Releases: renesas/fsp
v5.5.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.5.0.
Minimum e2 studio version for FSP 5.5.0 is e2 studio 2024-07
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_5_0_e2s_v2024-07.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_5_0_e2s_v2024-07.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_5_0_e2s_v2024-07.pkg, from here.
If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.
- For Windows download setup_fsp_v5_5_0_rasc_v2024-07.exe from here
- For Linux download setup_fsp_v5_5_0_rasc_v2024-07.AppImage from here
- For macOS (Apple Silicon) download setup_fsp_v5_5_0_rasc_v2024-07.pkg from here
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
LLVM Embedded Toolchain for Arm: 18.1.3
QE for Capacitive Touch: 3.5.0
Contributor License Agreement
- Added CONTRIBUTING.md file to Github repository containing guidelines for community contributions to FSP.
- Note: We now require community contributors to sign a Contributor License Agreement (CLA). If you or your organization haven't previously signed, a bot comment will prompt you to sign the CLA when you create a pull request.
New Features
- Added support for the following boards:
- VK-RA8M1
- VOICE-RA2L1
- VOICE-RA4E1
- VOICE-RA6E1
- OSPI/DOTF: Added support for wrapped AES keys
- DA14531/DA14535: Added support for Legacy Pairing, Just Works, and Passkey pairing methods as well as initiating pairing from the Peripheral side
- Block Media RAM middleware now supports SDRAM and other memory-mapped RAM devices
- SCI UART driver now supports IrDA communication on supported devices
- Added support for lwIP (lightweight TCP/IP) stack
- Added support for ZMOD4510 NO2 O3 sensor
- Support Dual Bank mode for Flash LP with MCUboot
- Added LittleFS support for external Flash
- Added support for GM02S LTE module
- GM cellular modules are a direct replacement for RYZ. As such, certain EWF and AWS cellular interface usage notes will now reference GM instead of RYZ. Some support for RYZ nomenclature has been retained for compatibility purposes.
Fixes and Improvements
- MCUBoot updated to 2.1.0
- Arm Mbed TLS updated to 3.6.0
- FreeRTOS+TCP updated to 4.2.1
- Segger JLink version updated to 7.98b
- CMSIS-DSP updated to 1.16.2
- RA8x1 Updates to clocks tab
- Updated the tooltip for ICLK and PCLKs to match the description in the hardware manual
- RA8T1 Removed unsupported clocks from clock tree (LCDCLK, U60CK, OCTASPICLK)
- Added missing PLL divider option (PLL Div / 4)
- Additional code size optimizations for TML32 and SAU UART drivers on RA0E1
- Fixed AC6/LLVM warning in rm_motor_driver (Implicit conversion from float to uint16_t)
- Fixed issue in AC6 linker scripts where extra RAM was being allocated for non-secure buffers in NetX projects on devices that don't support TrustZone.
- RA2A2 Fixed issue where the LOCO could be selected as a clock source for RTC (Only Sub-Clock is available)
- RA0E1 Fixed issue where the weekday field was not being calculated in the r_rtc module.
- IICA Fixed build warning in generated code when SDLA and SDAA pins were disabled.
- IICA Fixed issue where transfers were not aborted after receiving a NACK
- Fixed build errors when 'Enable inline BSP IRQ functions' setting is enabled on CM4 devices
- Fixed write value of unused mask invalid bits in r_can driver (applies to FIFO mode only)
- Fixed unresolvable constraint when multiple I3C stacks are added
- Added warnings for certain invalid clock configurations on some devices
- Fixed invalid Developer Assistance callback entry for SAU UART
- CTSU: Fixed issue with capacitive touch filter
- Fixed issue with upgrade mode (Direct XIP) using MCUboot and internal code flash
- Fixed issue with CEU capture
- Fixed TRNG drawing excessive current after use when placed in power down
- DSI: Fixed virtual channel ID for HS sequence operations
- Common FSP API support updated to v1.7.0
- Update MQTT usage notes
- IAR EW projects now correctly select size-based optimization for RA0E1 projects by default
- SMBus now provides unique error codes for different timeout events via
rm_comms_callback_args_t::p_instance_args
Deprecations
- FS2012 and OB1203 sensor modules
- RYZ cellular modules
- ZMOD4410 "Odor" mode
- ZMOD4510 "OAQ 1st Gen" mode
Known Issues
- RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Add optimization flags (e.g.
-O0
) manually to 'Other optimization flags' to override the-Oz
setting
- Add optimization flags (e.g.
- HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
- FS1015 and FS3000 sensors do not support SAU-I2C driver
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when USBX Composite Device(PCDC+PMSC) is connected to specific Linux OS (USB Host).
