Bill of Materials

QuakeGuard Bill of Materials (BOM)

This document details the exact hardware components required to assemble the QuakeGuard sensor node PCB (Printed Circuit Board). The data is exported directly from the KiCad schematics (hardware/QuakeGuard_PCB/QuakeGuard_PCB.kicad_sch).

📋 Component List

Reference(s)	Value / Component	Footprint (THT)	Qty	Description
J1, J2	ESP32-C3 SuperMini	PinSocket_1x08_P2.54mm_Vertical	2	Left & Right headers for the RISC-V MCU
J3	ADXL345	PinSocket_1x08_P2.54mm_Vertical	1	I2C Digital Accelerometer module
J4	NEO-6M / M8N GNSS	PinSocket_1x05_P2.54mm_Vertical	1	GPS Module (GNSS Sync/Triangulation)
C1, C3	10µF	CP_Radial_D5.0mm_P2.50mm	2	Electrolytic Decoupling Capacitors
C2	0.1µF	C_Disc_D5.0mm_W2.5mm_P5.00mm	1	Ceramic Decoupling Capacitor
D1	Green LED	LED_D5.0mm	1	Network / Sync Status Indicator
D2	Blue LED	LED_D5.0mm	1	GPS Fix Indicator
D3	Red LED	LED_D5.0mm	1	STA/LTA Seismic Trigger Indicator
R1, R2, R3	330Ω	R_Axial_DIN0207_L6.3mm...	3	LED Current Limiting Resistors

💡 Fabrication Note: All components use Through-Hole Technology (THT) to allow for easy manual soldering and educational assembly. The raw fabrication Gerbers (.gbr) are available in the hardware/QuakeGuard_PCB/output/ directory of the main repository.

📄 Licensing

The QuakeGuard PCB, schematics, and this BOM are released under the CERN Open Hardware Licence (CERN-OHL).