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hexa-sscb — Solid-State Circuit Breaker (HEXA-SSCB mk1)

600 ns DC fault interruption for 48 V / 100 A buses. SiC MOSFET + BCD 180 nm

  • Σ-Δ ADC + Cortex-M4, packaged as a 4-foundry SiP. n=6 master identity governs cutoff time (6×100 ns), foundry count (τ(6)=4), and BOM lattice (σ(6)=12) — every design knob answers to that arithmetic.

Status (2026-05-06): mk1 design package frozen — paper + engineering pack + impact ladder (Mk.I → Mk.V) + runnable verify/build/tests/firmware surface. Silicon tape-out PLANNED.

License: MIT Spec: mk1 Cutoff: 600 ns Foundries: 4 BOM: $30.77 Verify: 10/10 Audit: 10/10 Firmware: builds

Distribution: GitHub canonical at https://github.com/need-singularity/hexa-sscb. Origin: extracted from n6-architecture/domains/compute/sscb/ 2026-05-06.


What is hexa-sscb?

hexa-sscb is a solid-state DC circuit breaker that interrupts a 48 V / 100 A bus fault in 600 ns — roughly 48,000× faster than a 30 ms electromechanical breaker, with no contact-arc plasma column, and a Bill-of-Materials that maps cleanly onto four Korean foundry deliverables (.own own 2):

  1. SiC MOSFET die — main interrupter, YESPOWER (예스파워테크닉스), 1200 V / 30 mΩ planar, 200 mm MPW
  2. BCD 180 nm gate driverDB HiTek (DB하이텍), 0.18 µm BCD 5M1P
  3. Σ-Δ ADC 24-bit + comparatorSK Key Foundry (SK키파운드리), 0.18 µm CMOS 1.8 V/5 V
  4. Cortex-M4 MCU + firmwareSamsung Foundry (삼성파운드리) 40 nm; mk1 commercial fallback STM32F429ZIT6

Packaging by AT&S Signetics (시그네틱스) — EDiP SiP + DBC AlN + Ag-sintered Cu interconnect.

The n=6 lattice is not decorative. It is the falsification budget:

  • cutoff_ns ≡ 6 × 100 ns
  • foundry_count ≡ τ(6) = 4
  • bom_lines ≡ σ(6) = 12
  • redundancy_depth ≡ φ(6) + τ(6) = 6

Every parameter in core/sscb/spec.md is independently falsifiable on the test bench (see §11 ACCEPTANCE in the engineering pack).


Repository layout

hexa-sscb/
├── README.md                          ← this file (public landing)
├── README.ai.md                       ← AI-native handoff (raw 271)
├── LICENSE                            ← MIT
├── core/
│   └── sscb/
│       ├── spec.md                    ← inaugural paper (387 lines)
│       ├── domain.md                  ← full domain doc (1320 lines, §1–§22)
│       └── doc/                       ← per-feature deep dives
├── module/
│   ├── engineering_pack/
│   │   └── README.md                  ← 754-line build package (BOM/PCB/firmware/test)
│   ├── impact/
│   │   └── README.md                  ← Mk.I → Mk.V impact ladder (§21+§22)
│   └── firmware/                      ← STM32F429 reference (CMSIS-only, host syntax-clean)
│       ├── src/, include/, linker/, startup/
│       └── Makefile                   ← arm-none-eabi-gcc cross-compile
├── .own                               ← project-local SSOT (mk2 own_v1) — invariants + roles + directives
├── verify/                            ← invariant audit (Python stdlib)
├── build/                             ← pandoc PDF rebuild
├── tests/                             ← pytest acceptance scaffold
└── doc/
    ├── archive/                       ← Korean predecessor + paper backup
    └── lineage/                       ← origin manifest + commit refs

The core/<feature>/ + module/<feature>/ + README.ai.md triplet follows hive raw.mk2 arch.001 (collapsed from raw 270 / 271 / 272 / 273) — the canonical core-hierarchy pattern enforced across the n6-architecture sister repositories.


Module inventory

Module What it is Lines
core/sscb/spec.md Inaugural paper — n=6 lattice, COMPARE table, ASCII bars, §1-§22 387
core/sscb/domain.md Full domain doc — exec summary, system reqs, architecture, circuit, PCB, firmware, mechanical, manufacturing, test, BOM, vendor, acceptance, appendix, IMPACT 1320
module/engineering_pack/ Hand-off build package — every number derivable, every claim falsifiable, stdlib-only Python verification appendix 754
module/impact/ §21 IMPACT ladder Mk.I → Mk.V (2026 → 2030) + §22 reduction to two practical questions 200
module/firmware/ STM32F4 reference firmware (CMSIS-only, host cross-compile) — engineering_pack §5 / domain.md §13 materialized code
verify/ Runnable invariant audit — domain.md §7 11-subsection physics check + cross-document n=6 consistency + BOM σ(6)=12 lattice reduction code
build/ Pandoc Makefile + xeCJK LaTeX template — rebuilds the three KakaoTalk-shared PDFs from the .md sources code
tests/ pytest scaffold for §16 T-1..T-10 + §19 A-1..A-10 acceptance — bench-only items skipped with reason, doc-bench-independent items auto-run code

