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Sprung FEA v0.1

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@kylebme kylebme released this 04 Oct 23:07

Sprung FEA's first release: a local desktop workspace for stress, vibration and heat analysis of STEP parts and bonded assemblies.

Features

  • Linear static analysis, natural frequencies, buckling, heat transfer, thermal stress and harmonic response.
  • Face-based supports and loads, material presets, automatic meshing and mesh convergence studies.
  • Interactive stress/displacement contours, animated modes, point probing, section planes, iso-surfaces and thresholds.
  • Portable .sfea projects, autosave, undo/redo and result exports.
  • Gmsh and CalculiX are bundled; meshing and solving happen on your computer.

Install

Download the installer for your platform from Assets below. The release tag is v0.1; the application and installer version is 0.1.0.

Platform Download Installation
macOS, Apple Silicon Sprung-FEA-0.1.0-arm64.dmg Open the DMG and drag Sprung FEA to Applications.
Windows, x64 Sprung-FEA-Setup-0.1.0.exe Run the installer; it installs for your user without administrator rights.
Linux, x64 Sprung-FEA-0.1.0-x86_64.AppImage Make it executable with chmod +x Sprung-FEA-0.1.0-x86_64.AppImage, then run it.

These builds are unsigned (macOS is ad-hoc signed, without notarization). On macOS, use System Settings → Privacy & Security → Open Anyway after the first launch is blocked. On Windows, use More info → Run anyway if SmartScreen appears.

Validation and source

Built from commit 70a3d06266f2f366514ba738448cce86715c27c4 in Build run 37224545554. All three platforms passed static and frequency solves using only the packaged engine and solver; the static beam tip movement was 0.2881 mm on every platform.

Sprung-FEA-v0.1-sources.tar.gz contains application and upstream source archives, build recipes, patches, the build log and a source manifest. SHA256SUMS.txt contains checksums for the installers and source bundle.

See the README for a first study and the validation report for numerical checks and limitations. This release uses tetrahedral solids and bonded assemblies; it does not support sliding/separating contact, shells/beams or transient analyses.