Release v5.2.0 · renesas/fsp

Release Notes

Flexible Software Package (FSP) for Renesas RA MCU Family, version 5.2.0.

Minimum e2 studio version for FSP 5.2.0 is e2 studio 2024-01.1

Download the FSP with e2 studio Windows installer for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.exe, from here.

Download the FSP with e2 studio Linux AppImage for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.AppImage, from here. Refer to https://en-support.renesas.com/knowledgeBase/19934358 for information on installing e2 studio and related software components in a Linux PC.

Download the FSP with e2 studio macOS (Apple Silicon) installer for this release, setup_fsp_v5_2_0_e2s_v2024-01.1.pkg, from here.

If using IAR or Keil MDK, download the Renesas Advanced Smart Configurator for this release, setup_fsp_v5_2_0_rasc_v2024-01.1.exe, from here.

All installers are available in the Assets section of this release.

Refer to the README.md in the FSP root folder for setup instructions, hardware details, and related links.

Tools

Arm GNU Toolchain: 13.2

LLVM Embedded Toolchain for Arm: 17.0.1

IAR Compiler: 9.50.1

ARM Compiler: 6.21

QE for Capacitive Touch: 3.3.0 or higher

QE for Display: 3.2.0

Renesas E2 and E2 Lite: 2.1.3

SEGGER J-Link: 7.94g

Important Information for RA0E1 Development

FSP v5.2.0 includes support for the upcoming RA0E1 MCU. For developers using this MCU, please note the following important improvements and known issues:

Improvements

The space between the vector table (at 0x0) and option setting memory (at 0x400) is now automatically filled with a preselected set of BSP functions. This functionality can be changed via the new 'Fill flash gap' BSP property.
- The functions placed in the section have been selected based on -Oz (aggressive size) optimization. When using other optimization levels this function may need to be disabled.
- When disabled, the space can be filled with user code/data by placing items in the .flash_gap section.
The FSP development team is currently analyzing all RA0E1 drivers to identify additional areas where code size savings can be made. Significant optimizations will continue to be made in coming releases

Known Issues

RA0E1 e2 studio projects currently automatically reset compiler optimization to -Oz (aggressive size optimization) when generating or compiling. To override this behavior, manually add the desired optimization flag(s) (e.g. -O0) to the 'Other optimization flags' box in the project Properties.
The LPM module is not yet supported.
The following sensors are currently not supported:
- HS400x
- ZMOD4xxx
- OB1203

Features

Support for new devices:
- RA2A2 MCU
- RA0E1 MCU
Support for new development kits:
- EK-RA2A2
- FPB-RA0E1
Support updated part numbers for RA2E1
USB Host Composite CDC + MSC support
Added new 'Using Registers Directly' guide to usage notes
RSIP-E51A Protected Mode support

Fixes and Improvements

Platform installer updated to include e2 studio 2024-01.1
Platform installer for MacOS
IAR compiler version updated to 9.50.1
Arm compiler version updated to 6.21
Segger J-Link version updated to 7.94g
Segger emWin version updated to 6.36
E2 and E2 Lite version updated to 2.1.3
Common FSP API support updated to v1.3.0
Resolved issues in SCE5 and SCE5_B cryptographic procedures
All peripherals now set to Secure by default in Flat projects
Fixed build warning when using FreeRTOS Heap in IAR EW projects
Added missing ADC_B Developer Assistance entries
Updated to support 0 length data for GCM AAD. Cleaned up documentation and error condition checks. Added more examples for CCM and CMAC.
SCE5 & SCE5_B security updates
Improved r_ble API usage note about L2CAP CBFC Channel connection parameters
USB Changes
- Fixed DMA src/dest address in configurator generated code
- Improved an error message when enabling continuous transfer mode on Full-Speed
- Improved timeout process for USBX PCDC
- Fixed configuration issue related to interrupt priority and Battery Charging on Hi-Speed
- Fixed memory corruption when USB related interrupt configuration is set to Not Supported
- Fixed USB HMSC setup failure on Hi-Speed

Known Issues

RA0E1:
- e2 studio projects automatically reset compiler optimization to a Size setting on every generate or build operation
  - Add optimization flags (e.g. -O0) manually to 'Other optimization flags' to override the -Oz setting
- The LPM module is not supported
- HS400x, ZMOD4xxx and OB1203 sensors cannot be used on RA0E1
EWARM support for RA2A2, RA0E1
- EWARM version 9.50.1 does not contain support for RA2A2, RA0E1. To develop for these devices, It will be necessary to Install support patch files (arm_Renesas_RA2A2_patch_20230302_1.zip,arm_Renesas_RA0E1_patch_20240103_1.zip) which can be downloaded by EWARM v9.50.1 users from the IAR MyPages system.
AGTW event not being properly output as activation source
DTC events are shown for selection that are not configured as interrupts