Visit GitHub Issues for this project.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon coreHTTP: 3.0.0+renesas.0
Amazon FreeRTOS Cellular Interface: 1.3.0
Amazon FreeRTOS Kernel: 10.6.1
Arm Trusted Firmware-M: 2.1.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.2
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.2
Microsoft Azure RTOS FileX: 6.4.0
v5.4.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.4.0.
Minimum e2 studio version for FSP 5.4.0 is e2 studio 2024-04
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_4_0_e2s_v2024-04.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_4_0_e2s_v2024-04.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_4_0_e2s_v2024-04.pkg, from here.
If you are using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for your operating system.
- For Windows download setup_fsp_v5_4_0_rasc_v2024-04.exe from here
- For Linux download setup_fsp_v5_4_0_rasc_v2024-04.AppImage from here
- For macOS (Apple Silicon) download setup_fsp_v5_4_0_rasc_v2024-04.pkg from here
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
LLVM Embedded Toolchain for Arm: 18.1.3
QE for Capacitive Touch: 3.5.0 or higher
New Features
- Support MacOS RASC build for FSP
- LLVM updated to version 18.1.3 in platform installer
- Support for new development kits:
- FPB-RA4T1
- FPB-RA6T3
- Added support for SDRAM as part of BSP
- Added SMBus support via I2C
- Added OSPI support to MCUboot for RA8 devices
- Added support for HDR-DDR mode in I3C for RA8 devices
- Added option to Fill Flash Gap on RA2 parts (requires -Oz optimization setting)
- Added new Renesas CM85 caching documentation
- BLE module support for DA14535 BLE SoC
- Added custom bitrate support for I2C peripherals
- PSA Crypto support ED25519 key generation
- HMAC-SHA 384/512 support for RSIP-E51A Protected Mode
- DA16XXX improvements:
- Support for SAU UART peripheral
- Support for MQTT simultaneous publish/subscribe
Fixes and Improvements
- Updated Arm CMSIS to 6.1.0
- CMSIS-NN updated to 5.0.0
- Updated MCUboot to 2.0.0
- Updated Arm Trusted Firmware-M to 2.0
- Updated Arm Mbed TLS to 3.5.0
- Updated Azure RTOS to v6.4.0
- Segger J-Link version updated to 7.96j
- Common FSP API support updated to v1.6.0
- RA0/RA2 Technical update : RA2A2 Disable RTC register access in BSP startup procedure and Low Power Mode (LPM) to reduce power consumption
- Code size optimization and new build-time options for the following modules:
- SAU SPI
- UARTA
- TAU PWM
- Fixed build error in rm_comms_uart
- Fixed IAR build support for MCUboot projects
- Fixed build error when r_ioport module name is changed
- Added property to adjust FreeRTOS configTASK_NOTIFICATION_ARRAY_ENTRIES macro
- Fixed IAR build warnings in rm_motor_driver
- Fixed erroneous baudrate constraint message when using SAU UART
- Fixed devassist for SAU_I2C
- SCE / RSIP Changes
- Fixed issue related to the DLM state in SCE9 Protected Mode
- Fixed secp521r1 signature generation corrupts memory in RSIP-E51A Protected Mode
- Fixed missing 4-byte aligned data in examples for RSIP-E51A Protected Mode
- Fixed C++ project causes a build error in SCE5 Compatibility Mode
- Updated RSIP-E51A Protected Mode documentation
- USB Changes
- Fixed callback issue on USBX PHID
- Fixed connection issue on USB composite (PCDC+PMSC) with FreeRTOS and baremetal
- Fixed build failure when USB_DEBUG_ON option enabled
- Fixed parameter checking issue on USB Host Composite (CDC and MSC)
- Removed PLLRESET bit setting in USB initialization process
- Fixed infinite loop in RPA generation and resolution due to Bluetoooth link layer hardware
- Fixes for Silex WiFi modules:
- Fixed hardfault when calling Close API
- Fixed compilation warning when using Azure RTOS and NetXduo
- Various configuration constraint improvements
- Fixed DA16XXX issue related to header length check
Known Issues
- RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Add optimization flags (e.g.
-O0
) manually to 'Other optimization flags' to override the-Oz
setting
- Add optimization flags (e.g.
- HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
- FS1015 and FS3000 sensors do not support SAU-I2C driver
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when USBX Composite Device(PCDC+PMSC) is connected to specific Linux OS (USB Host).
Note
- RYZ cellular modules are deprecated and will be removed from FSP in a future release
Visit GitHub Issues for this project.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon coreHTTP: 3.0.0+renesas.0
Amazon FreeRTOS Cellular Interface: 1.3.0
Amazon FreeRTOS Kernel: 10.6.1
Arm Trusted Firmware-M: 2.0.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.2
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.1
Microsoft Azure RTOS FileX: 6.4.0
Microsoft Azure RTOS GUIX: 6.4.0
Microsoft Azure RTOS LevelX: 6.4.0
Microsoft Azure RTOS NetX Duo: 6.4.0+renesas.0
Microsoft Azure RTOS ThreadX: 6.4.0
Microsoft Azure RTOS USBX: 6.4.0
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
[Visit our knowledge base for other technical updates.](https://en-support.renesa...
v5.3.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.3.0.
