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Update/extend library elements with file format 1.0 data #13

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merged 5 commits into from
Aug 30, 2023

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@ubruhin ubruhin commented Aug 29, 2023

SUMMARY
  • Set manufacturer name of library
  • Rename packages according IPC recommendation
  • Specify package assembly types & pad functions
  • Add package outline polygons & courtyards where missing
  • Add MPNs to devices
  • Approve "missing 3D models" warnings
  • CI: Run library checks since all warnings are now resolved.
DATASHEETS / REFERENCES

N/A

OPEN QUESTIONS / UNRESOLVED ISSUES

None

CHECKLIST
  • I have read and followed the library conventions¹.
  • For packages, I followed IPC7351C (see details in library conventions).
  • For modified elements, I bumped their version number².
  • I already used the new library elements in a design and verified their correctness (optional).
  • I'm the copyright owner of the added content (i.e. the changes are made by myself, not copied/imported from somewhere else).
  • I agree to publish all my changes under the CC0 Public Domain License³, allowing everyone to use and modify the content without any restrictions.

¹ Library Conventions: https://docs.librepcb.org/#libraryconventions
² Minor version bump if only metadata was modified (e.g. "0.1" -> "0.1.1"), major version bump if functional changes were made (e.g. "0.1" -> "0.2")
³ CC0 Public Domain License: https://en.wikipedia.org/wiki/CC0

@ubruhin ubruhin added ready for review Waiting for review by maintainers. enhancement Improving an existing library element. labels Aug 29, 2023
@ubruhin ubruhin merged commit be2e64c into master Aug 30, 2023
2 checks passed
@ubruhin ubruhin deleted the rework-for-1.0 branch August 30, 2023 22:33
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enhancement Improving an existing library element. ready for review Waiting for review by maintainers.
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