A custom 4-layer PCB integrating ESP32, sensor suite & analog front-end
YouTube: Design & assemble the 4-layer ESP32 IoT PCB
This project presents the end-to-end design, layout, fabrication and testing of a custom 4-layer printed circuit board (PCB) built around the ESP32 microcontroller. The board integrates multiple sensors and analog front-end components to facilitate IoT, sensing and embedded systems prototypes.
- ESP32 WiFi/Bluetooth microcontroller (as the main compute node)
- Amplified microphone input for audio sensing
- BME280 module (temperature, pressure, humidity)
- Photocell / photorésistance for light sensing
- 4-layer PCB stack-up with dedicated power and ground planes for improved signal integrity and noise performance
- Full schematic capture and layout in KiCad (or Altium Designer if you used it)
- 4-layer routing: inner power/ground planes, optimized trace widths, controlled-impedance/clearance where required
- Careful placement and routing of analog front-end (microphone + amplifier) with respect to power & ground to minimise noise
- Testing and validation of all Input/Output (E/S) signals: sensor data acquisition, digital communications (UART, I²C, SPI)
- Serial communication validation with ESP32 to ensure correct sensor data capture and transmission
- PCB design: KiCad (or Altium Designer)
- Microcontroller: ESP32 (firmware written in C/C++ using ESP-IDF or Arduino framework)
- Sensors: BME280, microphone + amplifier, photorésistance
- Protocols & interfaces: I²C, SPI, UART, WiFi/Bluetooth
- Production & testing: board fabrication, assembly, signal validation, functional testing
schematic/– Folder containing the PCB schematic fileslayout/– Folder for PCB layout/copper layer filesfirmware/– ESP32 code (data acquisition, sensor reading, serial output)docs/– Design notes, BOM (bill of materials), stack-up description, test resultsimages/– Photos of assembled board, test setup, sensors, measurements
This board is ideal for:
- IoT sensor nodes (environmental monitoring, audio sensing)
- Prototyping connected devices with multiple sensing modalities
- Embedded systems coursework or rapid prototyping for research
- Integration in robotics, wearables, smart home systems
Possible future enhancements include:
- Integration of LoRa or LTE-M/NB-IoT communication for long-range connectivity
- Addition of power-management (e.g., battery, solar) for off-grid sensing nodes
- Enclosure design and industrialisation for deployment
- Firmware enhancement: edge-processing, machine-learning inference on-board
This project is released under the MIT License. Feel free to use, adapt or remix the design for your own work.
Marwen Mekni — Electrical Engineering student (Embedded Systems & IoT), with strong experience in embedded software, hardware design and IoT system integration.
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📧 mekni0845@gmail.com