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add Texas SO-20 PowerPAD #340
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- increased tolerances (assuming they are given in inches, not in mm) - slightly increase paste coverage to 0.7
Fix F.Paste extra pad Fix F.SilkS near pad
Fixes imperial handling for no lead generator (moved unit specifier to top level of every size definition instead of having it inside every dimension. This allows the pin pitch to use non metric units as well. Add support for giving dimensions as strings of the styles nom+/-tol, nom+tolp-toln, min...nom...max and min...max.
Fixed 'B' in DF12E*DP Changed variable name to not make confusion
Also known as TI's S-PVQFN-N20.
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Code Climate has analyzed commit 6267c45 and detected 0 issues on this pull request. View more on Code Climate. |
5 tasks
replacement of all yaml.load with yaml.safe_load. CVE-2017-18342
Add 3.5x3.5mm QFN-20 with 2mm pad.
* Add MSOP-8_3x3mm_P0.65mm * Fix tolerances * Fix format
….75 mm pitch, 0.32 mm ball diameter (pointhi#381) * Re-add parameters from the PR I screwed up @ pointhi#364 * Add overall height from @EvanSchultz suggestion pointhi#364 (comment) * Remove trailing decimal from footprint title to match other TFBGA footprints * Fix mask margin per @EvanSchultz suggestion @ pointhi#364 (comment) . See screenshots in PR. * Remove ball diameter from title * Fix link to incorrect datasheet * Rename TFBGA-196 footprint because of Microchip peculiarities, per KiCad/kicad-footprints#1604 (comment) * Remove pad size from footprint name per KiCad/kicad-footprints#1604 (comment)
…tor into PowerPAD
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@poeschlr are there still changes requested from you? |
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This now follows FIG16 from the OPA569 datasheet. |
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Could you explain why your pull request touches this many things? And has this many commits? |
aewallin
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Dec 27, 2019
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closing. see #474 instead. |
poeschlr
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Jan 5, 2020
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Used by e.g. OPA569:
http://www.ti.com/lit/ds/symlink/opa569.pdf
Further details on footprint at:
http://www.ti.com/lit/an/slma004b/slma004b.pdf