Minimum e2 studio version for FSP 5.3.0 is e2 studio 2024-04
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_3_0_e2s_v2024-04.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_3_0_e2s_v2024-04.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_3_0_e2s_v2024-04.pkg, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release,
setup_fsp_v5_3_0_rasc_v2024-04.exe, for Windows from here.
setup_fsp_v5_3_0_rasc_v2024-04.AppImage, for Linux from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
LLVM Embedded Toolchain for Arm: 17.0.1
QE for Capacitive Touch: 3.3.0 or higher
Change to FSP License
The FSP license has been changed to BSD-3-Clause, allowing for more flexible use in open-source projects. License terms (including exceptions) are available in the LICENSE file.
Important Information for RA0E1 Development
FSP v5.3.0 includes support for the new RA0E1 MCU. For developers using this MCU, please note the following important improvements and known issues:
Improvements
- The space between the vector table (starting at 0x0) and option setting memory (starting at 0x400) is now automatically filled with a preselected set of BSP functions. This functionality can be changed via the new 'Fill flash gap' BSP property.
- The functions placed in the section have been selected based on
-Oz
(aggressive size) optimization. When using other optimization levels this function may need to be disabled. - When disabled, the space can be filled with user code/data by placing items in the
.flash_gap
section. - The FSP development team is currently analyzing all RA0E1 drivers to identify additional areas where code size savings can be made. Significant optimizations will continue to be made in coming releases. Modules optimized so far include:
- ADC_D
- RTC_C
- SAU I2C
- SAU UART
- TAU
Known Issues
- RA0E1 e2 studio projects currently automatically reset compiler optimization to
-Oz
(aggressive size optimization) when generating or compiling. To override this behavior, manually add the desired optimization flag(s) (e.g.-O0
) to the 'Other optimization flags' box in the project Properties. - The following sensors are currently not supported:
- HS400x
- ZMOD4xxx
- OB1203
- The following sensors do not support SAU-I2C driver:
- FS1015
- FS3000
Features
- Support new development kits
- AIK-RA6M3
- AIK-RA4E1
- BGK-RA6E2
- The following modules are now supported in RA0E1 projects:
- LPM
- IICA
- TML32
- Support 4096-bit RSA key generation for RA8 devices
- Support MCUBoot TrustZone for external QSPI based memory
- Support HOCOCR2 register for RA4M1
- Support GPT trigger for ADC
- Added Netxduo wifi and onchip_silex_wifi documentation
- Baremetal support for DA16XXX Wi-Fi and on-chip MQTT/HTTP client modules
- Support for Reality AI over USB
- Dual motor support for MCK-RA8T1
- Support RRH46410 sensor
- Support USBX composite PCDC+PMSC
- DTC event selection now limited to only DTC-compatible events with an enabled interrupt
- Support IICA for 20 and 16 pin devices of RA0E1
Fixes and Improvements
- Platform installer updated to include e2 studio 2024-04
- Segger J-Link version updated to 7.96a
- IAR compiler version updated to 9.50.2
- Common FSP API support updated to v1.5.0
- Support RSIP-E51A protected mode for RA8D1 and RA8T1 devices
- RSIP-E51A protected mode support new cryptographic feature.
- SHA-512
- ECC P-521
- RSA 3072/4096 bit key generation
- AES key wrap/unwrap following RFC3394
- Injected key import API
- Support IICA Master in rm_comms_i2c
- Updated GPT driver to support compare match
- Updated documentation for USB
- Updated documentation for Reality AI over USB
- Updated MCUBoot documentation to address a TrustZone issue on RA8M1
- Fixed some artifacting issues when using D-Cache in emWin projects
- Fixed DOTF configuration key type
- Fixed compilation failure when selecting 'use own target' for Ethernet PHY leads
- Fixed limitation of LLVM support on BLE Mesh
- Fixed limitation related to the restart of SAU-I2C driver
- Fixed OSPI clock divider options for RA8D1
- Fixed ADCR register for RA0E1
- Fixed ADC conversion with synchronous trigger
- Resolved USB event handling issue when connected to Android/Linux hosts
- Fixed constraint issue with MCUBoot VTOR offset
- Fixed MCUBoot dual bank mode on RA8M1
- RTC on RA0E1 no longer pauses during Open if already running
- Fixed a parameter checking issue in R_LVD_Open on RA8M1, RA8D1 and RA8T1 devices
- Fixed issue when using UARTA with SOSC as the clock source
- Improved
rtc_alarm_time_t
configuration for RTC_C to match other RTC implementations - Wi-Fi API header file (
rm_wifi_api.h
) was updated to support baremetal and not be dependent on FreeRTOSportmacro
andrm_wifi_config
header files were wrapped to check for FreeRTOS- Wi-Fi configuration macros were included and wrapped to check for baremetal
WIFI_IsConnected()
function return type was changed fromBaseType_t
toWIFI_ReturnCode_t
to remove FreeRTOS dependency- Users will need to change their return value check (success return value changed from
1
to0
)
- Users will need to change their return value check (success return value changed from
Known Issues
- Selecting 'Safely Remove Hardware and Eject Media' on Windows and eject the mass storage (PMSC), when using USBX composite device (PCDC+PMSC), the Windows Explorer for PMSC does not disappear.
