FDM Appendices

FDM Polymers — A Technical Reference ›

Appendices

Cross-polymer property comparison tables, the author's bench-measured calibration profiles for a representative prosumer setup, an alphabetical brand index keyed to chapter references, and the consolidated source list for data values cited throughout the volume.

Appendix A — Master cross-polymer property comparison

Consolidated property tables across the polymer families in this volume. Values are typical FDM-printed-specimen envelopes from manufacturer TDS data, biased toward XY-direction tensile and modulus values where vendors publish them. Specific filament brands and batches will vary within each polymer's range by 10–25%. Cross-reference the per-polymer chapter for engineering decisions.

A.1 Thermal envelope

Polymer	Tg(°C)	Tm(°C)	HDT @ 0.45 MPa (°C)	Continuous service (°C)
PLA	55–65	150–170	55–60	50
PLA annealed (HTPLA)	55–65	150–170	~120	100
PETG	75–80	— (a)	70–75	60
PCTG	85–95	—	76–99	70
ABS	~105	—	90–98	80
ASA	~100	—	90–98	85
HIPS	90–100	—	85	70
PP unfilled	-10	160–170	85–100	60
PP-GF	-10	160–170	115–140	100
PP-CF	-10	160–170	115–160	100
PE / HDPE	-110	~130	50–60	60
PA6 (dry)	~55	215–225	150–170	80
PA66 (dry)	~70	255–265	180–200	100
PA12	~45	175–180	140–150	90
PA612	~50	210–220	150–160	100
PA11	~45	180–190	140–150	90
PPA (unfilled, filament)	~80	~230–260	75–85	70–90 (c)
PPA-CF (filament)	~80	~230–260	120–230 (c)	130–150 (c)
PC blend (general)	109–145	—	95–145	100
PC-CF	~113–142+	—	114–140	100–130
ESD-PC	143	—	135–138	120
PEI 9085-CF	186	—	180	170
PEI 1010-CF	217	—	210	~170 (RTI)
PEEK	143	343	160 / 240 annealed	250
PEKK-A (amorphous)	~165	—	160	150 (b)
PPS-CF	~90	~280	200+	180
PMMA	100–110	—	94	70
POM	-60	165–180	155–175	90
PVDF	-35	165–175	110	120
TPU 95A	—	~200	50–70	70
TPEE 55D	—	~200	90–110	110
PEBA 40D	—	~160	80–95	90
PVA / BVOH	n/p (d)	n/p	n/p	n/a — soluble supports, dissolved in service (Ch 20)
PVB	n/p (d)	n/p	n/p	cosmetic tier; low layer adhesion limits structural use (Ch 21)
PHA / PLA-PHA	n/p (d)	n/p	n/p	n/p — grade-dependent; see Ch 21
PCL	n/p (d)	~60	n/p	<40 — softens above 40 °C, loses dimensional stability above 50 °C (Ch 21)

_{Table A.1 — Thermal envelope across the polymer families covered in this volume. Continuous service temperature is derived from RTI/HDT data and creep behavior per polymer — there is no reliable T-offset formula — and is not the absolute upper limit, which is closer to Tg or HDT. Use this column for service-life calculations; use HDT for short-duration thermal events. (a) PETG is an amorphous copolyester with no true crystalline melting point; it is processed across a melt/processing range of roughly 230–250 °C rather than at a defined Tm. (b) The PEKK row is the amorphous grade (PEKK-A); semi-crystalline PEKK runs a higher continuous-service envelope of roughly 220–240 °C, as noted in §19.4. (c) The PPA rows give printable filament-grade values: commercial PPA filaments are printability-modified semi-aromatic copolymers with a melting point near 230–260 °C, well below the 290–320 °C of neat high-temperature PA6T/PA9T resins. PPA-CF HDT is strongly load- and anneal-dependent — roughly 120 °C at 1.80 MPa rising to ~190–230 °C at 0.45 MPa for annealed and process-tuned grades (vendor figures up to ~240 °C depending on test method; see Table 14.5) — so the filament datasheet should be read with the test basis in mind. The continuous-service figures reflect RTI-class data adjusted for grade: the low-crystallinity printability-modified unfilled grades are creep-limited near their ~80 °C Tg, while CF grades retain stiffness well above it; the 180–230 °C figures sometimes quoted for PPA-CF are short-term or annealed HDT values, not continuous service. (d) Support and niche polymers are listed for completeness: figures appear only where Chapters 20–21 document them, and n/p cells are deliberately left unpopulated rather than estimated — these materials are selected for function (solubility, post-formability, smoothability, compostability), not thermal envelope. Their process parameters are in Table A.3 and bed-adhesion guidance in Table 24.1.}

