A portable, open-source e-book reader built around the ESP32-C6 microcontroller, featuring an energy-efficient E-Paper display, microSD storage, environmental sensing, and a comprehensive power management system.
The architecture focuses on a high-efficiency 3.3V power rail and shared communication buses (SPI/I2C):
- ESP32-C6 – Main MCU managing UI, file systems, and wireless connectivity.
- E-Paper Display – 1.5" (200x200px) ultra-low-power screen.
- Power Management – Includes the XC6220 1A LDO for 3.3V regulation and MCP73831 for Li-Po charging.
- Battery Monitoring – MAX17048G+T10 fuel gauge for precision voltage and SoC tracking.
- RTC (DS3231SN) – Real-time clock with a CPH3225A Supercapacitor for power backup.
- BME680 Sensor – Integrated environmental sensing (Temp, Humidity, Pressure, Gas).
- External Flash (64MB) – Winbond W25Q512 for extended storage and caching.
Access the full list of components used in this design, including technical specifications and sourcing links:
Access the Bill of Materials (CSV)
The system supports primary power via USB-C (5V). Charging is handled by the MCP73831 controller. A high-performance XC6220A331MR-G LDO regulator converts the input/battery voltage to a stable 3.3V to power the ESP32 and peripherals. Circuit protection includes a USBLC6-2SC6Y ESD protector and several PGB1010 varistors.
- MicroSD Card (J4): SPI-based interface for external library storage.
- NOR Flash (U1): 512Mb (64MB) SPI flash memory for firmware extensions.
| Function | ESP32-C6 Pins | Notes |
|---|---|---|
| MicroSD Card | IO2, IO3, IO4, IO5 | SPI |
| E-Paper Display | IO8, IO9, IO10 | SPI |
| Shared I2C Bus | IO6 (SCL), IO7 (SDA) | BME680, RTC, and Fuel Gauge |
| External Flash | IO0, IO1, IO2 | SPI (Shared Bus) |
| Reset Button | IO9 | Reset functionality |
| UI Button (Change) | IO10 | Navigation/Mode control |
| UART Debug | IO20 (TX), IO21 (RX) | Serial communication |
All design-related documentation is located in the Images/ directory:
- SMD Hole Errors: Two minor SMD hole warnings were manually approved during the PCB routing phase. These were verified as non-critical for the final manufacturing.
- All SMD components are 0402 package size (unless specified).
- Optimized for single-side component placement (Top-layer).
- Implemented via stitching and dual-layer ground planes for thermal/EMC stability.
- RF Isolation: The ESP32 antenna area is kept clear of copper and traces.
- Passed all Design Rule Checks (DRC) and Electrical Rule Checks (ERC).
- Designed the full ESP32-C6 pinout across SPI and I²C buses, integrating the E-Paper display, BME680 sensor, RTC, fuel gauge, NOR flash, and microSD card on shared communication lines.
- Managed the PCB routing phase in Autodesk Fusion 360, resolving DRC and ERC violations and manually approving non-critical SMD hole warnings after physical verification.
- Implemented dual-layer ground planes with via stitching for thermal and EMC stability, and maintained RF isolation by keeping the ESP32 antenna area clear of copper and traces.
This is a 3rd-year TSC course assignment, designed in Autodesk Fusion 360 using a student license.
This project is licensed under the GPL-3.0 license.