Electronics design and Bill of Materials

Triggertrap · May 24, 2017 · 6d16883 · 6d16883
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diff --git a/Mobile_Dongle_3.2 Data Pack/Bill of Materials/Bill of Materials-TRI003 Dongle V1.0.xls b/Mobile_Dongle_3.2 Data Pack/Bill of Materials/Bill of Materials-TRI003 Dongle V1.0.xls
diff --git a/Mobile_Dongle_3.2 Data Pack/DXF/code.dxf b/Mobile_Dongle_3.2 Data Pack/DXF/code.dxf
diff --git a/Mobile_Dongle_3.2 Data Pack/DXF/date.dxf b/Mobile_Dongle_3.2 Data Pack/DXF/date.dxf
diff --git a/Mobile_Dongle_3.2 Data Pack/DXF/new overlay.pdf b/Mobile_Dongle_3.2 Data Pack/DXF/new overlay.pdf
diff --git a/Mobile_Dongle_3.2 Data Pack/DXF/tt logo.dxf b/Mobile_Dongle_3.2 Data Pack/DXF/tt logo.dxf
diff --git a/Mobile_Dongle_3.2 Data Pack/DXF/tt name.dxf b/Mobile_Dongle_3.2 Data Pack/DXF/tt name.dxf
diff --git a/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0-RoundHoles.TXT b/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0-RoundHoles.TXT
@@ -0,0 +1,34 @@
+M48
+;Layer_Color=9474304
+;FILE_FORMAT=2:5
+INCH,LZ
+;TYPE=PLATED
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+;TYPE=NON_PLATED
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+%
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+M30
diff --git a/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0-SlotHoles.TXT b/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0-SlotHoles.TXT
@@ -0,0 +1,29 @@
+M48
+;Layer_Color=9474304
+;FILE_FORMAT=2:5
+INCH,LZ
+;TYPE=PLATED
+T2F00S00C0.01575
+;TYPE=NON_PLATED
+%
+G90
+G05
+T02
+G00X0065354Y0011811
+M15
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diff --git a/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0.DRR b/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0.DRR
@@ -0,0 +1,19 @@
+---------------------------------------------------------------------------
+NCDrill File Report For: TRI003 Dongle V1.0.PcbDoc   1/30/2014  1:30:55 PM
+---------------------------------------------------------------------------
+
+Layer Pair : Top Layer to Bottom Layer
+ASCII RoundHoles File : TRI003 Dongle V1.0-RoundHoles.TXT
+ASCII SlotHoles File : TRI003 Dongle V1.0-SlotHoles.TXT
+
+Tool         Hole Size           Hole Type     Hole Count Plated       Tool Travel
+---------------------------------------------------------------------------
+T1        15.75mil (0.40005mm)     Round          12               2.73 Inch (69.22 mm)
+T2        15.75mil (0.40005mm)     Slot           4                283.80 Inch (7208.52 mm)
+T3        40mil (1.016mm)          Round          3                0.20 Inch (5.08 mm)
+T4        62.99mil (1.59995mm)     Round          2                0.67 Inch (17.00 mm)
+T5        59.06mil (1.50012mm)     Round          1         NPTH   0.00 Inch (0.00 mm)
+---------------------------------------------------------------------------
+Totals                                            22               287.39 Inch (7299.82 mm)
+
+Total Processing Time (hh:mm:ss) : 00:00:00
diff --git a/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0.LDP b/Mobile_Dongle_3.2 Data Pack/NC Drill Files/TRI003 Dongle V1.0.LDP
@@ -0,0 +1,3 @@
+Layer Pairs Export File for PCB: G:\Active\Projects\TRI003\Working Phase 1\TRI003 Dongle V1.0\TRI003 Dongle V1.0.PcbDoc
+LayersSetName=Top_Bot_Thru_Holes|DrillFile=tri003 dongle v1.0-roundholes.txt|LayerPairs=gtl,gbl
+LayersSetName=Top_Bot_Slot_Holes|DrillFile=tri003 dongle v1.0-slotholes.txt|LayerPairs=gtl,gbl
diff --git a/Mobile_Dongle_3.2 Data Pack/PDF/TRI003 Dongle V1.0 Production .PDF b/Mobile_Dongle_3.2 Data Pack/PDF/TRI003 Dongle V1.0 Production .PDF
diff --git a/Mobile_Dongle_3.2 Data Pack/TRI003_Iss1 Ident layer.png b/Mobile_Dongle_3.2 Data Pack/TRI003_Iss1 Ident layer.png