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mtd: spi-nor: Fixed die crossover issue
Read operation in multi die flash devices is bounded by its die segment. In a continuous read, that spans across multiple die, when the last byte of the selected die segment is read, the next byte read is the first byte of the same die segment. This is Die crossover issue. This patch fixes this issue by splitting a read transaction, that spans across multiple banks, into one read per bank. Bank size for single and dual stacked connection is 16MB and for dual parallel connection its 32MB. Signed-off-by: Amit Kumar Mahapatra <amit.kumar-mahapatra@xilinx.com> Reviewed-by: Naga Sureshkumar Relli <naga.sureshkumar.relli@xilinx.com> Signed-off-by: Radhey Shyam Pandey <radhey.shyam.pandey@xilinx.com>
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