- PMSC may not work properly when USBX Composite Device(PCDC+PMSC) is connected to specific Linux OS (USB Host).
Visit GitHub Issues for this project.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon coreHTTP: 3.0.0+renesas.0
Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52
Amazon FreeRTOS Cellular Interface: 1.3.0
Amazon FreeRTOS Kernel: 10.6.1
Arm Trusted Firmware-M: 1.8.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.2
[Microsoft Azure Embedded ...
v5.2.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.2.0.
Minimum e2 studio version for FSP 5.2.0 is e2 studio 2024-01.1
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.pkg, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_2_0_rasc_v2024-01.1.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
LLVM Embedded Toolchain for Arm: 17.0.1
QE for Capacitive Touch: 3.3.0 or higher
Important Information for RA0E1 Development
FSP v5.2.0 includes support for the upcoming RA0E1 MCU. For developers using this MCU, please note the following important improvements and known issues:
Improvements
- The space between the vector table (at 0x0) and option setting memory (at 0x400) is now automatically filled with a preselected set of BSP functions. This functionality can be changed via the new 'Fill flash gap' BSP property.
- The functions placed in the section have been selected based on
-Oz
(aggressive size) optimization. When using other optimization levels this function may need to be disabled. - When disabled, the space can be filled with user code/data by placing items in the
.flash_gap
section.
- The functions placed in the section have been selected based on
- The FSP development team is currently analyzing all RA0E1 drivers to identify additional areas where code size savings can be made. Significant optimizations will continue to be made in coming releases
Known Issues
- RA0E1 e2 studio projects currently automatically reset compiler optimization to
-Oz
(aggressive size optimization) when generating or compiling. To override this behavior, manually add the desired optimization flag(s) (e.g.-O0
) to the 'Other optimization flags' box in the project Properties. - The LPM module is not yet supported.
- The following sensors are currently not supported:
- HS400x
- ZMOD4xxx
- OB1203
Features
- Support for new devices:
- RA2A2 MCU
- RA0E1 MCU
- Support for new development kits:
- EK-RA2A2
- FPB-RA0E1
- Support updated part numbers for RA2E1
- USB Host Composite CDC + MSC support
- Added new 'Using Registers Directly' guide to usage notes
- RSIP-E51A Protected Mode support
Fixes and Improvements
- Platform installer updated to include e2 studio 2024-01.1
- Platform installer for MacOS
- IAR compiler version updated to 9.50.1
- Arm compiler version updated to 6.21
- Segger J-Link version updated to 7.94g
- Segger emWin version updated to 6.36
- E2 and E2 Lite version updated to 2.1.3
- Common FSP API support updated to v1.3.0
- Resolved issues in SCE5 and SCE5_B cryptographic procedures
- All peripherals now set to Secure by default in Flat projects
- Fixed build warning when using FreeRTOS Heap in IAR EW projects
- Added missing ADC_B Developer Assistance entries
- Updated to support 0 length data for GCM AAD. Cleaned up documentation and error condition checks. Added more examples for CCM and CMAC.
- SCE5 & SCE5_B security updates
- Improved r_ble API usage note about L2CAP CBFC Channel connection parameters
- USB Changes
- Fixed DMA src/dest address in configurator generated code
- Improved an error message when enabling continuous transfer mode on Full-Speed
- Improved timeout process for USBX PCDC
- Fixed configuration issue related to interrupt priority and Battery Charging on Hi-Speed
- Fixed memory corruption when USB related interrupt configuration is set to Not Supported
- Fixed USB HMSC setup failure on Hi-Speed
Known Issues
- RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- Add optimization flags (e.g.
-O0
) manually to 'Other optimization flags' to override the-Oz
setting
- Add optimization flags (e.g.
