asukiaaa I'm happy that you were able to get the scripting sorted out and I should have been more careful when I pushed the footprints to exclude this one. I was going too fast and pushed all the QFNs I'd generated into one branch. I'm thankful that you took initiative to add symbols and footprints to KiCad. Having people like yourself add parts they need into our library is important to making a useful library. I hope to see more contributions from you in the future that will grow and improve KiCad's official library for all users. :) |
Thank you, I'm glad to know that. |
Datasheet: http://rohmfs.rohm.com/en/techdata_basic/ic/package/vson010v3030_1-e.pdf
Related PRs:
KiCad/kicad-symbols#934
KiCad/kicad-packages3D#401