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微信公众号:千艺千寻

在这里插入图片描述

My csdn blog:https://blog.csdn.net/wwt18811707971

My_Embedded_Code

(1)MCU:STM32F103RC

(2)包含底层通信和对应的应用测试代码

修改记录:

(1)2020.03.11 上传工程代码

(2)2020.03.14 软硬件 SPI 通信均测试验证成功

(3)2020.03.22 软件 I2C 通信完成验证,并实现温湿度传感器通过 I2C 采集数据;

文件记录:

App:

(1)app_flash.c:spi flash test code(erase;read;write)

(2)app_adc:adc get voltage test(stm32 the input voltage is 0——3.3V,notice input maybe lead to adc module break)

(3)app_htu21d.c:Sensor temperature and humidity gets data by i2c,see the data form usart by "printf"

(4)logic_grammer.c:c library function(memcpy,memset,memcmp,strcpy,strlen,strcmp,sprintf)

(5)app_at24cxx.c:eeprom operate by i2c

(6)c_language_regular.c:some c language regular test

(7)variable.c:gloal variable

Driver:

(1)drvexflash.c:Spi flash operate (W25X,W25Q ,and so on)

(2)drvsfi2c.c:Soft simulate i2c logic communication

(3)drvsfspi.c:Soft simulate spi logic communication(mode0 and mode3)

(4)hardware_spi.c:Hard spi driver

(4)drvadc.c :ADC dirver (single channel)

(5)drvuart.c:Uart driver

(6) hcsr04.c:超声波驱动文件

(7) drvrtc.c:RTC 驱动文件

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