- The LPM module is not supported
- HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
- EWARM support for RA2A2, RA0E1
- EWARM version 9.50.1 does not contain support for RA2A2, RA0E1. To develop for these devices, It will be necessary to Install support patch files (arm_Renesas_RA2A2_patch_20230302_1.zip,arm_Renesas_RA0E1_patch_20240103_1.zip) which can be downloaded by EWARM v9.50.1 users from the IAR MyPages system.
- AGTW event not being properly output as activation source
- DTC events are shown for selection that are not configured as interrupts
Visit GitHub Issues for this project.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon coreHTTP: 3.0.0+renesas.0
Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52
Amazon FreeRTOS Cellular Interface: 1.3.0
Amazon FreeRTOS Kernel: 10.6.1
Arm Trusted Firmware-M: 1.8.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.2
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.1
Microsoft Azure RTOS FileX: 6.2.1
Microsoft Azure RTOS GUIX: 6.2.1
Microsoft Azure RTOS LevelX: 6.2.1
Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1
Microsoft Azure RTOS ThreadX: 6.2.1
Microsoft Azure RTOS USBX: 6.2.1
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v5.2.0.zip fcf...
v5.1.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.1.0.
Minimum e2 studio version for FSP 5.1.0 is e2 studio 2023-10
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_1_0_e2s_v2023-10.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_1_0_e2s_v2023-10.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_1_0_rasc_v2023-10.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
LLVM Embedded Toolchain for Arm: 17.0.1
QE for Capacitive Touch: 3.3.0 or higher
QE for Display: 3.1.1 or higher
Renesas E2 and E2 Lite: 1.13.3
Features
- Support for new devices:
- RA8D1 MCU
- RA8T1 MCU
- Support for new development kits:
- EK-RA8D1
- MCK-RA8T1
- Added SCI_B LIN driver (r_sci_b_lin)
- Added support for multiple data collector instances.
- Added ability to control the transmit power on the DA14531 via the existing API’s
- Support USB PPRN for FreeRTOS
- Support interrupt mode for USB-PCDC on bare-metal
- Added new driver to support using the DA16xxx HTTP stack with FSP
Fixes and Improvements
- Arm GNU Toolchain updated to version 13.2
- J-Link updated to version 7.92o
- Improved CTSU measurement accuracy by correcting correction calculation
Known Issues
- Potential issue with AES CCM support in PSA Crypto (under investigation)
- Potential issue with ZMOD4xxx RAQ support on CM4 devices (under investigation)
- EWARM support for RA8M1, RA8D1, RA8T1 and RA2E3
- EWARM version 9.40.1 do not contain support for RA8M1, RA8D1, RA8T1 and RA2E3. To develop for these devices, It will be necessary to Install support patch files which can be downloaded by EWARM v9.40.1 users from the IAR MyPages system.
- The following is not yet supported in projects using LLVM Compiler:
- BLE Mesh modules
- RYZ Cellular AWS support
- USB HMSC does not work with secure project on RA4, RA6 and RA8 series devices other than GCC compiler (deploys TrustZone).
Visit GitHub Issues for this project.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon coreHTTP: 3.0.0+renesas.0
Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52
Amazon FreeRTOS Cellular Interface: 1.3.0
Amazon FreeRTOS Kernel: 10.6.1
Arm Trusted Firmware-M: 1.8.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.1
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.0
Microsoft Azure RTOS FileX: 6.2.1
Microsoft Azure RTOS GUIX: 6.2.1
Microsoft Azure RTOS LevelX: 6.2.1
Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1
Microsoft Azure RTOS ThreadX: 6.2.1
Microsoft Azure RTOS USBX: 6.2.1
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v5.1.0.zip 7ca3c7beca916e720a28ac09077374f4
- FSP_Packs_v5.1.0.exe 115b2763b74d50d5665d795ab4ddaf74
- fsp_documentation_v5.1.0.zip 57ba796be534148ca860d0ae6a28261a
- setup_fsp_v5_1_0_e2s_v2023-10.exe 4dd25d3b0c4f3c7fa003484f47c15936
- setup_fsp_v5_1_0_e2s_v2023-10.AppImage 0e476c797846fc3dec36f75b735651b4
- setup_fsp_v5_1_0_rasc_v2023-10.exe 16f84eae3b579a7061b40518222de273
- setup_fsp_v5_1_0_rasc_v2023-10.AppImage ae77dc9143471b37814770b418923100
- MDK_Device_Packs_v5.1.0.zip 15be2247cd3bd7761048d0cd77e5fc43
v5.0.1
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.0.1.
This release includes packs that are installed separately from e2 studio. This means the v5.0.0 platform installer (Windows) or the v5.0.0 AppImage (Linux) should be installed first, then the packs in this release can be installed into the new e2 studio.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v5.0.1.zip 5c62b6b347f3baf126cdc55589d7e6c0
- FSP_Packs_v5.0.1.exe 5912286c922021fc90251f8e621ffddd
- fsp_documentation_v5.0.1.zip ef80f6e4007e8683b9b934d64c823150
- MDK_Device_Packs_v5.0.1.zip eae8bf4923923fe1bc8b316e64495d8e
v5.0.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.0.0.
