RISC-V 3D Chip Design with TSV and Thermal Modeling

[b224hisl]

Dear judges,

Here is our submission for the competition. We present our demo of a 3D IC design, which incorporates some innovations in EDA tools. To ensure seamless reproducibility and accessibility, we have packaged the runtime environment as a public Docker image.

Simply follow the instructions outlined in the accompanying notebook, and you'll be able to replicate our work effortlessly. For your convenience, a quick start guide at the end summarizes all the necessary codes. However, please note that Colab does not support Docker, so you may need to use Jupyter Notebook to open them.

As this is our first participation in the competition, we welcome any feedback and suggestions from you. Your insights will be invaluable in guiding us towards further improvements. Thank you~