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POLARA-DEVKIT_project_launch.md

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OpenHW CORE-V POLARA Dev-Kit Project Launch

Title of Project - "CORE-V Polara DevKit"

Project Concept Proposal

Date of proposal - 2023-12-14

Author(s)

  • François Leduc-Primeau, Polytechnique Montreal
  • Mike Aronson, Rumble Dev
  • Duncan Bees, OpenHW

Engineering resource supplied by members - requirement and availability

PolyMtl is providing 1 Master’s student supervised by Prof. Leduc-Primeau and funded by Empaiot. In addition, Empaiot and RumbleDev are providing engineering support as specified in the table below.

Item Resource Rough Timespan
Polara daughter board schematics RumbleDev, PolyMtl Jan. 8, 2024 – Mar. 4, 2024
Development of Chipset on Genesys2 PolyMtl Jan. 8 2024 – May 3, 2024
Polara daughter board layout Empaiot Mar. 4, 2024 – Apr. 1, 2024
Polara daughter board manufacture Empaiot Apr 1, 2024 – Apr. 22, 2024
Bring up of Polara chip/board PolyMtl May 8, 2024 – June 5, 2024
User manual for DevKit and Interface PolyMtl May 8, 2024 – June 12, 2024
Use Case development and testing of Polara DevKit PolyMtl June 5, 2024 – July 31, 2024
Document results of testing PolyMtl July 31, 2024 – Aug. 7, 2024

Project Technical Artifacts/Output List

Document License Leader Rough Timeframe
DevKit schematic Solderpad 2.1 F. Leduc-Primeau Feb. 2024
DevKit layout Solderpad 2.1 Mike Aronson Apr. 2024
DevKits manufactured n/a Alfred Shiu End of April 2024
Bring up software Apache 2.0 F. Leduc-Primeau Start of May 2024
Use case test software (baremetal for VEC testing) Apache 2.0 F. Leduc-Primeau Aug. 2024
SMP linux on CVA6 but not for VEC GPL F. Leduc-Primeau Aug. 2024

External Dependencies

Dependency Explanation
Polara tapeout Silicon expected back May 7, 2024
Polara packaging Packaged chips expected May 7, 2024 (CMC delivery date includes packaging)
Polara FPGA testing Currently the Polara chip is emulated in FPGA and is (almost) running SMP Linux. Software running on FPGA will be able to be ported to the DevKit.
Check power supply capabilities of Genesys2 board If Genesys board can provide enough power, may not need to bring power supply directly to the development board.

TGs Involved

The project should be reviewed in either the OpenHW HW TG or the Interconnect TG.

Resource Requirements/Plan

In addition to engineering resources above, management and support resources are as follows.

  • Project Manager for hardware development: Mike Aronson
  • Project Manager for software integration: Francois Leduc-Primeau
  • OpenPiton support: Jonathan Balkind

Architecture/Context Diagram

Polara board block diagram

Project License

  • Hardware - Solderpad 2.1
  • Software - Apache 2.0

Initial Code Contribution Description

Not applicable

Repository

Repo License Explanation
core-v-polara-devboard Solderpad Board schematics and layout, User manual, FPGA RTL code for the chipset, FPGA image for the Genesys2 “chipset”, Low level software (demo level)
linux Existing OpenHW linux repository will be used to host the linux distribution for Polara.

Project Distribution Model

The software and RTL code generated by this project will be distributed on Github.

Although this project does not endeavour to distribute boards to “general public” like the CORE-V MCU DevKit, limited availability of boards to OpenHW Group members who would commit to provide technical feedback is likely available on a cost recovery basis. A rough estimate of the costs per board is as follows: Polara packaging cost: 150 USD (source: rough estimate of 1500 USD for 10 parts from Hugh Pollitt-Smith) Board fabrication: approx. 10 USD (to be confirmed with Empaiot) Board BOM (excluding Polara): FMC connector is about 20-30 USD, and we can budget another 10 USD for the rest of the parts. Polara socket (17x17, 208 pins, low insertion force) ~20USD. Adding a socket for the Polara package simplifies the logistic since in that case PCB parts can be mounted before Polara is received, and boards can be distributed separately from the Polara chip itself without requiring users to do soldering.

A cutoff date for expression of interest will be communicated to the TWG as soon as established.

Preliminary Project Risk Register

Risk Impact Mitigation
Polara doesn’t work Severe Identify the issue and consider a second fabrication run.
Devboard errors cause need for respin Moderate Fix PCB design error and fabricate boards again.
Genesys2 availability insufficient Moderate Port the Chipset project to a different board.