A.2 Mechanical envelope (XY-direction, dry as-printed)

Polymer	Density (g/cm3)	Tensile (MPa)	Modulus (GPa)	Elongation (%)	Notched Izod (kJ/m2)
PLA	1.24	50–70	3–4	3–8	2–4
PETG	1.23–1.27	40–50	1.9–2.1	8–25	4–8
PCTG	1.18–1.23	44–58	1.5–1.6	TDS up to ~220 (b)	~8–24 (b)
ABS	1.0–1.1	30–45	~2	10–40	15–25
ASA	1.05–1.1	30–45	~2	10–35	15–25
PP unfilled	0.90–0.91	15–25	1.0–1.4	100–600	5–15
PP-GF (15–30%)	1.05–1.15	30–50	2.0–3.0	3–10	7–12
PP-CF (15–30%)	0.91–1.00	25–45	2.0–4.0	3–6	10–15
PA6 dry	1.13	70–85	2.0–3.0	30 / 5 (Z)	5–8
PA12	1.01	45–55	1.1–1.5	30–80	4–6
PA6-CF (15–25%)	1.15	90–130	5–9	3–6	8–12
PPA-CF (15–20%)	~1.20	95–170	6–10	2–5	6–10
PC blend	~1.20	40–65	~2.0–2.5	6–80	50–80
PC-CF (10–15%)	~1.25	64–76	~5	~3	15–30
PPS-CF (10–20%)	~1.30	90–110	5–12	~2	~5
PEEK unfilled	1.30	90–100	3.5–4.0	30–50	5–7
PEEK-CF (15–30%)	1.35	130–170	12–15	~2	5–8
PMMA	1.18–1.20	60–75	3.0–3.5	2–5	~2
POM	1.4	65–75	2.5–3.0	10–30	6–8
PVDF	1.75–1.80	35–50	1.5–2.5	50–200	10–15
TPU 95A	1.20–1.25	30–45	~0.05	400–600	—
PEBA 40D	1.01	35–55	~0.08	400–700	—

_{Table A.2 — Mechanical envelope across the polymer families. Reinforced grades (CF, GF) carry the highest stiffness numbers but the lowest elongation and notched impact — the brittle/stiff trade is structural. Elastomer modulus values are reported low because the polymer flexes under test load; tensile strength remains useful as a relative metric even though elongation dominates elastomer applications. (b) PCTG elongation and notched-impact figures vary widely with resin grade, test method (ISO 180 Izod vs ISO 179 Charpy), specimen basis, and print orientation; the ~8–24 kJ/m² impact range spans vendor TDS values near the low end and independently measured flat-printed specimens near the high end. Treat these as orientation- and method-dependent, not single allowables. The support and niche polymers (PVA, BVOH, PVB, PHA, PCL) are omitted from this table deliberately: vendors do not publish printed-specimen mechanical data for them, and their selection axes are functional rather than mechanical — see Chapters 20–21.}