Minimum e2 studio version for FSP 5.0.0 is e2 studio 2023-10
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_0_0_e2s_v2023-10.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_0_0_e2s_v2023-10.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_0_0_rasc_v2023-10.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
LLVM Embedded Toolchain for Arm: 17.0.1
QE for Capacitive Touch: 3.3.0
Renesas E2 and E2 Lite: 1.13.3
Features Added
- Support for new devices:
- RA8M1 MCU
- RA2E3 MCU
- Support for new development kits:
- EK-RA8M1
- FPB-RA2E3
- CK-RA6M5 V2
- Support for LLVM Embedded Toolchain for Arm (v17.0.1)
- Support for booting DA14531 from host MCU
- Support for USB HCDC-ECM
- RSIP Key Injection API for ECC and RSA
- I2C slave DTC support
Fixes and Improvements
- Platform installer updated to include e2 studio 2023-10
- TF-M version has been updated to v1.8.0
- E2 and E2 Lite version updated to 1.13.3
- JLink version updated to 7.92j
- emWin version updated to 6.34c
- CMSIS NN version updated to 4.1.0
- Updated FreeRTOS
- Updated zmod modules IAQ 2nd Gen, IAQ 2nd Gen ULP, Relative IAQ, Relative IAQ ULP
- Common FSP API support updated to v1.1.0
- Improved CTSU CFC measurement feature
- Updated Sensor GMOD library
- Added user custom feature for ether phy
Known Issues
- EWARM support for RA8M1 and RA2E3
- EWARM version 9.40.1 do not contain support for RA8M1 and RA2E3. To develop for these devices, It will be necessary to Install support patch files which can be downloaded by EWARM v9.40.1 users from the IAR MyPages system.
- The following is not yet supported in projects using LLVM Compiler:
- BLE Balance and Compact configurations
- BLE Mesh modules
- RYZ Cellular AWS support
- Virtual EEPROM (VEE) module
- USB HMSC does not work with secure project on RA4, RA6 and RA8 series devices (deploys TrustZone).
Visit GitHub Issues for this project.
Third Party Software
These third party software solutions are included alongside FSP.
Amazon coreHTTP: 3.0.0+renesas.0
Amazon FreeRTOS+FAT: 08d0cff40d9832f235442ab22e577ddf4204da52
Amazon FreeRTOS Cellular Interface: 1.3.0
Amazon FreeRTOS Kernel: 10.6.1
Arm Trusted Firmware-M: 1.8.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.1
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.0
Microsoft Azure RTOS FileX: 6.2.1
Microsoft Azure RTOS GUIX: 6.2.1
Microsoft Azure RTOS LevelX: 6.2.1
Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1
Microsoft Azure RTOS ThreadX: 6.2.1
Microsoft Azure RTOS USBX: 6.2.1
Bug Fixes
See fixed GitHub Issues for this release.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v5.0.0.zip 669b14f09baddf3f124bc22f8cd11a84
- FSP_Packs_v5.0.0.exe e6c10f42bfa6a2bfaa59a5b4abfc4e12
- fsp_documentation_v5.0.0.zip cbc95d60af9955fdc161af048a026268
- setup_fsp_v5_0_0_e2s_v2023-10.exe e287c88e5ac12f7b82996a1a2af9cf6f
- setup_fsp_v5_0_0_e2s_v2023-10.AppImage 7801a3a269e8639200f9ab66bc3734ab
- setup_fsp_v5_0_0_rasc_v2023-10.exe 27c30bd4707d97fd7979230c6cbe3b28
- setup_fsp_v5_0_0_rasc_v2023-10.AppImage 47bc45b2ca8388d9b77d82aa56499f6a
- MDK_Device_Packs_v5.0.0.zip bac7c614a09d2718becc62b17e760adb
v4.6.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.6.0.
