GR533x Series SoC

1. Introduction

• The Goodix GR533x series is a Bluetooth Low Energy (Bluetooth LE) 5.3 System-on-Chip (SoC) designed for various applications such as smart home, health care, smart trackers, and IoT modules, supporting Bluetooth Mesh networking protocols.

• Based on Arm® Cortex®-M4F CPU core running at 64 MHz, the GR533x integrates a 2.4 GHz RF transceiver, Bluetooth LE 5.3 protocol stack, 512 KB on-chip Flash memory, 96 KB system SRAM, and a rich set of peripherals. It provides excellent RF performance, with a maximum of +15 dBm TX power, -99 dBm RX sensitivity, and a maximum of 114 dB link budget in Bluetooth LE 1 Mbps mode.

• With two main power supply schemes (DC-DC and SYS_LDO), the GR533x offers flexible options to achieve a balance between low power consumption and economical BOM.

2. Key Features

• Bluetooth Low Energy 5.3 transceiver integrating Controller and Host layers

  • Supported data rates: 1 Mbps, 2 Mbps, Long Range (500 kbps, 125 kbps)
  • TX power:
    • GR5331: up to 6 dBm
    • GR5332: up to 15 dBm
  • RX sensitivity:
    • GR5331: -97.5 dBm @ 1 Mbps
    • GR5332: -99 dBm @ 1 Mbps
  • Power consumption at 3.3 V VBAT input on GR5331:
    • TX current: 3.8 mA @ 0 dBm output power (DC-DC supply, 16 MHz system clock)
    • RX current: 4.7 mA @ 1 Mbps (DC-DC supply, 16 MHz system clock)
  • Power consumption at 3.3 V VBAT input on GR5332:
    • TX current: 5.9 mA @ 0 dBm output power (DC-DC supply, 16 MHz system clock)
    • TX current: 86.3 mA @ 15 dBm output power (SYS_LDO supply, 64 MHz system clock)
    • RX current: 4.9 mA @ 1 Mbps (DC-DC supply, 16 MHz system clock)

• Arm® Cortex®-M4F 32-bit micro-processor with floating point support

  • Up to 64 MHz clock frequency
  • Built-in Memory Protection Unit (MPU) supporting eight programmable regions
  • Hardware Floating Point Unit (FPU)
  • Built-in Nested Vectored Interrupt Controller (NVIC)
  • Non-maskable Interrupt (NMI) input
  • Serial Wire Debug (SWD) with 16 breakpoints, two watchpoints, and a debug timestamp counter
  • 32 µA/MHz CoreMark running from Flash @ 3.3 V, 64 MHz

• On-chip memory

  • 96 KB RAM data memory with retention capabilities
  • 8 KB cache RAM instruction memory with retention capabilities
  • ROM for boot and partial Bluetooth LE Protocol Stack code
  • 512 KB internal Flash

• Digital peripheral

  • One general-purpose DMA engine with five channels and up to 16 programmable request/trigger sources

• Analog peripherals

  • One 13-bit Sense ADC with a sampling rate of 1 Msps. It supports up to eight external I/O channels and three internal signal channels
  • Built-in die temperature and voltage sensors
  • Low-power comparator, supporting wakeup from sleep mode

• Flexible serial peripherals

  • Two UART modules up to 2 Mbps with flow control and IrDA features
  • Two I2C modules for peripheral communication, up to 1 MHz
  • One 8-bit/16-bit/32-bit SPI master interface and one SPI slave interface for host communication

• Security

  • Complete secure computing engine
    • AES 128-bit security module (ECB, CBC)
    • True random number generator (TRNG)

• I/O peripherals

  • Up to 32 multiplexed I/O pins in total
    • Up to 14 general-purpose I/O (GPIO) pins with configurable pull-up/pull-down resistors
    • Up to eight always-on I/O (AON I/O) pins, supporting wakeup from sleep mode
    • Up to 10 mixed signal I/O (MSIO) pins, configurable to be digital/analog signal interfaces

