Add IMX415 sensor config for CV500 platform#47
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Closes the modern-kernel gap for the V3A SoC family. Targets the hi3516av200 SKU (most-deployed V3A in the wild and the canonical dev board variant) while sharing the OPENIPC_SOC_FAMILY=hi3519v101 dispatch with the sibling hi3519v101 SKU. Same blob ABI, same DT (arch/arm/boot/dts/hisilicon/hi3519v101.dtsi + hi3519v101-demb.dts — merged in openipc/linux PR #47), distinguished only by the SCSYSID0 sub-variant byte. Companion to [OpenIPC/openhisilicon#188] which landed the V3A OSAL/peripheral kernel-compat fixes + v3a_shim module. - br-ext-chip-hisilicon/configs/hi3516av200_neo_defconfig — new neo defconfig pointing at openipc/linux:upstream-patches (7.0-rc6 + BVT patches). Mirrors hi3516av300_neo / hi3516cv300_neo shape. BR2_OPENIPC_SOC_MODEL="hi3516av200" (the SKU under test) + BR2_OPENIPC_SOC_FAMILY="hi3519v101" (shared kernel/openhisilicon dispatch — matches the existing hi3516av200_lite_defconfig convention). - br-ext-chip-hisilicon/board/hi3519v101/hi3516av200.neo.config — per-SKU neo kernel config. ARCH_HI3519V101 + COMMON_CLK_HI3519 + HISI_HIGMAC for the HiGMAC V200 at 0x10050000. SMP disabled (QEMU emulates single A7; real silicon has A17+A7 but the A17 cluster needs cpufreq + power-domain glue that is not yet in mainline). Lives in board/hi3519v101/ alongside hi3519v101.generic /hi3516av200.generic for the lite targets — same directory convention as av200_lite. - br-ext-chip-hisilicon/board/hi3519v101/neo-post-image.sh — wraps zImage + hi3519v101-demb.dtb into uImage at 0x80008000. Same pattern as hi3516cv300_neo / hi3516av300_neo. The DTB filename is the FAMILY DT (no per-SKU device tree split in upstream- patches; v101 and av200 share dies). - general/package/hisilicon-opensdk/hisilicon-opensdk.mk - bump pin 488a76f → d23c94a (openhisilicon PR #188 merge) - install open_v3a_shim.ko → /lib/modules/3.18.20/hisilicon/v3a_shim.ko on neo variant only (lite kernel has the symbols natively; the shim compiles to a no-op stub there but is harmless to skip). - .github/workflows/build.yml — register hi3516av200_neo in the Firmware matrix under the HI3519V101 family heading. Same row shape as hi3516av300_neo / hi3516cv300_neo / hi3516ev300_neo. Verification: - QEMU (qemu-system-arm -M hi3519v101): boots to login, eth0 DHCP via HiGMAC, no Oops/panic, full V3A module set loads after openhisilicon PR #188 init-wrapper fixes. - Real hardware (openipc-hi3516av200.dlab.torturelabs.com): 27/27 modules load, zero Unknown symbol errors, module set matches baseline byte-for-byte. See openhisilicon PR #188 description for the full regression test trail. Co-Authored-By: Claude Opus 4.7 (1M context) <noreply@anthropic.com>
widgetii
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May 25, 2026
Closes the modern-kernel gap for the V3A SoC family. Targets the hi3516av200 SKU (most-deployed V3A in the wild and the canonical dev board variant) while sharing the OPENIPC_SOC_FAMILY=hi3519v101 dispatch with the sibling hi3519v101 SKU. Same blob ABI, same DT (arch/arm/boot/dts/hisilicon/hi3519v101.dtsi + hi3519v101-demb.dts — merged in openipc/linux PR #47), distinguished only by the SCSYSID0 sub-variant byte. Companion to [OpenIPC/openhisilicon#188] which landed the V3A OSAL/peripheral kernel-compat fixes + v3a_shim module. - br-ext-chip-hisilicon/configs/hi3516av200_neo_defconfig — new neo defconfig pointing at openipc/linux:upstream-patches (7.0-rc6 + BVT patches). Mirrors hi3516av300_neo / hi3516cv300_neo shape. BR2_OPENIPC_SOC_MODEL="hi3516av200" (the SKU under test) + BR2_OPENIPC_SOC_FAMILY="hi3519v101" (shared kernel/openhisilicon dispatch — matches the existing hi3516av200_lite_defconfig convention). - br-ext-chip-hisilicon/board/hi3519v101/hi3516av200.neo.config — per-SKU neo kernel config. ARCH_HI3519V101 + COMMON_CLK_HI3519 + HISI_HIGMAC for the HiGMAC V200 at 0x10050000. SMP disabled (QEMU emulates single A7; real silicon has A17+A7 but the A17 cluster needs cpufreq + power-domain glue that is not yet in mainline). Lives in board/hi3519v101/ alongside hi3519v101.generic /hi3516av200.generic for the lite targets — same directory convention as av200_lite. - br-ext-chip-hisilicon/board/hi3519v101/neo-post-image.sh — wraps zImage + hi3519v101-demb.dtb into uImage at 0x80008000. Same pattern as hi3516cv300_neo / hi3516av300_neo. The DTB filename is the FAMILY DT (no per-SKU device tree split in upstream- patches; v101 and av200 share dies). - general/package/hisilicon-opensdk/hisilicon-opensdk.mk - bump pin 488a76f → d23c94a (openhisilicon PR #188 merge) - install open_v3a_shim.ko → /lib/modules/3.18.20/hisilicon/v3a_shim.ko on neo variant only (lite kernel has the symbols natively; the shim compiles to a no-op stub there but is harmless to skip). - .github/workflows/build.yml — register hi3516av200_neo in the Firmware matrix under the HI3519V101 family heading. Same row shape as hi3516av300_neo / hi3516cv300_neo / hi3516ev300_neo. Verification: - QEMU (qemu-system-arm -M hi3519v101): boots to login, eth0 DHCP via HiGMAC, no Oops/panic, full V3A module set loads after openhisilicon PR #188 init-wrapper fixes. - Real hardware (openipc-hi3516av200.dlab.torturelabs.com): 27/27 modules load, zero Unknown symbol errors, module set matches baseline byte-for-byte. See openhisilicon PR #188 description for the full regression test trail. Co-Authored-By: Claude Opus 4.7 (1M context) <noreply@anthropic.com>
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