Minimum e2 studio version for FSP 4.6.0 is e2 studio 2023-07
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_6_0_e2s_v2023-07.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_6_0_e2s_v2023-07.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_6_0_rasc_v2023-07.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 3.3.0
Renesas E2 and E2 Lite: 1.13.2
Features Added
- DA16600 WiFi support
Fixes and Improvements
- Platform installer updated to include e2 studio 2023-07
- SEGGER emWin version updated to 6.34
- E2 and E2 Lite version updated to 1.13.2
- Arm Compiler updated to 6.19
- GCC compiler updated to 12.2
- Segger J-Link version updated to 7.88n
- MCUboot updated to 1.10
- Memory optimizations for using On-Chip MQTT drivers for DA16XXX modules
- Fixed invalid default clocks on CK-RA6M5
- Added TFM Support for RA6M5
- Added CANFD transmit FIFO support (Common FIFOs)
- Improved Motor driver support when using two motors
- Fixed issue with filter function in ADC_B Hybrid mode
- Fixed issue with configuring QSPI pins on RA4E1 48 pin devices
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.6
Arm Trusted Firmware-M: 1.7.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2+renesas.0
Microsoft Azure RTOS FileX: 6.2.1
Microsoft Azure RTOS GUIX: 6.2.1
Microsoft Azure RTOS LevelX: 6.2.1
Microsoft Azure RTOS NetX Duo: 6.2.1+renesas.1
Microsoft Azure RTOS ThreadX: 6.2.1
Microsoft Azure RTOS USBX: 6.2.1
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v4.6.0.zip 3210d59e6a5590b418365f482271e3e0
- FSP_Packs_v4.6.0.exe 595c788db86ffcca864c2c37a63dbbb5
- fsp_documentation_v4.6.0.zip 2da86a6186ddb19a8c762463226b8bb5
- setup_fsp_v4_6_0_e2s_v2023-07.exe e1407ac041d9f8a63b2474e27e5eb125
- setup_fsp_v4_6_0_e2s_v2023-07.AppImage 57a97a6691ad20f6c65940752b836bc6
- setup_fsp_v4_6_0_rasc_v2023-07.exe 616c5b17b7fd721c32fa3eafd74a536b
- setup_fsp_v4_6_0_rasc_v2023-07.AppImage 0412882ac6e05f342faa21db0d4bb204
- MDK_Device_Packs_v4.6.0.zip 64e31470e443900e92a54dcae22e49ea
v4.5.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.5.0.
Minimum e2 studio version for FSP 4.5.0 is e2 studio 2023-04
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_5_0_e2s_v2023-04.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_5_0_e2s_v2023-04.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_5_0_rasc_v2023-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Tools
QE for Capacitive Touch: 3.2.0
Renesas E2 and E2 Lite: 1.12.2
Features Added
- Support CCM hardware acceleration on SCE7 and SCE9 for PSA Crypto
- Support CCM hardware acceleration on all SCE engines for Netx Crypto
- Support generating transfer descriptor array for chain transfer in DTC
- Support Block Media RAM
- Support Smart Card Interface
- Added Data Collector module for Reality AI
- Added Data Shipper module for Reality AI
- Added new zmod modules IAQ 2nd Gen and IAQ 2nd Gen ULP
- Added on-chip MQTT support to DA16xxx
Fixes and Improvements
- Fixed initialization issue in Virtual EEPROM (rm_vee_flash)
- Fixed missing files in AWS TLS 1.3
- Segger J-Link version updated to 7.88d
- SEGGER emWin version updated to 6.32c
- Arm Mbed TLS version updated to 3.4.0
- IAR compiler version updated to 9.40.1
- The rm_wifi_onchip_da16200 module has been renamed to rm_wifi_onchip_da16xxx to make way for future Dialog 16xxx series support in FSP.
Users calling the following SNTP APIs in projects created before v4.5.0 will need to update to the new API names:- RM_WIFI_ONCHIP_DA16200_SntpServerIpAddressSet -> RM_WIFI_ONCHIP_DA16XXX_SntpServerIpAddressSet
- RM_WIFI_ONCHIP_DA16200_SntpEnableSet -> RM_WIFI_ONCHIP_DA16XXX_SntpEnableSet
- RM_WIFI_ONCHIP_DA16200_SntpTimeZoneSet -> RM_WIFI_ONCHIP_DA16XXX_SntpTimeZoneSet
- RM_WIFI_ONCHIP_DA16200_LocalTimeGet -> RM_WIFI_ONCHIP_DA16XXX_LocalTimeGet
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.6
Arm Trusted Firmware-M: 1.7.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2.renesas.rx
Microsoft Azure RTOS FileX: 6.2.1
Microsoft Azure RTOS GUIX: 6.2.1
Microsoft Azure RTOS LevelX: 6.2.1
Microsoft Azure RTOS NetX Duo: 6.2.1
Microsoft Azure RTOS ThreadX: 6.2.1
Microsoft Azure RTOS USBX: 6.2.1
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v4.5.0.zip 48af462dfcd5e92345f8cd9f76bd83f6
- FSP_Packs_v4.5.0.exe 19bc88bfb598b0a8c73d42e8adc3a483
- fsp_documentation_v4.5.0.zip ccca8b498a534543db815fd4b6d4e855
- setup_fsp_v4_5_0_e2s_v2023-04.exe 6c7039e47811ad0c7ebee5ab8673aa0c
- setup_fsp_v4_5_0_e2s_v2023-04.AppImage 2114bc0f6eea10257f5ccf96c17a365b
- setup_fsp_v4_5_0_rasc_v2023-04.exe 9f5a7cfe42f2dc30e0a368031eece13a
- setup_fsp_v4_5_0_rasc_v2023-04.AppImage 23e0e2c580149523188de6edfe5e7553
- MDK_Device_Packs_v4.5.0.zip f9adee2ffcf534f49d4c1e4af2c323bd
v4.4.0
Release Notes
Flexible Software Package (FSP) for Renesas RA MCU Family, version 4.4.0.