Build & verify

python3 verify/sscb_verify.py        # 10/10 PASS expected (exit 0)
python3 verify/cross_doc_audit.py    # n=6 consistency across spec/domain/engineering_pack/impact
python3 verify/bom_lattice.py        # σ(6)=12 BOM reconciliation, total ≤ $35
make -C build all                    # rebuild 3 PDFs (requires pandoc + xelatex + CJK font)
make -C module/firmware all          # cross-compile firmware.elf (requires arm-none-eabi-gcc)
pytest tests/ -v                     # acceptance scaffold; bench-only items skip with reason

Last validation sweep — 2026-05-06

Check Result Notes
verify/sscb_verify.py ✅ 10/10 PASS §7.1 turnoff 266 ns / §7.9 BOM $31.50 / §7.10 schedule 12 mo
verify/cross_doc_audit.py ✅ 10/10 PASS cutoff_ns ≡ 600, 4-foundry stack present in spec+domain+engpack, σ(6)=12, Mk-ladder monotone
verify/bom_lattice.py ✅ PASS 19 engpack rows → σ(6)=12 lattice, total $30.77 ≤ $35
pytest tests/ ✅ 5 passed / 16 bench-skipped / 0 failed A-2 / A-3 / A-8 / A-9 (mk1-v1.0 tag) + source-checklist auto-pass; T-1..T-10 / A-1 / A-4..A-7 / A-10 skip with bench/handoff reason
make -C build all ✅ 3 PDFs built sscb_mk1.pdf 98 KB · _engineering_pack.pdf 152 KB · _impact.pdf 58 KB (.gitignore'd, not committed)
module/firmware/ ARM cross-compile firmware.elf 1996 B text · 3096 B BSS · ~5 KB total arm-none-eabi-gcc 16.1.0 (brew bare-metal) + -ffreestanding + repo-local include/freestanding/stdint.h shim — no newlib needed; on-target run still requires STM32F429 board + ST-Link
.own schema ✅ own 1/2/3 declared n=6 master identity · 4-foundry contractual · doc-first scope guard

Re-run the sweep after any spec or BOM edit. verify/ exits non-zero on drift; tests/ skip-but-not-fail on unverified bench items.


Architecture (one-line)

   48V DC bus ─┬─ SiC MOSFET ── load
               │     ▲
       Σ-Δ ADC │     │ gate
       (500kHz)│     │ (BCD 180nm driver)
               │     │
               └─► Cortex-M4 ─── 600 ns IRQ cutoff
                    │
                    └─ firmware = §13 in engineering_pack

Six 100 ns slices: sense (1) · compute (2) · drive (2) · channel collapse (1). Each slice is independently bench-falsifiable.


Caveats

  • mk1 is paper-frozen, not silicon-frozen. Tape-out is PLANNED, not RELEASED. Numbers in core/sscb/spec.md are SPICE-derived plus vendor datasheet composition; physical bring-up will refine them.
  • Single-direction (DC) only. Bidirectional cutoff is a Mk.II target (module/impact/README.md §21.mk2).
  • Auto re-close is manual on mk1. Mk.II adds firmware auto-reclosure with fault-class discrimination.
  • GaN complement + AI cutoff prediction is Mk.V (planned 2030-06-01).

Branches & tags

Ref Status Purpose
main active mk2 evolution (planned: 400 V / 200 A bidirectional, 500 ns cutoff, 2027-06-01)
mk1 archival (frozen) mk1 v1.0 preservation snapshot — never force-pushed
tag mk1-v1.0 immutable Paper-frozen mk1 design package as of 2026-05-06

When you fetch this repo and want the exact mk1 deliverable used by the inaugural paper, check out mk1-v1.0 or the mk1 branch. The main branch will diverge as Mk.II work lands per module/impact/README.md §21.mk2.

Lineage

This repository is a forensic extraction from the n6-architecture monorepo (2026-05-06). See doc/lineage/origin.md for the exact commits and source paths each file was pulled from. Two of the four source markdowns were recovered from a deletion commit (a489a368, 2026-04-21); the agent-scope content originally recovered as ai-native/CLAUDE.md was reorganized into /.own (hive raw.mk2 own_v1) on 2026-05-06.

License: MIT.

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⚡ hexa-sscb — Solid-State Circuit Breaker (HEXA-SSCB mk1). 600 ns DC fault interruption, 4-foundry Korean stack. Extracted from n6-architecture.

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