A.3 Process envelope

Polymer	Nozzle (°C)	Bed (°C)	Chamber	Drying	Tier
PLA	200–220	50–60	none	45–55 °C, 4–6 h (optional)	1
PETG	230–250	80–90	optional	60–70 °C, 4–6 h	1
PCTG	250–280	70–90	optional	65–70 °C, 4–6 h	2 (e)
ABS / ASA	240–270	95–110	enclosed	60–70 °C, 4–6 h	2
PP family	200–280	20–105	optional	unfilled: not required; GF/CF: follow TDS (some specify none; some 60–80 °C, 4–6 h)	1 (unfilled) / 2 (GF, CF)
PA12 / 612 / 11	245–275	60–90	open OK; passive beneficial	70–80 °C, 8–12 h	2
PA6 / 66	260–280	90–110	passive 40–50	80–90 °C, 10–16 h	2
PA-CF / GF	265–295	90–110	passive 40–50	90–110 °C, 8–10 h	2
PPA (unfilled)	275–310	80–110	passive 40–60	80–140 °C, 4–12 h (d)	3
PPA-CF / GF	280–320	90–120	active 55–65	80–140 °C, 4–12 h (d)	3
PC blend	270–290	100–115	passive 40–50	80–100 °C, 6–8 h	2
PC-CF / GF	275–300	100–115	passive 40–50	90–110 °C, 8–10 h	3
ESD-PC	270–300	110–120	passive 45–60	80–100 °C, 6–8 h	2
FR-PC	240–280	90–110	passive 40–50	60–80 °C, 4–16 h	2
PPS-CF	320–350	80–120	product-dependent: none (Polymaker, Flashforge) to 60–90 (Bambu)	per TDS: Bambu 100–140 °C, 8–12 h; Flashforge 120 °C, ≥8 h	3
PEI-CF	350–390	140–155	active 85+ (65 marginal)	130–150 °C, 4–6 h	3–4*
PEEK / PEKK	380–440	140–155	active 85+	120–130 °C, >=4 h	4
PMMA	240–270	100–110	enclosed	90 °C, 4–6 h	2
POM	210–230	100–115	optional + ventilation	80 °C, 4–6 h	2
PVDF	230–250	90–110	optional	80 °C, 4–6 h	2
TPU / TPE	220–260	40–70	optional	50–65 °C, 4–6 h	1 (f)
TPEE	230–250	50–70	optional	65–75 °C, 6–8 h	1
PEBA	225–250	50–60	optional	70–80 °C, 6–8 h	2
PVA / BVOH	195–225	50–65	none	45–60 °C, 8–12 h	1
PVB	215±10	70–80	none	45 °C, 8 h	1
PHA / PLA-PHA	200–220 (blends print PLA-like; pure PHA per vendor)	0–60 (some grades cold-bed)	none	per vendor TDS	1
PCL	85–95	20–30	none	rarely needed; keep well below Tm ~60 °C	1

_{Table A.3 — Process envelope and hardware tier across the polymer families. The tier column maps to the §4 hardware definitions: Tier 1 baseline desktop, Tier 2 engineering desktop, Tier 3 active-chamber engineering, Tier 4 ultra-high-temperature industrial (beyond prosumer scope). Filament selection outside the hardware's tier capability produces unreliable results. *PEI-CF straddles the Tier 3/Tier 4 boundary: it has been run marginally in 65 °C Tier 3 active chambers, but its 140–155 °C bed and 350–390 °C nozzle exceed the Tier 3 envelope defined in §4 (bed <=120 °C) and require Tier 4 thermal hardware. Treat it as boundary hardware, not standard Tier 3. (d) PPA drying guidance varies by brand: the upper end (~140 °C, 8–12 h) suits the higher-melting engineering PPAs such as Bambu PPA-CF, while the printability-modified grades such as Siraya Fibreheart PPA specify a milder 80–100 °C for 4–6 h and treat drying as needed only when moisture symptoms appear. Follow the spool's own datasheet rather than a single family schedule. (e) Mainstream PCTG grades specify 250–270 °C (Spectrum, Fiberlogy) up to 260–280 °C (Tritan-class 3D-Fuel) — above the Tier 1 nozzle ceiling, so Tier 2 hotend capability is required, though no enclosure. (f) The TPU/TPE window spans hardness grades: soft through 95A grades stay within the Tier 1 nozzle ceiling, while the 64D+ hard grades run up to 260 °C (Appendix B.2) and need Tier 2 hotend capability.}

Appendix B — Example calibrated filament profiles

Bench-measured calibration values for specific filaments, captured on a representative prosumer setup as worked examples of the §23 calibration workflow. These values are measured, not vendor-supplied; they should be treated as starting points for re-calibration on the reader's actual hardware rather than as universal values. Spool-to-spool drift of 5–10% on EM and PA is normal within the same brand and color.

B.1 Reference hardware setup All values below were measured on a single enclosed CoreXY prosumer printer with a 0.4 mm hardened-tip nozzle (PCD-tipped for the CF-loaded and abrasive grades, hardened steel for the unfilled engineering polymers), in an active-chamber configuration capable of 45–65 °C ambient. Per-spool drying was performed to the §3.5 protocol before each calibration. The calibrations reported here used the Califlower Mk2 XY-shrinkage methodology and the 12-sample wall measurement EM method described in §23.4. Where a different nozzle size was used (0.6 mm high-flow), it is noted in the per-profile entry.

