TFStudio 1.6.3

Changelog

v1.6.3

Added

• Simplified Chinese is now available for the app interface and bundled documentation (contributed by imyu37).
• Design Editor adds optical-thickness-preserving material replacement, Herpin group collapse/restore, rounding and quantization, repeatable thickness kicks, stack copying, and spreadsheet-style typing.
• Status monitors now cover phase, dispersion, peak field, ellipsometry, spectral features, thickness operands, and stack totals.
• Optical Evaluation adds a 0 to 1 scale; analysis plots add two-axis rectangle zoom and double-click reset.
• Process Deposition Simulator adds layer navigation via up/down arrows and focused or all-layer chart views.
• Needle Automatic, Gradual Evolution, and Structural Search keep separate history for each run.

Changed

• Status monitors use quantity-specific units and precision, a grouped picker, and a scrolling chip row.
• Process Deposition Simulator UI got updated, and its export step now defaults to 0.5 nm.

Fixed

• Updated app icon now appears in Linux application menus at standard icon sizes.
• Numeric fields in DE accept either decimal separator, reject malformed values, keep the thickness caret where clicked, and fit four-digit thicknesses.
• Process Deposition Simulator keeps its columns and timeline labels aligned; whole-sample spectra are much faster at normal incidence.
• Live plots retain hover and zoom during runs; zoom reset, rectangle zoom, and design switching now behave consistently.
• Optical Evaluation targets can be drawn and dragged again.
• Needle Automatic retries thin starting designs; Refinement stops cleanly and keeps Best available.
• Cone-angle averaging no longer blocks the Design Editor during recalculation.