• Timers

  • Two general-purpose, 32-bit timer modules
  • One dual timer module composed of two programmable 32-bit or 16-bit down counters
  • One sleep timer for waking the device up from sleep mode
  • Two 3-channel PWM modules with edge alignment mode and center alignment mode
  • One real-time counter (RTC)

• Power management

  • On-chip DC-DC/SYS_LDO to provide RF analog voltage and supply CORE_LDO
  • On-chip I/O LDO to provide I/O voltage and supply external components
  • Programmable thresholds for brownout detector (BOD)
  • Supply voltage: 2.0 V – 3.63 V
  • I/O voltage: 1.8 V – 3.6 V

• Low-power consumption

  • Sleep mode: 2.6 µA (Typical) at 3.3 V VBAT input, with 48 KB SRAM retention on, wakeup sources from AON I/Os, and LFXO_32K running
  • Ultra deep sleep mode: 1.9 µA (Typical), with no memory data in retention and wakeup sources from SLP Timer or AON I/Os
  • OFF mode: 200 nA (Typical), with system in reset mode

• Packages

  • QFN32: 4.0 mm * 4.0 mm * 0.75 mm, 0.4 mm pitch
  • QFN48: 6.0 mm * 6.0 mm * 0.75 mm, 0.4 mm pitch

• Operating temperature range

  • GR5331: –40°C ～ 85°C
  • GR5332: –40°C ～ 105°C

3. Product Details

		GR5515IGND	GR5515I0NDA	GR5515IENDU	GR5515GGBD	GR5515RGBD	GR5513BENDU
Status		Active	Active	Active	Active	Active	Active
Protocol	Bluetooth LE [1]	5.1	5.1	5.1	5.1	5.1	5.1
	Bluetooth Mesh	●	●	●	●	●	●
Core System	CPU	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F
	Clocks	64 MHz / 32K Hz	64 MHz / 32 KHz	64 MHz / 32 KHz	64 MHz / 32 KHz	64 MHz / 32 KHz	64 MHz / 32 KHz
	Cache	8 KB	8 KB	8 KB	8 KB	8 KB	8 KB
	RAM	256 KB	256 KB	256 KB	256 KB	256 KB	128 KB
	OTP
	Flash	1 MB	External Flash	512 KB	1 MB	1 MB	512 KB
Security	Root of Trust	●	●	●	●	●	●
	Secure Key Store	4	4	4	4	4	4
	PKC	●	●	●	●	●	●
	RSA	●	●	●	●	●	●
	AES	●	●	●	●	●	●
	ECC	●	●	●	●	●	●
	TRNG	●	●	●	●	●	●
Radio	Frequency	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz
	Maximum Tx Power	7 dBm	7 dBm	7 dBm	7 dBm	7 dBm	7 dBm
	Rx Sensitivity	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)
Peripheral	UART	2	2	2	2	2	2
	SPI	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS
	I2C	2	2	2	2	2	2
	QSPI	2	2	2	0	2	1
	Timers	4	4	4	4	4	4
	PWM	2	2	2	2	2	2
	RTC	1	1	1	1	1	1
	I2S	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS
	ADC	13-bit	13-bit	13-bit	13-bit	13-bit	13-bit
	Comparator	●	●	●	●	●	●
	Temperature Sensor	●	●	●	●	●	●
	GPIO	39	39	39	29	39	22
Packages	Type	QFN56	QFN56	QFN56	BGA55	BGA68	QFN40
	Dimensions	7.0 * 7.0 mm	7.0 * 7.0 mm	7.0 * 7.0 mm	3.5 *3.5 mm	5.3 * 5.3 mm	5.0 * 5.0 mm
Certification		PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)
Operating Temperature		-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃
Supply Voltage Range		2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V
Development Kits		GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit

4. Change Log

• Click to view the change log