B.2 Calibrated profiles (engineering polymers)

Filament	Nozzle (°C)	Bed (°C)	Max vol. (mm3/s)	EM	PA	XY shrink (%)
Prusament PC Blend	275	110	~10	1.045	0.025	—
Kexcelled K8 PC	270	105	~10	1.049	0.045	—
3D-Fuel Pro PCTG	265	85	~10	0.937	0.053	0.20
Spectrum PCTG Matte Black CF (0.4 mm)	245	85	11	0.960	tuned	0.20
Overture Easy Nylon (CoPA)	245	50	11	1.000	0.030	0.25
Polymaker Fiberon PA6-CF20	290	95	~9	0.898	tuned	0.20
iglidur I150-PF (tribological; base polymer undisclosed)	245	60	4	1.030	geometry-dependent (not converged)	—
Siraya Tech TPU 64D	260	45	5	0.970	tuned	—

_{Table B.1 — Bench-measured calibration profiles on a 0.4 mm PCD-tipped or hardened-steel nozzle. Bed surface varies by polymer family per §24; the values above assume the bed surface from that chapter's recommendation. Legend: “tuned” marks a value stored in the machine-side filament profile that is machine-specific and therefore not published as a portable number; “geometry-dependent (not converged)” means repeated calibration runs did not settle on a single value.}

One profile is deliberately excluded from the table as incomplete: Prusament ASA (nozzle 260 °C, bed 105 °C, max volumetric ~9.5 mm³/s, EM 1.030) was still in calibration at compilation — pressure advance and XY shrinkage are pending, and the row will join Table B.1 when the values converge.

B.3 Calibrated profiles (0.6 mm high-flow nozzle)

Filament	Nozzle (°C)	Bed (°C)	Chamber (°C)	Max vol. (mm3/s)	EM	PA
Overture ASA (0.6 mm HF)	265	95	45	14	tuned	0.025
Polymaker Fiberon PET-GF15 (0.6 mm HF)	290	80	55–60	13	tuned	0.030
Polymaker Fiberon PPS-CF10 (0.6 mm Diamondback)	350	120	55–65	~10	tuned	tuned

_{Table B.2 — 0.6 mm high-flow profiles where the larger nozzle was used instead of the 0.4 mm default. “Tuned” as in the Table B.1 legend. Overhang fan settings: 40% for PET-GF15 (reduces stringing on the longer-melt high-flow setup); 0% for ASA and PPS-CF (interlayer adhesion sensitive to cooling at this nozzle scale).}

B.4 Notes on workflow Pressure advance is best stored per-filament rather than as a single machine-wide value, so the correct compensation travels with the material instead of requiring a manual reset between filaments. Most firmware implementations expose a way to do this: a per-filament start-G-code command (for example, M900 K… on Marlin, M572 D0 S… on RepRapFirmware and Prusa Buddy firmware, or the SET_PRESSURE_ADVANCE macro on Klipper), or a per-filament field in the slicer profile on printers that manage the value in firmware. The profiles above were captured with the value in the filament start G-code; the reader should use whichever mechanism their own firmware and slicer provide. Skew correction, where the frame is measured out of square, is applied either in firmware or as a G-code post-processing step and validated against a printed skew calibration model; the residual after correction on the reference setup was below 0.02°. Z-shrinkage compensation was intentionally skipped on most profiles where Z-axis dimensional precision was already within the engineering tolerance for the intended application; it is worth measuring only where tall parts must hold a tight Z dimension.

Appendix C — Brand index

Alphabetical index of filament brands cited in this volume, with their primary product families and the chapter references where they appear. Brands with single-chapter coverage are listed once; brands spanning multiple polymer families are listed with the primary application axis noted.

