ma N 2405 ~0.5um

by Erik Palesch (erikpalesch@gmail.com)

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1. Spin coat ma-N 2405 (0.5 μm)

    3000 RPM for 33 s
    Ramp: 1000 RPM/s for 3 s  
   

2. Soft bake

    90 °C for 90 s 
   

3. Exposure

    Features: Areas
    HV: 100 kV
    Current: 500 pA
    Dose: 700 μC/cm^2
   

4. Post-exposure bake

    None.
   

5. Develop

    ma-D 525 for ~ 60 s (gently agitating from side to side in two orthogonal directions)
    Rinse in DI water for 30 s
    Dry with N2(g)
   

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This process was done on STS Elionix EBL system. It should work for areas from 100 nm to 1 um in dimension. Use the Beamer SW or another one with PEC to obtain good results when working with many objects close to each other. Very clean sample required, o-zone cleaning should follow after solvent cleaning. Use at least 600 ul for spin-coating of 2 inch wafer. Clean the backside of the wafer with swab soaked in suitable solvent if there is remaining resist.