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Bump VERSION to v0.13.0_dev #371

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Description

Bump VERSION to v0.13.0_dev

Type of change

  • Bug fix (non-breaking change that fixes an issue)
  • New feature (non-breaking change that adds new functionality)
  • Breaking change (bug fix or new feature that breaks existing functionality)
  • Third-party dependency update
  • Documentation additions or improvements
  • Code quality improvements to existing code or test additions/updates

Applicable issues

N/A

CORTX image version requirements

N/A

How was this tested?

N/A

Checklist

  • The change is tested and works locally.
  • New or changed settings in the solution YAML are documented clearly in the README.md file.
  • All commits are signed off and are in agreement with the CORTX Community DCO and CLA policy.

If this change requires newer CORTX or third party image versions:

  • The image fields in solution.example.yaml have been updated to use the required versions.
  • The appVersion field of the Helm chart has been updated to use the new CORTX version.

If this change addresses a CORTX Jira issue:

  • The title of the PR starts with the issue ID (e.g. CORTX-XXXXX:)

Signed-off-by: Walter Lopatka <walter.lopatka@seagate.com>
@cla-bot cla-bot bot added the cla-signed label Sep 1, 2022
@walterlopatka walterlopatka marked this pull request as ready for review September 1, 2022 18:00
@walterlopatka walterlopatka requested a review from a team as a code owner September 1, 2022 18:00
@walterlopatka walterlopatka merged commit ec265c1 into Seagate:integration Sep 1, 2022
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2 participants