Releases · telink-semi/tl_ble_mesh

01 Nov 14:02

mwchen269

V4.2.0.1

712d7fd

Release V4.2.0.1 Latest

Latest

V4.2.0.1(PR)

Version

SDK Version: tl_ble_mesh_V4.2.0.1
Chip Version:
- TLSR921X(B91): A2
- TL321X: A1
Hardware EVK Version:
- TLSR921X: C1T213A20_V1.3
- TL321X: C1T331A20_V1.0/C1T335A20_V1.0
Platform Version:
- tl_ble_sdk V4.0.4.2
Toolchain Version:
- TLSR921X: TL32 ELF MCULIB V5F GCC7.4 (IDE: TelinkIoTStudio_V2024.8)
- TL321X: TL32 ELF MCULIB V5 GCC12.2 (IDE: TelinkIoTStudio_V2024.8)

Features

Supported TL321X A1 chip
- (Firmware)add Flash protection, set APP_FLASH_PROTECTION_ENABLE to 1 to enable, it's enabled by default.
  - Flash protection is enabled by default, and it must be enabled in production.
  - During the development phase, user should click the "Unlock" button in Telink BDT tool to unlock before erase/write the Flash.
- (Firmware)each mesh nodes can be connected by up to three masters.
- (Firmware)add TL321X_mesh_LPN with suspend/deepsleep_retention mode.
- (Firmware)add TL321X_mesh_switch with suspend/deepsleep_retention mode.
Android/iOS
- add support to modify cloud URL.
- optimize fast provision function, add logs during fast provisioning.
- add support App to connect specified node.

Bug Fixes

fix the following issue by moving proxy filter initial function from connection callback to disconnection callback: ‌
When both Phone A and Phone B connecting with node C, if Phone A disconnects and connects to node D, Phone A will fails to get the status of node C.

Known issues

TL321X_mesh_gw do not support USB mode currently, use uart mode by default.

Performance Improvements

BREAKING CHANGES

Notes

debugging tools: such as sig_mesh_tool.exe and Android apk, please make sure to use the tools of this release.
to avoid compilation errors or loss of functionality, please update all files when upgrading the SDK.
for the release note contents of the BLE SDK and Driver SDK mentioned in "Version", please refer to the release note files of related SDKs.
support SIG Mesh single connection app TelinkBleMesh.

Flash

TLSR921X
- P25Q80U
- P25Q16SU
- P25Q32SU
TL321X
- P25Q80U
- P25Q16SU

CodeSize

TLSR921X
- B91_mesh(default target)
  - Flash bin size: 156.0KB
  - IRAM size: 58.9KB
  - DRAM size: 4KB stack
- B91_mesh_gw(default target)
  - Flash bin size: 155.2KB
  - IRAM size: 63.2KB
  - DRAM size: 4KB stack
- B91_mesh_lpn(default target)
  - Flash bin size: 150.4KB
  - IRAM size: 52.5KB
  - DRAM size: 4KB stack
- B91_mesh_switch(default target)
  - Flash bin size: 142.4KB
  - IRAM size: 53.5KB
  - DRAM size: 4KB stack
TL321X
- TL321X_mesh(default target)
  - Flash bin size: 161.5KB
  - IRAM size: 60.4KB
  - DRAM size: 4KB stack
- TL321X_mesh_gw(default target)
  - Flash bin size: 161.0KB
  - IRAM size: 65.2KB
  - DRAM size: 4KB stack
- TL321X_mesh_lpn(default target)
  - Flash bin size: 155.2KB
  - IRAM size: 54.3KB
  - DRAM size: 4KB stack
- TL321X_mesh_switch(default target)
  - Flash bin size: 145.6KB
  - IRAM size: 54.3KB
  - DRAM size: 4KB stack

Version

SDK Version: tl_ble_mesh_V4.2.0.1
Chip Version:
- TLSR921X(B91): A2
- TL321X: A1
Hardware EVK Version:
- TLSR921X: C1T213A20_V1.3
- TL321X: C1T331A20_V1.0/C1T335A20_V1.0
Platform Version:
- tl_ble_sdk V4.0.4.2
Toolchain Version:
- TLSR921X: TL32 ELF MCULIB V5F GCC7.4 (IDE: TelinkIoTStudio_V2024.8)
- TL321X: TL32 ELF MCULIB V5 GCC12.2 (IDE: TelinkIoTStudio_V2024.8)

Features

支持 TL321X A1 芯片
- (Firmware)添加Flash保护，设置 APP_FLASH_PROTECTION_ENABLE 等于 1来使能该功能，默认打开。
  - SDK 中默认开启 Flash 保护，在量产时必须启用。
  - 在开发阶段，用户在擦写Flash前应使用Telink BDT工具中的“Unlock”命令解锁Flash。
- (Firmware)每个mesh节点支持最多3个master同时连接。
- (Firmware)添加TL321X_mesh_LPN，具备suspend/deepsleep_retention休眠模式。
- (Firmware)添加TL321X_mesh_switch，具备suspend/deepsleep_retention休眠模式。
Android/iOS
- 支持可编辑云端地址。
- 优化fast provision功能， UI上添加更多provision过程信息显示。
- 支持App连接指定的节点。