Minimum e2 studio version for FSP 4.4.0 is e2 studio 2023-04
Download the FSP with e2 studio Windows installer for this release, setup_fsp_v4_4_0_e2s_v2023-04.exe, from here.
Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v4_4_0_e2s_v2023-04.AppImage, from here.
If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v4_4_0_rasc_v2023-04.exe, from here.
All installers are available in the Assets section of this release.
Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.
Refer to e2 studio section in System Requirements for operating environment information of e2 studio
Tools
QE for Capacitive Touch: 3.2.0
Renesas E2 and E2 Lite: 1.12.2
Known Issues
- EWARM support for RA4T1 and RA6T3 MCUs.
EWARM 9.32.2 does not contain support for the RA4T1 and RA6T3 devices. To develop for RA4T1 / RA6T3, It will be necessary to either:- Update to a later version of EWARM than v9.32.2, or
- Install support patch files which can be downloaded by EWARM 9.32.2 users from the MyPages system on www.iar.com
Features Added
- Support for new RA4T1 and RA6T3 MCUs
- Includes support for the following development boards:
- MCK-RA4T1
- MCK-RA6T3
- Includes support for the following development boards:
- Support AWS OTA
- Support for AWS Cellular APN Authentication
- Support CMAC hardware acceleration on SCE5, SCE5b, SCE7 and SCE9 for PSA Crypto
- Support NetX RSA acceleration on SCE7
- SCE7 Key Injection API supports AES-192, Brainpool 256 / 384
- Support USB composite device (PVND + PCDC)
- Support motor control on RA6T3 and RA4T1
- Support for TRNG module on RA4T1, RA6T3, RA6E2 and RA4E2
- support NetX SHA256 acceleration on SCE7
- support NetX ECC acceleration on SCE7
- Support USB Composite PCDC + PVND
- Support fastboot protected mode
Fixes and Improvements
- E2 and E2 Lite version updated to 1.12.2
- Platform installer updated to include e2 studio 2023-04
- Segger J-Link version updated to 7.86b
- SEGGER emWin version updated to 6.32b
- Arm Mbed TLS version updated to 3.3.0
- Arm Trusted Firmware-M updated to 1.7.0
- Microsoft Azure components updated to 6.2.1
- IAR compiler updated to 9.32.2
- Added Developer Assistance support to BLE Mesh
- Refactored DA14531 middleware and reduced memory usage
Third Party Software
These third party software solutions are included alongside FSP.
Amazon FreeRTOS Cellular Interface: 1.2.0
Amazon FreeRTOS Kernel: 10.4.6
Arm Trusted Firmware-M: 1.7.0+renesas.0
Intel TinyCrypt: 0.2.8+renesas.0
Microsoft Azure Embedded Wireless Framework: 1.0.0-preview.2.renesas.rx
Microsoft Azure RTOS FileX: 6.2.1
Microsoft Azure RTOS GUIX: 6.2.1
Microsoft Azure RTOS LevelX: 6.2.1
Microsoft Azure RTOS NetX Duo: 6.2.1
Microsoft Azure RTOS ThreadX: 6.2.1
Microsoft Azure RTOS USBX: 6.2.1
Bug Fixes
See fixed GitHub Issues for this release.
Known Issues
Visit GitHub Issues for this project.
Knowledge Base
Visit our knowledge base for other technical updates.
MD5 Checksums
- FSP_Packs_v4.4.0.zip 6d1db8a1b6ca4a68f49865c66da448a2
- FSP_Packs_v4.4.0.exe 1fd47ccfce259992800f92a67fc2f4b0
- fsp_documentation_v4.4.0.zip 9ddefcb1ab3628e0116afe9937b184c4
- setup_fsp_v4_4_0_e2s_v2023-04.exe c59dce2e388b7bb1de7db5dd62ce357a
- setup_fsp_v4_4_0_e2s_v2023-04.AppImage f9f48404a921e964fc852b85f9942ae5
- setup_fsp_v4_4_0_rasc_v2023-04.exe 71071ce4d721db0362330df604e02417
- setup_fsp_v4_4_0_rasc_v2023-04.AppImage bc3b1a86bd30cedf8eb24d91af438505
- MDK_Device_Packs_v4.4.0.zip b128b0db28313a273dd84f617543920c