Skip to content
New issue

Have a question about this project? Sign up for a free GitHub account to open an issue and contact its maintainers and the community.

By clicking “Sign up for GitHub”, you agree to our terms of service and privacy statement. We’ll occasionally send you account related emails.

Already on GitHub? Sign in to your account

4.0.0-alpha.2 Pre release #2461

Merged
merged 1 commit into from
Jun 23, 2022
Merged

4.0.0-alpha.2 Pre release #2461

merged 1 commit into from
Jun 23, 2022

Conversation

scott-brust
Copy link
Member

4.0.0-alpha.2

⚠️ Please note this is in internal release, do not use on production devices!

FEATURES

  • [esomx] Adds support for new platform esomx #2443 #2459
  • [E404X] Determine flash part at runtime #2456
  • [gen3][quectel] Adds support for BG95-M1, BG95-MF, BG77, and EG91-NAX #2458

BUGFIXES

  • [gen3] hal: fix power leak on Boron #2452

INTERNAL

  • [workbench] update-device-os-workbench-manifest-json #2457
  • [ci] test-build-system-tune-timeouts #2455

@scott-brust scott-brust added this to the 4.0.0 milestone Jun 17, 2022
@scott-brust scott-brust changed the title bump module version to 4.0.0-alpha.2 (4001) 4.0.0-alpha.2 Pre release Jun 17, 2022
@scott-brust scott-brust merged commit 5cfa3ec into develop Jun 23, 2022
@scott-brust scott-brust deleted the test/v4.0.0-alpha.2 branch June 23, 2022 19:14
Sign up for free to join this conversation on GitHub. Already have an account? Sign in to comment
Labels
None yet
Projects
None yet
1 participant