Brand	Primary product families	Chapters
3D-Fuel	Pro PCTG (Tritan), ReFuel PCTG, PETG, PLA	6, 7, 8
3DXTech	CarbonX (CF-filled: PEEK+CF, PEKK-A+CF15, PEI 9085+CF, PA6-CF, PC-CF, PPS+CF, HTN+CF, PETG-CF); ThermaX (unfilled: PEEK, PEKK-A, PEI 9085, PSU, PPSU); 3DXLABS PEBA 90A; FluorX PVDF; 3DXSTAT ESD-Safe PC; FibreX PPA+GF15	13, 14, 15, 16, 17, 18, 19
American Filament	PCTG, PETG (US food-contact focus)	8
AzureFilm	PC-ABS, PETG, PLA, ABS (European budget tier)	15
Bambu Lab	PC, PC FR, PPS-CF, PPA-CF, PAHT-CF, PA6-CF, PA6-GF, TPU 95A, TPU for AMS, Support W	13, 14, 15, 16, 18, 20
BCN3D	PAHT CF15, BVOH; primarily for BCN3D printer ecosystem	14, 20
Braskem	FL900PP-CF (recycled CF), FL500PP-GF, FL100PP, FL105PP, FL300PE	11, 12
colorFabb	LW-PLA, PLA/PHA, allPHA, nGen copolyester	6, 7, 21
Creality	Generic "Nylon" SKUs (CoPA / PA6 base), budget engineering filaments	13
eSun	PVA, eTPU-95A, generic Nylon (CoPA), generic engineering filaments (budget tier)	13, 16, 20
Essentium	PCTG (Tritan) — legacy: exited filament production in the Nexa3D restructuring; PCTG line taken over by 3D-Fuel	8
Fiberlogy	PCTG, Nylon PA12, PA12-GF, PP, R PP (recycled), Inox metal-filled	7, 8, 11, 13
Fillamentum	PP 2320, Porthcurno (with Fishy Filaments; 100% ocean-recovered PA6 from fishing nets), NonOilen PLA/PHA, Flexfill PEBA 90A	11, 13, 16, 21
Flashforge	PPS-CF (LUVOCOM), PPA-CF, PEEK (limited)	14, 18, 19
FormFutura	AthenaX (PCTG-class), ApolloX (ASA), TitanX (ABS), Centaur PP, Atlas Support	7, 10, 11, 20
Forward AM (BASF)	Ultrafuse PC/ABS FR, PC GF30, TPU 64D/85A/95A	15, 16
Gizmo Dorks	Acetal (POM)	17
Kexcelled	K8 PC, K-class PLA and engineering grades	15
Nanovia	PC family (PC-CF and PC-ABS variants); French specialty	15
NinjaTek	NinjaFlex 85A, Cheetah 95A, Armadillo 75D	16
Nobufil	PCTG, color-focused European specialty	8
Overture	Easy Nylon (CoPA), ASA, PETG, generic engineering	10, 13
Polymaker	PolyMax PC, PolyLite PC, PC-ABS, PC-PBT, PolyMide CoPA, Fiberon PA6-CF20, PA612-CF15, PA6-GF25, PPS-CF10, PolyFlex TPU, PolyMax TPU, PolyDissolve S1, PolyTerra PLA, PolyMax PETG	6, 7, 13, 15, 16, 18, 20
PPprint	P-filament 721, P-support 279, P-surface 141 (PP system)	11
Prusament	PC Blend, PC Blend CF, PC Space Grade Black, ASA, PETG, PVB, PA11-CF Carbon Fiber, PP CF, PP GF, PLA	6, 7, 10, 11, 13, 15, 21
Qidi	PAHT-CF / PAHT-GF (PPA-based)	14
Raise3D	Industrial PPA CF, PPA GF, breakaway PPA support	14
Recreus	FilaFlex 60A/70A/82A/95A, PP3D, PP-GF	11, 16
SainSmart	TPU 95A, generic flexibles (budget tier)	16
Siraya Tech	Fibreheart PPA, PPA-CF, PPA-CF Core, TPU 64D, Pro Flex 85A, foaming line (Flex TPU Air, Roamr TPU Air HR, PEBA Air)	14, 16
Spectrum	Premium PCTG, PCTG CF10, PCTG GF, HDPE, PC CF, PC/PTFE, PC/ABS FR V0, ABS, ASA, PLA	7, 8, 10, 12, 15
Sunlu	TPU 95A, PETG, PLA, generic Nylon (budget tier)	7, 11, 13, 16
Tangled Filament	PCTG (aggressive pricing target)	8
Verbatim	BVOH (soluble support)	20

Appendix D — Consolidated references

Source list for the data values, methodologies, and references cited throughout the volume. Per the editorial principle in §1.3, the citation hierarchy is manufacturer filament TDS first, resin manufacturer TDS second, peer-reviewed literature and independent testing third, with vendor marketing relegated to the bottom of the source stack. Where a stable canonical location exists, the URL is given below with the date it was last checked (May 2026). Filament technical datasheets are versioned and their document paths change with vendor website updates; for those, the manufacturer's official domain is given as the stable entry point rather than a deep link that will rot, and the reader should expect the live TDS to supersede any figure quoted here. This list does not claim per-claim version provenance: individual numeric values were drawn from whichever TDS revision was current during preparation, and that revision is not always recoverable. Values that drive material selection should be tied back to the relevant table note or current TDS, including method, specimen type, print orientation, dry/wet conditioning, and anneal state. Treat the volume's figures as starting points to be confirmed against current vendor data, exactly as §1.3 and the Preface state.

