FLASH Add W25M homogeneous stack driver and W25M512 support #5722
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DieHertz
reviewed
Apr 19, 2018
src/main/drivers/flash_w25m.c
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| int dieNumber = address / dieSize; | ||
| uint32_t dieAddress = address % dieSize; | ||
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| if (dieAddress + rlen > dieSize) { |
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I would probably rewrite this to:
tlen = MIN(dieAddress + rlen, dieSize) - dieAddress
DieHertz
previously approved these changes
Apr 19, 2018
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@jflyper What chip package you were using for your development? I thought there was one pin compatible with one of existing NOR chips used on FCs. |
mikeller
requested changes
Apr 19, 2018
src/main/drivers/flash_w25m.c
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| rbytes = dieDevice[dieNumber].vTable->readBytes(&dieDevice[dieNumber], dieAddress, buffer, tlen); | ||
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| if (!rbytes) { | ||
| debug[0]++; |
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This will have to be changed to use DEBUG_SET() or removed, or else it will break other debug modes.
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| #include "pg/flash.h" | ||
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| #define W25M_INSTRUCTION_SOFTWARE_DIE_SELECT 0xC2 |
jflyper
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mikeller
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Apr 20, 2018
mikeller
requested changes
Apr 20, 2018
src/main/drivers/flash_w25m.c
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| for (rlen = length; rlen; rlen -= tlen) { | ||
| int dieNumber = address / dieSize; | ||
| uint32_t dieAddress = address % dieSize; | ||
| tlen = MIN(dieAddress + rlen, dieSize) - dieAddress |
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Now this needs to include common/maths.h.
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Ouch!!! (And a semi-colon...)
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mikeller
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The homogeneous stack driver provides support for Winbond W25M series spistack flash chips that are stacks of same sized dies.
W25M512JV ( = 2 x W25Q256JV )
https://www.winbond.com/resource-files/w25m512jv%20revc%2001062017.pdf
Note:
Support for W25M02G will be provided by the W25M homogeneous mode driver once W25N01G is added.