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Phase2-hgx290 Provide better description of HGCal geometry description #35511

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Oct 3, 2021
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Phase2-hgx290 Provide better description of HGCal geometry description #35511

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17 changes: 8 additions & 9 deletions Configuration/Geometry/README.md
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Expand Up @@ -68,15 +68,14 @@ Tracker:
* T27: Phase2 tilted tracker. Outer Tracker (v8.0.0): same as T24/T21. Inner Tracker (v8.0.0): Based on (v7.0.2) (T25), but with bricked pixels in the central rod of TBPX L2 and in the central 3 rods of TBPX L3+4. All pixels in TFPX and TEPX are bricked. Compatible with DD4hep library.

Calorimeters:
* C9: HGCal (v11 post TDR HGCal Geometry w/ corner centering for HE part) + Phase2 HCAL and EB + Tracker cables
* C10: HGCal (as in C9) + HFNose with corrected wafer size + Phase2 HCAL and EB
* C11: HGCal (v12 post TDR HGCal Geometry same as C9 + modified support structure + full list of masked wafers)
* C12: HGCal (as in C11) + HFNose with corrected wafer size + Phase2 HCAL and EB
* C13: HGCal (reading the constants of the flat file and made provision to be used downstream) + Phase2 HCAL and EB
* C14: HGCal (reading the constants of the flat file and use it to create geometry) + Phase2 HCAL and EB
* C15: HGCal (as in C14) + HFNose with corrected wafer size + Phase2 HCAL and EB
* C16: HGCal (create HGCal geometry with real full and partial silicon modules using the constants of the flat file) + Phase2 HCAL and EB
* C17: HGCal (create HGCal geometry with new longitudinal structure having 47 layers and new definition of partial wafers using the constants of the flat file) + Phase2 HCAL and EB
* C9: HGCal (v11 post TDR HGCal Geometry w/ corner centering for HE part) + Phase2 HCAL and EB + Tracker cables (used in 2026D49)
* C10: HGCal (as in C9) + HFNose with corrected wafer size + Phase2 HCAL and EB (used in 2026D60)
* C11: HGCal (v12 post TDR HGCal Geometry same as C9 + modified support structure + full list of masked wafers) + Phase2 HCAL and EB + Tracker cables (used in 2026D68)
* C13: HGCal (v13 version which reads the input from the flat file, uses these for checks and makes provision to be used downstream) + Phase2 HCAL and EB (used in 2026D70, 2026D84)
* C14: HGCal (v14 version reading the input from the flat file and uses it to create geometry, still using masking to define partial wafers) + Phase2 HCAL and EB (used in 2026D76-81, 2026D85, 2026D87)
* C15: HGCal (as in C14) + HFNose with corrected wafer size + Phase2 HCAL and EB (used in 2026D82)
* C16: HGCal (v15 version of HGCal geometry created using real full and partial silicon modules using the constants of the flat file) + Phase2 HCAL and EB (used in 2026D83)
* C17: HGCal (v16 version of HGCal geometry created with new longitudinal structure having 47 layers and new definition of partial wafers using the constants of the flat file) + Phase2 HCAL and EB (used in 2026D86)

Muon system:
* M4: Phase2 muon system for TDR w/ GE2/1, ME0, RE3/1, RE4/1 (incl. granularity in ME0, staggered GE2/1), 96 iRPC strips, no overlaps, MB4Shields
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