D.1 Independent testing datasets

MyTechFun comparative filament test database. An independently compiled dataset of tensile, layer-adhesion, and thermal measurements for a large number of filaments, tested on a single reference machine with a uniform test geometry. It is a useful cross-brand sanity check on manufacturers' TDS-published values. The database is the property of its author and is distributed to the project's Patreon supporters; its specific measured values are not reproduced in this volume. Readers who want the underlying numbers should obtain them directly from the MyTechFun project (mytechfun.com and the associated Patreon), under that project's own terms. §13.7 and §14.11 discuss, in general terms, the patterns such independent testing reveals — datasheet stiffness overstating printed-part performance, and heat figures diverging by test method — without citing any of the database's figures.

Prosumer-printer community troubleshooting analysis. The author's statistical analysis of ~910 community-reported troubleshooting threads on a single prosumer printer model, classified into 15 issue categories. Cited in the polymer chapters as the empirical basis for the relative frequency of failure modes (VFA, layer adhesion loss, bed adhesion, warp) across polymer families. Method and classifier are documented in the author's published write-up; see the revision note in D.5 for where errata and supporting material are tracked.

Califlower Mk2 dimensional calibration methodology. A multi-feature XY-shrinkage test geometry published on community model repositories alongside the calibration methodology used throughout this volume. Provides both external and internal dimensional checks for shrinkage compensation tuning. The model and accompanying method notes are published on its creator's (Vector3D's) Printables profile (accessed May 2026).

D.2 Manufacturer technical datasheets Filament TDS data is cited from the manufacturers' published documents on their official websites and distributor portals. The principal manufacturer reference points used across the volume:

Manufacturer	Product families with TDS data cited
3D-Fuel	Pro PCTG, ReFuel PCTG
3DXTech	CarbonX, ThermaX, FluorX, 3DXSTAT product families
AzureFilm	PC-ABS
Bambu Lab	PC, PC FR, PPA-CF, PAHT-CF, PA6-CF, PA6-GF, TPU 95A
Braskem	FL900PP-CF, FL500PP-GF, FL100PP, FL105PP, FL300PE
Eastman	Tritan TX1001 resin TDS (foundational reference for “PCTG”-marketed filaments; strictly, Tritan is a TMCD-containing terpolymer, chemically distinct from CHDM-based PCTG — see §8.1)
Fiberlogy	PCTG, PA12, PP, R PP
Fillamentum	PP 2320, PLA-PHA NonOilen
Forward AM (BASF)	Ultrafuse PC/ABS FR, PC GF30, TPU
NinjaTek	NinjaFlex, Cheetah, Armadillo
Polymaker	PolyMax PC, PC-ABS, PC-PBT, Fiberon PA, PolyDissolve, PolyTerra, PolyMax PETG
PPprint	P-filament 721, P-support 279
Prusament	PC Blend, PC Blend CF, PC Space Grade, ASA, PETG, PVB, PA11-CF, PP CF, PP GF, PLA
Recreus	FilaFlex product line
Siraya Tech	Fibreheart PPA/PPA-CF/PPA-CF Core, TPU 64D, foaming product line
Spectrum	PCTG, PC CF, PC/PTFE, PC/ABS FR V0, HDPE

_{Table D.1 — Manufacturer TDS sources by filament family. Each manufacturer publishes current technical datasheets on its official domain (e.g. bambulab.com, prusa3d.com, polymaker.com, 3dxtech.com, fiberlogy.com, spectrumfilaments.com, basf-forward-am.com, eastman.com); those domains are the stable entry point and were the live source checked May 2026. Deep links to individual TDS PDFs are deliberately not listed because vendors revise document paths frequently — but, unlike a prior revision of this appendix, the official domains above are given so the source is locatable. Where a datasheet states a version, the volume cites it inline (for example Table 14.6 cites the Bambu Lab PPA-CF TDS V1.0); where it does not, the figure should be treated as the revision current at the time of writing and reconfirmed against the live TDS.}

D.3 Resin manufacturer reference data Base-polymer TDS data is cited from the resin producers where the filament TDS is silent on a property of interest and the filament is clearly built on a documented resin grade. The principal resin producers referenced, with their official material-data domains (accessed May 2026):

• Eastman — Tritan, Amphora, Eastar copolyester grades (eastman.com; product catalog at productcatalog.eastman.com).

• Covestro — Makrolon polycarbonate (covestro.com / solutions.covestro.com).

