Add to thermal: emissivity (0-1, critical for cryogenic radiation shielding budgets — polished Al ≈ 0.04, anodized ≈ 0.8), thermal_diffusivity (mm²/s), min_use_temp_K + cryogenic_compatible (bool — Delrin/PEEK get brittle below ~-50 C), integrated_thermal_conductivity (W/m, ∫k dT, NIST style for cryo heat-leak), latent_heat_fusion / latent_heat_vaporization (kJ/kg, for liquids/coolants).
Add to
thermal:emissivity(0-1, critical for cryogenic radiation shielding budgets — polished Al ≈ 0.04, anodized ≈ 0.8),thermal_diffusivity(mm²/s),min_use_temp_K+cryogenic_compatible(bool — Delrin/PEEK get brittle below ~-50 C),integrated_thermal_conductivity(W/m, ∫k dT, NIST style for cryo heat-leak),latent_heat_fusion/latent_heat_vaporization(kJ/kg, for liquids/coolants).