Excessive solder mask gap

[mdavidsaver]

As of 1.4.3 the solder mask gap on many components is large enough to leave no mask between IC pads, or between groups of small passives. This presents an increased risk of shorts during assembly.

For example U28:

[mdavidsaver]

Gap reduced by 4973bbf.

[mdavidsaver]

As can be seen in the above picture, excessive mask gap is much move obvious when substrate and solder mask have different colors.

[ldoolitt]

Closing with the release of v1.4.4.