• SABIC — Lexan PC, ULTEM PEI (sabic.com).

• BASF — Elastollan TPU, Ultramid PA, Ultrason PSU/PPSU (basf.com; Forward AM at basf-forward-am.com).

• Arkema — Pebax PEBA, Kynar PVDF (arkema.com; hpp.arkema.com for the Kynar fluoropolymer family).

• Solvay / Syensqo — Radel PPSU, Ryton PPS, KetaSpire PEEK, AvaSpire PAEK (syensqo.com, formerly solvay.com specialty polymers).

• DuPont — Zytel and Zytel HTN polyamides, Delrin POM (dupont.com; note Delrin and the HTN line have moved through divestitures and may appear under successor-company domains).

• Victrex — PEEK 450G and related grades (victrex.com).

• Kuraray — Genestar PA9T (kuraray.com). Resin TDS and SDS documents on these domains are versioned; cite the version shown on the retrieved document for any audit use.

D.4 Standards bodies and occupational safety Test-method standards are cited by their standard number, which is the stable identifier; full texts are obtained from the issuing body's catalog. Mechanical testing: ISO 527 (tensile), ISO 178 (flexural), ISO 179 / ISO 180 (Charpy / Izod impact); ASTM D638 (tensile), ASTM D790 (flexural), ASTM D256 (Izod) — ISO standards via iso.org, ASTM standards via astm.org. Thermal testing: ISO 75 / ASTM D648 (HDT), ISO 306 / ASTM D1525 (Vicat), ASTM D3418 (DSC), ASTM D955 (mold shrinkage). Optical and surface: ASTM D1003 (haze and transmittance), ASTM D785 (Rockwell hardness). Flammability: UL94 (flame test, via ulse.org), EN45545 (rail-vehicle fire-safety, via cen.eu / national standards bodies).

Indoor air and emissions. ANSI/CAN/UL 2904, "Standard Method for Testing and Assessing Particle and Chemical Emissions from 3D Printers" (first edition, 2019) — UL Standards & Engagement, ulse.org; background and the underlying UL Chemical Safety / Georgia Tech research at chemicalinsights.ul.org. NIOSH, "Approaches to Safe 3D Printing: A Guide for Makerspace Users, Schools, Libraries, and Small Businesses," DHHS (NIOSH) Publication No. 2024-103, at cdc.gov/niosh/docs/2024-103/. NIOSH Health Hazard Evaluation Report 2017-0059-3291, "Evaluation of 3-D Printer Emissions and Personal Exposures at a Manufacturing Workplace," at cdc.gov/niosh/hhe/ (reports/pdfs/2017-0059-3291.pdf). All accessed May 2026.

Food contact and biocompatibility. U.S. FDA food-contact regulations under 21 CFR Part 177 (polymer-specific subparts), via ecfr.gov; NSF/ANSI 51 (food-equipment materials) and NSF/ANSI/CAN 61 (drinking-water system components), via nsf.org. FDA, "Technical Considerations for Additive Manufactured Medical Devices — Guidance for Industry and Food and Drug Administration Staff" (finalized 5 December 2017; docket FDA-2016-D-1210), via fda.gov. ISO 10993-1, "Biological evaluation of medical devices — Part 1: Evaluation and testing within a risk management process," via iso.org. All accessed May 2026. As §8.9 and §19.4 stress, food-contact and biocompatibility certifications attach to a resin grade or a cleared device and validated process — not to filament generically.

D.5 Editorial scope and revision context This volume was compiled May 2026, with brand surveys current to early 2026 and calibration profiles measured on the author's prosumer hardware in 2025–2026. The polymer-chemistry foundations and process-physics principles will remain accurate; the brand surveys, price ranges, and specific product availability will drift and should be verified against current vendor data for procurement decisions. Errata and updates are tracked on the author's GitHub repository alongside the supporting calibration methodology and the associated slicer calibration-edition fork.

Revision and verification policy. The volatile content classes — brand surveys, prices, product availability, and regulatory notes — should be re-verified against live sources on a roughly six-month cadence, with the check date recorded in the affected table note; the chemistry and process-physics content does not drift. Verification history: compiled May 2026; two independent accuracy passes in July 2026 corrected 65 findings (see the repository commit history for the itemized changes); regulatory notes last checked July 2026.

D.6 Source ledger Where a specific document version, revision, or docket number is known, it is recorded here so a numeric claim can be audited against the exact source revision. Values without a versioned entry are traceable only to the vendor domain and retrieval window per D.2; extend this ledger when adding or re-verifying values.

