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Releases: bboe/fug

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v1.0.0

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@github-actions github-actions released this 09 Aug 06:45
v1.0.0
53e9286

Manufacturing package — board rev A

Upload fug-v1.0.0-gerbers.zip to your fab.
Built from 53e92865b22c6ddf0261310a346e63e220aec8cb; the build is byte-reproducible, so
./gen/fug.py at this tag produces the same archive.

Boards from this package are marked rev A · 2026-08-08 on the
back silkscreen. That marking, not the tag, identifies the physical board.

Setting Value
Board revision A (2026-08-08)
Layers 2
Size 36 x 57 mm
Thickness 1.6 mm
Copper 1 oz - 2 oz doubles the neck's thermal conduction
Min track / hole 0.2 mm / 0.4 mm
Finish HASL

Print the footprint check sheet at 100 % on US Letter and
confirm the outline measures 36.00 x 57.00 mm before ordering.