4.0.4

Highlights

• Updated overlayfs, IPC, and diagnostic-filesystem compatibility for Linux 6.18 API changes.
• Improved namespace teardown and PID-namespace reaper handling, including a Linux 5.15-specific exit-path fallback.
• Expanded QEMU boot testing to include Android 17 / Linux 6.18.

Compatibility and testing

Release module builds remain available for the seven arm64 Android GKI KMIs listed in 4.0.3. Android 17 / Linux 6.18 is included in boot-only CI coverage; this release does not provide an Android 17 module asset.

The vendor-kernel documentation at this tag still marks remote QEMU verification of the new Linux 5.15 exit-path fallback as pending.

Changes

feature:

• Add compatibility paths for Linux 6.18 namespace, IPC, overlayfs, and diagnostic-filesystem APIs.

fix:

• Improve PID-namespace reaper handoff and vendored namespace teardown; preserve overlay credential references on Linux 6.18.

docs:

• Update the vendor-kernel compatibility notes for the Linux 5.15 exit path and newer-kernel API changes.

chore:

• Test against official Google GKI images across the KMI matrix and stream QEMU kernel logs to CI output. Android 17 / Linux 6.18 remains boot-only, without a module build.