Bug Fixes

将代理列表初始化从连接回调中移到断开连接回调修复以下问题：
当手机A和手机B同时连接到节点C时，如果手机A断开连接并连接到节点D，手机A将无法获取节点C的状态。

Known issues

TL321X_mesh_gw 暂不支持usb模式，默认使用串口模式。

Performance Improvements

BREAKING CHANGES

Notes

调试工具：比如sig_mesh_tool.exe和APP 安装包文件，请务必使用本次release的版本。
为避免编译错误以及功能丢失，升级SDK时，请确认更新全部SDK文件。
“Version”里面提到的BLE SDK和Driver SDK的release note内容，请查阅对应SDK的release note文件。
支持SIG Mesh单连接app TelinkBleMesh。

Flash

TLSR921X
- P25Q80U
- P25Q16SU
- P25Q32SU
TL321X
- P25Q80U
- P25Q16SU

CodeSize

TLSR921X
- B91_mesh(default target)
  - Flash bin size: 156.0KB
  - IRAM size: 58.9KB
  - DRAM size: 4KB stack
- B91_mesh_gw(default target)
  - Flash bin size: 155.2KB
  - IRAM size: 63.2KB
  - DRAM size: 4KB stack
- B91_mesh_lpn(default target)
  - Flash bin size: 150.4KB
  - IRAM size: 52.5KB
  - DRAM size: 4KB stack
- B91_mesh_switch(default target)
  - Flash bin size: 142.4KB
  - IRAM size: 53.5KB
  - DRAM size: 4KB stack
TL321X
- TL321X_mesh(default target)
  - Flash bin size: 161.5KB
  - IRAM size: 60.4KB
  - DRAM size: 4KB stack
- TL321X_mesh_gw(default target)
  - Flash bin size: 161.0KB
  - IRAM size: 65.2KB
  - DRAM size: 4KB stack
- TL321X_mesh_lpn(default target)
  - Flash bin size: 155.2KB
  - IRAM size: 54.3KB
  - DRAM size: 4KB stack
- TL321X_mesh_switch(default target)
  - Flash bin size: 145.6KB
  - IRAM size: 54.3KB
  - DRAM size: 4KB stack

Assets 2

05 Jul 06:21

mwchen269

V4.2.0.0

98d4f8f

Release V4.2.0.0

V4.2.0.0(PR)

Version

SDK Version: tl_ble_mesh_V4.2.0.0
Chip Version: TLSR921X/951X
BLE Version: telink_b91m_ble_multiple_connection_sdk_V4.0.3.0_beta(SHA-1: d64b1a385eb2a604a8ccfa4bf12d15e8ee2b8713)

Features

(Firmware)add Flash protection.
- Flash protection is enabled by default, and it must be enabled in production.
- During the development phase, user should click the "Unlock" button in Telink BDT tool to unlock before erase/write the Flash.
(Firmware)each mesh nodes can be connected by up to three masters.
(Firmware)add B91_mesh_LPN with suspend/deepsleep_retention mode.
(Firmware)add B91_mesh_switch with suspend/long deepsleep_retention mode.
(Firmware/Android/iOS)support all features of mesh V1.1, mainly include:
- enhance provision auth: set PROV_EPA_EN to 1 to enable. enable by default.
- remote provision: provision the unprovision devices within one-hop or multi-hops. set MD_REMOTE_PROV to 1 to enable. disabled by default.
- device firmware update: Upgrade the firmware of multiple nodes simultaneously through mesh. set MD_MESH_OTA_EN to 1 to enable. disabled by default.
- directed forwarding: set MD_DF_CFG_SERVER_EN to 1 to enable. disabled by default.
- certificate-base provisioning: set CERTIFY_BASE_ENABLE to 1 to enable. disabled by default.
- private beacons: set MD_PRIVACY_BEA and PRIVATE_PROXY_FUN_EN to 1 to enable. disabled by default.
- subnet bridge: set MD_SBR_CFG_SERVER_EN to 1 to enable. disabled by default.
- Opcodes Aggregator: aggregate multiple messages into a single message to send. set MD_OP_AGG_EN to 1 to enable. disabled by default.
- NLC profiles: Network Lighting Control profiles. set one of NLCP_BLC_EN, NLCP_DIC_EN, NLCP_BSS_EN, NLCP_TYPE_ALS, NLCP_TYPE_OCS and NLCP_TYPE_ENM to 1 to enable the corresponding NLC profile. disabled by default.

Bug Fixes

Known issues

not support mesh audio currently.
use Telink_RDS_v323 IDE to compile, not support Telink IoT studio IDE currently.

Performance Improvements

BREAKING CHANGES

Notes

debugging tools: such as sig_mesh_tool.exe and Android apk, please make sure to use the tools of this release.
to avoid compilation errors or loss of functionality, please update all files when upgrading the SDK.
for the release note contents of the BLE SDK and Driver SDK mentioned in "Version", please refer to the release note files of related SDKs.
support SIG Mesh single connection app TelinkBleMesh.

