Diffusion Current Transients from Spherical Cap Theory During Electrocrystallization
Evans' theory describes the current transient behavior during metal electrodeposition, considering the influence of nucleation rate and diffusion-controlled growth. The number of nucleation sites follows an exponential activation law, while the active surface area expands with a diffusion-limited radius. The transient current follows:
where (
The Avrami theory models the time-dependent surface coverage during electrocrystallization, considering nucleation rate, growth kinetics, and diffusion overlap. The fraction of the electrode covered by diffusion zones is:
where:
- ( b ) depends on nucleation site density,
- ( d(\theta) ) accounts for contact angle effects.
The current density follows:
This reflects diffusion-limited growth of nuclei.
- Avrami: Nucleation + Growth, considers surface coverage evolution.
- Evans: Diffusion-controlled deposition, no explicit nucleation model.
The Avrami–Evans–Kolmogorov (AEK) theorem extends the classical Avrami and Kolmogorov phase transformation theories to electrocrystallization by incorporating diffusion effects (Evans’ contribution). This framework is particularly useful for describing the time-dependent nucleation and growth of metal deposits on an electrode surface.
Key aspects of the AEK theorem in electrocrystallization:
- Surface Coverage ( S ): Describes the fraction of the electrode covered by growing nuclei, incorporating nucleation, growth, and diffusion:
where:
-
$b$ depends on the nucleation site density ($N_0$ ) and diffusion coefficient ($D$ ), -
$d(\theta)$ is a shape factor accounting for the effect of contact angle, -
$\Theta(At)$ accounts for the transient nucleation dynamics.
- Current Density ( I ): The electrochemical current transient follows:
where
The (AEK) Key Equations in a nutshell:
where:
- (
$b$ ) is a parameter influenced by nucleation site density and diffusion coefficient, - ($d(\theta)$) is a shape factor that accounts for contact angle effects,
- ($\Theta(At)$) represents transient nucleation kinetics,
- (
$a = \frac{n F D^{1/2} c}{\pi^{1/2}}$ ) is the prefactor controlling mass transport.
- Incorporates Diffusion Effects (Evans’ Contribution)
- Accounts for Surface Coverage Evolution (Avrami–Kolmogorov)
- Applies to Electrochemical Deposition (e.g., Ag, Li, Mg deposition)
| Theory | Description | Surface Coverage | Diffusion Effects |
|---|---|---|---|
| Kolmogorov | Random nucleation model | No explicit diffusion | No |
| Avrami | Nucleation + Growth | Includes surface coverage | No |
| Evans | Diffusion-limited deposition | No nucleation model | Yes |
| AEK | Combines all three for electrocrystallization | Yes | Yes |
Contact Info:
- Email: attari.v@tamu.edu
- Department of Materials Science and Engineering



