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HotSpot v7.0 is an accurate and fast thermal model suitable for use in architectural studies.

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HotSpot is a pre-RTL thermal simulator intended for use early in the design process. HotSpot supports simulation of traditional 2D Integrated Circuits (2D ICs) and 3D ICs as well as microfluidic cooling. If this is your first time seeing HotSpot, check out our Getting Started page. To see HotSpot in action, check out our simulation examples in the examples directory! Please send questions, comments, concerns, bugs, etc. to hotspot@virginia.edu.

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HotSpot v7.0 is an accurate and fast thermal model suitable for use in architectural studies.

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