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Seed for TAM protocol #31
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I looked into the text and I wonder whether we really need to talk about the seed in the architecture document. To me it sounds like providing a bit too much details about the OTrP protocol in the architecture draft. Hence, I am proposing to remove the seed concept from the architecture document to resolve this comment. |
Section 7.1 should briefly talk about what attestation in the context of TEEP is and what we are trying to accomplish. |
Related to issue #17 |
This will be addressed in attestation discussion update in the draft. Seeding of attestation keys will be discussed where seeding at manufacture becomes one of the ways, not the only way. The overall trust of attestation claims will have a list of assumptions for an attestation key to be trusted. |
Align picture with diagrams used in the TEEP WG at IETF 105 THis addresses issues #17, #31, and the part of #70 that talks about digital signature formats. Per discussion at IETF 106, the direction is that the architecture document should explain the relationship between TEEP and attestation, and leave protocol details to the TEEP protocol spec. It should NOT discuss attestation details, including anything about signing with any attestation key, seeding of attestation keys, or using specific crypto algorithms for attestation. Signed-off-by: Dave Thaler <dthaler@microsoft.com>
Section 7.1 Attestation Hierarchy mentions that "seed required for TAM protocol operation must be built into the device at manufacture".
This is technically correct, but considering that the architecture assumes the presence of multiple TEEs on the device, it could be rephrased as "seed required for TAM protocol operation must be built into the TEE at manufacture".
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