Source	Version / identifier	Used in	Checked
Bambu Lab PPA-CF TDS	V1.0	Table 14.6	May 2026
Polymaker PolyMax PC TDS	V5.4	Table 15.1 (tensile 53.4 MPa)	July 2026
Forward AM Ultrafuse PC/ABS FR TDS	v1.2	Table 15.4	July 2026
EPA methylene chloride final rule	89 FR 39254 (May 2024)	Table 26.1 regulatory note; §5.3	July 2026
EPA methylene chloride risk-management page	epa.gov/assessing-and-managing-chemicals-under-tsca/risk-management-methylene-chloride	Table 26.1 regulatory note (compliance-date updates)	July 2026
ISO 18064	2022 edition (ed. 3, 2022-04)	§16.1, Table 16.1	July 2026
NIOSH Approaches to Safe 3D Printing	DHHS (NIOSH) Publication No. 2024-103	§5.1, D.4	May 2026
NIOSH Health Hazard Evaluation	Report 2017-0059-3291	D.4	July 2026
Eastman Tritan TX1001 TDS	revision current at compilation	Table 8.2	May 2026
Siraya Tech Fibreheart PPA user manual	vendor page	§3.6, §14.9 annealing protocol	July 2026
3DXTech FibreX PPA+GF15 product page	vendor page	§14.6 and Table 14.7 hardware note	July 2026
igus iglidur i151 product page	vendor page	Table 28.1 food-contact note	July 2026

Appendix E — License and terms of use

This document is released under the Creative Commons Attribution-NonCommercial-NoDerivatives 4.0 International license (CC BY-NC-ND 4.0). The full legal text and the plain-language summary are published by Creative Commons at creativecommons.org/licenses/by-nc-nd/4.0/. The summary below states what that license means in practice; where this summary and the official license text differ, the official text governs.

E.1 What you may do

• Download and keep it. You may download this document, store it, and read it on any device, at no cost.

• Share it unchanged. You may copy and redistribute the document in any medium or format — for example, sharing the PDF with others or hosting it for free download — provided it is the complete, unmodified document.

• Use it freely for your own work. You may apply the information here to your own printing, calibration, and material-selection decisions without restriction.

E.2 Conditions and limits

• Attribution. When you share the document, keep the author identifier ("hyiger") and this license notice intact, and do not imply the author endorses you or your use of it.

• NonCommercial. You may not use the document, in whole or in part, for commercial purposes. It may not be sold, bundled into a paid product or service, placed behind a paywall, or used primarily for commercial advantage or monetary compensation.

• NoDerivatives. If you remix, transform, adapt, or otherwise build upon the document, you may not distribute the modified material. Share it as the complete original document, not as excerpts repackaged as a new work. (Brief quotation for review, commentary, teaching, or similar purposes, where permitted by applicable copyright exceptions such as fair use or fair dealing, is unaffected by this license.)

E.3 No warranty and limitation of liability This document is provided as-is and as-available, for general informational and educational purposes only. To the fullest extent permitted by law, the author offers it with no warranties of any kind concerning the document — express, implied, statutory, or otherwise — including, without limitation, warranties of accuracy, completeness, fitness for a particular purpose, or absence of errors. This as-is/as-available disclaimer is part of the CC BY-NC-ND 4.0 license and is restated here for clarity.

3D printing involves high temperatures, moving machinery, electrical equipment, solvents, and material emissions. The processes, temperatures, chemicals, and settings described in this document carry real risk of personal injury, property damage, and equipment damage. Material data is summarized from manufacturer datasheets and other sources that change over time and may contain errors. You are responsible for your own safety and for verifying any information before you rely on it. Follow the safety data sheet and technical datasheet for your specific filament, the documentation for your specific hardware, and the chemical-handling and ventilation guidance appropriate to your workspace.

To the fullest extent permitted by applicable law, the author ("hyiger") accepts no liability for any loss, injury, or damage of any kind arising from the use of, or reliance on, this document or the information in it. Use of this document is entirely at your own risk.

E.4 Trademarks and third-party material Brand names, product names, company names, and standards designations in this document are the property of their respective owners and are used for identification and descriptive purposes only. Their use does not imply any affiliation with, sponsorship by, or endorsement from those owners. This license covers the text and original tables of this document; it does not grant any rights in third-party trademarks, datasheets, standards texts, or other referenced material, which remain governed by their own terms.

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