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@renesas-fsp-development renesas-fsp-development released this 27 Jun 16:56

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.4.0.

Minimum e2 studio version for FSP 5.4.0 is e2 studio 2024-04

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_4_0_e2s_v2024-04.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_4_0_e2s_v2024-04.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_4_0_e2s_v2024-04.pkg, from here.

If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.

  • For Windows download setup_fsp_v5_4_0_rasc_v2024-04.exe from here
  • For Linux download setup_fsp_v5_4_0_rasc_v2024-04.AppImage from here
  • For macOS (Apple Silicon) download setup_fsp_v5_4_0_rasc_v2024-04.pkg from here

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 13.2

LLVM Embedded Toolchain for Arm: 18.1.3

IAR Compiler: 9.50.2

ARM Compiler: 6.21

QE for Capacitive Touch: 3.5.0 or higher

QE for Display: 3.2.0

QE for BLE: 1.7.0

QE for Motor: 1.3.0

e2 studio: 2024-04

RASC: 2024-04

Renesas E2 and E2 Lite: 2.1.3

SEGGER J-Link: 7.96j

New Features

  • Support MacOS RASC build for FSP
  • LLVM updated to version 18.1.3 in platform installer
  • Support for new development kits:
    • FPB-RA4T1
    • FPB-RA6T3
  • Added support for SDRAM as part of BSP
  • Added SMBus support via I2C
  • Added OSPI support to MCUboot for RA8 devices
  • Added support for HDR-DDR mode in I3C for RA8 devices
  • Added option to Fill Flash Gap on RA2 parts (requires -Oz optimization setting)
  • Added new Renesas CM85 caching documentation
  • BLE module support for DA14535 BLE SoC
  • Added custom bitrate support for I2C peripherals
  • PSA Crypto support ED25519 key generation
  • HMAC-SHA 384/512 support for RSIP-E51A Protected Mode
  • DA16XXX improvements:
    • Support for SAU UART peripheral
    • Support for MQTT simultaneous publish/subscribe

Fixes and Improvements

  • Updated Arm CMSIS to 6.1.0
    • CMSIS-NN updated to 5.0.0
  • Updated MCUboot to 2.0.0
  • Updated Arm Trusted Firmware-M to 2.0
  • Updated Arm Mbed TLS to 3.5.0
  • Updated Azure RTOS to v6.4.0
  • Segger J-Link version updated to 7.96j
  • Common FSP API support updated to v1.6.0
  • RA0/RA2 Technical update : RA2A2 Disable RTC register access in BSP startup procedure and Low Power Mode (LPM) to reduce power consumption
  • Code size optimization and new build-time options for the following modules:
    • SAU SPI
    • UARTA
    • TAU PWM
  • Fixed build error in rm_comms_uart
  • Fixed IAR build support for MCUboot projects
  • Fixed build error when r_ioport module name is changed
  • Added property to adjust FreeRTOS configTASK_NOTIFICATION_ARRAY_ENTRIES macro
  • Fixed IAR build warnings in rm_motor_driver
  • Fixed erroneous baudrate constraint message when using SAU UART
  • Fixed devassist for SAU_I2C
  • SCE / RSIP Changes
    • Fixed issue related to the DLM state in SCE9 Protected Mode
    • Fixed secp521r1 signature generation corrupts memory in RSIP-E51A Protected Mode
    • Fixed missing 4-byte aligned data in examples for RSIP-E51A Protected Mode
    • Fixed C++ project causes a build error in SCE5 Compatibility Mode
    • Updated RSIP-E51A Protected Mode documentation
  • USB Changes
    • Fixed callback issue on USBX PHID
    • Fixed connection issue on USB composite (PCDC+PMSC) with FreeRTOS and baremetal
    • Fixed build failure when USB_DEBUG_ON option enabled
    • Fixed parameter checking issue on USB Host Composite (CDC and MSC)
    • Removed PLLRESET bit setting in USB initialization process
  • Fixed infinite loop in RPA generation and resolution due to Bluetoooth link layer hardware
  • Fixes for Silex WiFi modules:
    • Fixed hardfault when calling Close API
    • Fixed compilation warning when using Azure RTOS and NetXduo
  • Various configuration constraint improvements
  • Fixed DA16XXX issue related to header length check

Known Issues

  • RA0E1:
    • e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
      • Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
    • HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
    • FS1015 and FS3000 sensors do not support SAU-I2C driver
  • Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
  • PMSC may not work properly when USBX Composite Device(PCDC+PMSC) is connected to specific Linux OS (USB Host).

Note

  • RYZ cellular modules are deprecated and will be removed from FSP in a future release

Visit GitHub Issues for this project.

Third Party Software

These third party software solutions are included alongside FSP.

Amazon coreHTTP: 3.0.0+renesas.0

Amazon coreMQTT: 2.1.1

Amazon corePKCS11: 3.5.0

Amazon coreJSON: 3.2.0

Amazon FreeRTOS+FAT: f834aee4

Amazon FreeRTOS Cellular Interface: 1.3.0

Amazon FreeRTOS Kernel: 10.6.1

Amazon FreeRTOS+TCP: 4.0.0

Amazon OTA 3.4.0

Arm CMSIS6: 6.1.0

Arm CMSIS-NN: 5.0.0

Arm CMSIS-DSP: 1.15.0

Arm Mbed TLS: 3.5.0+renesas.0

Arm Trusted Firmware-M: 2.0.0+renesas.0

Arm littlefs: 2.2.1+renesas.1

Intel TinyCrypt: 0.2.8+renesas.2

Intel tinyCBOR: 0.6.0

MCUboot: 2.0.0+renesas.0

Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.1

Microsoft Azure RTOS FileX: 6.4.0

Microsoft Azure RTOS GUIX: 6.4.0

Microsoft Azure RTOS LevelX: 6.4.0

Microsoft Azure RTOS NetX Duo: 6.4.0+renesas.0

Microsoft Azure RTOS ThreadX: 6.4.0

Microsoft Azure RTOS USBX: 6.4.0

SEGGER emWin: 6.36

TES D/AVE 2D: 3.8.0

Bug Fixes

See fixed GitHub Issues for this release.

Knowledge Base

Visit our knowledge base for other technical updates.

MD5 Checksums

  • FSP_Packs_v5.4.0.zip 8e508b9acf39d00a7f293db9f6fd0a4e
  • FSP_Packs_v5.4.0.exe 6a8f7a0cf29b9f9aafb5d325e44e5f8e
  • fsp_documentation_v5.4.0.zip 5548fc4bc761dc40e823166835bfe147
  • setup_fsp_v5_4_0_e2s_v2024-04.exe 11a5f020ac62d7d3298a1f5fb3ad9bd8
  • setup_fsp_v5_4_0_e2s_v2024-04.AppImage 324e0aab70645e3c3b63b6a7f2ed5d74
  • setup_fsp_v5_4_0_e2s_v2024-04.pkg 9c164f0103d2aaddc3da0393ed40c237
  • setup_fsp_v5_4_0_rasc_v2024-04.exe 9ce64a81b299488f6d1695467866a927
  • setup_fsp_v5_4_0_rasc_v2024-04.AppImage 8773d006b2f0b41b085ab6bc198c0697
  • setup_fsp_v5_4_0_rasc_v2024-04.pkg 956b136507dc4385f6ac2bd52e06166d
  • MDK_Device_Packs_v5.4.0.zip f5da181d85f4e559d2d7895650d99297