Flash

P25Q80U
P25Q16SU
P25Q32SU

CodeSize

B91_mesh(default target)
- Flash bin size: 155.0KB
- IRAM size: 57.5KB
- DRAM size: 4KB stack
B91_mesh_gw(default target)
- Flash bin size: 154.5KB
- IRAM size: 62.0KB
- DRAM size: 4KB stack
B91_mesh_lpn(default target)
- Flash bin size: 150.7KB
- IRAM size: 52.5KB
- DRAM size: 4KB stack
B91_mesh_switch(default target)
- Flash bin size: 143.2KB
- IRAM size: 53.8KB
- DRAM size: 4KB stack

Version

SDK Version: tl_ble_mesh_V4.2.0.0
Chip Version: TLSR921X/951X
BLE Version: telink_b91m_ble_multiple_connection_sdk_V4.0.3.0_beta(SHA-1: d64b1a385eb2a604a8ccfa4bf12d15e8ee2b8713)

Features

(Firmware)添加Flash保护，设置 APP_FLASH_PROTECTION_ENABLE 等于 1来使能该功能，默认打开。
- SDK 中默认开启 Flash 保护，在量产时必须启用。
- 在开发阶段，用户在擦写Flash前应使用Telink BDT工具中的“Unlock”命令解锁Flash。
(Firmware)每个mesh节点支持最多3个master同时连接。
(Firmware)添加B91_mesh_LPN，具备suspend/deepsleep_retention休眠模式。
(Firmware)添加B91_mesh_switch，具备suspend/long deepsleep_retention模式。
(Firmware/Android/iOS)支持 mesh V1.1 的所有功能，主要包含：
- enhance provision auth：组网认证增强，设置 PROV_EPA_EN 等于 1来使能该功能，默认打开。
- remote provision：把距离provisioner一跳及多跳的未配网设备都能添加到网络中。设置 MD_REMOTE_PROV 等于 1来使能该功能，默认关闭。
- device firmware update：通过mesh方式对多个节点同时进行固件升级，设置 MD_MESH_OTA_EN 等于 1来使能该功能，默认关闭。
- directed forwarding：路由功能，设置 MD_DF_CFG_SERVER_EN 等于 1来使能该功能，默认关闭。
- certificate-base provisioning：基于证书认证的组网模式，设置 CERTIFY_BASE_ENABLE 等于 1来使能该功能，默认关闭。
- private beacons：私有信标，设置 MD_PRIVACY_BEA 和 PRIVATE_PROXY_FUN_EN 等于 1来使能该功能，默认关闭。
- subnet bridge：子网桥接，设置 MD_SBR_CFG_SERVER_EN 等于 1来使能该功能，默认关闭。
- Opcodes Aggregator：多个消息组合成一条消息的功能，设置 MD_OP_AGG_EN 等于 1来使能该功能，默认关闭。
- NLC profiles: Network Lighting Control profiles, 分别设置 NLCP_BLC_EN, NLCP_DIC_EN, NLCP_BSS_EN, NLCP_TYPE_ALS, NLCP_TYPE_OCS, NLCP_TYPE_ENM 等于 1来使能对应功能，默认关闭。

Bug Fixes

Known issues

暂不支持mesh audio。
用Telink_RDS_v323 IDE编译，暂不支持Telink IoT studio IDE。

Performance Improvements

BREAKING CHANGES

Notes

调试工具：比如sig_mesh_tool.exe和APP 安装包文件，请务必使用本次release的版本。
为避免编译错误以及功能丢失，升级SDK时，请确认更新全部SDK文件。
“Version”里面提到的BLE SDK和Driver SDK的release note内容，请查阅对应SDK的release note文件。
支持SIG Mesh单连接app TelinkBleMesh。

Flash

P25Q80U
P25Q16SU
P25Q32SU

CodeSize

B91_mesh(default target)
- Flash bin size: 155.0KB
- IRAM size: 57.5KB
- DRAM size: 4KB stack
B91_mesh_gw(default target)
- Flash bin size: 154.5KB
- IRAM size: 62.0KB
- DRAM size: 4KB stack
B91_mesh_lpn(default target)
- Flash bin size: 150.7KB
- IRAM size: 52.5KB
- DRAM size: 4KB stack
B91_mesh_switch(default target)
- Flash bin size: 143.2KB
- IRAM size: 53.8KB
- DRAM size: 4KB stack

Assets 2

Releases: telink-semi/tl_ble_mesh

Release V4.2.0.1

V4.2.0.1(PR)

Version

Features

Bug Fixes

Known issues

Performance Improvements

BREAKING CHANGES

Notes

Flash

CodeSize

Version

Features

Bug Fixes

Known issues

Performance Improvements

BREAKING CHANGES

Notes

Flash

CodeSize

Release V4.2.0.0

V4.2.0.0(PR)

Version

Features

Bug Fixes

Known issues

Performance Improvements

BREAKING CHANGES

Notes

Flash

CodeSize

Version

Features

Bug Fixes

Known issues

Performance Improvements

BREAKING CHANGES

Notes

Flash

CodeSize