Skip to content

dancinlab/hexa-chip

Folders and files

NameName
Last commit message
Last commit date

Latest commit

Β 

History

41 Commits
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 
Β 

Repository files navigation

πŸ”² hexa-chip β€” Chip Substrate (HEXA family)

Chip substrate β€” 28-verb semiconductor stack (architecture / design / EDA / process / packaging / NPU / PIM / 3D / photonic / RTL-gen / yield / consciousness-chip). Spec-first standalone extraction of the compute/ chip-axis from n6-architecture@c0f1f570 (2026-05-06), organised into 7 sister groups mirroring the Korean fab heritage stack (SamsungΒ·SKΒ·HynixΒ·DRAM/HBM lineage).

License: MIT Version Verbs: 28 / 7 groups Status: spec-first Provenance Verify: 5/5 Sandboxes: 29/29 Tests: 4/4

Status (2026-05-07): v1.0.x runnable-surface buildout landed. The 29 verb directories are all wired with .hexa working sandboxes (verify_<verb>.hexa per dir), a 5-check verify/cli.hexa unified verifier mirrors hexa-sscb's verify/cli.py pattern, and tests/ aggregates four invariant tests. make ci reports 5/5 verify Β· 29/29 sandboxes Β· 4/4 tests PASS.

v1.0.0 initial extraction (2026-05-06): 29 verb spec directories landed across 6 groups; per-verb sandboxes were TBD at that time. Wired in 2026-05-07 β€” see "Build & verify" below.

Distribution: GitHub canonical at https://github.com/need-singularity/hexa-chip. CLI tooling β€” installed via hx install hexa-chip from the hexa-lang registry, or git clone directly.


Why

The n6-architecture/domains/compute/ tree had grown to 28 distinct chip-axis modules organised by physical / functional layer. As hexa-chip this becomes a standalone substrate: one repo, seven sister groups, spec-first vocabulary that downstream consumers (hexa-rtsc, hexa-codex, anima) can pin without dragging the full architecture monorepo.

The 7-group decomposition tracks the actual semiconductor industry stack β€” from RTL down through fab process, then back up through advanced packaging into accelerator IP and finally into the consciousness-chip experimental axis:

                    β”Œβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”
                    β”‚  architecture group  (3 verbs)  β”‚   "what to build"
                    β”‚   architecture Β· isa_n6 Β· hexa1 β”‚
                    β””β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”¬β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”˜
                                     β”‚
                    β”Œβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β–Όβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”
                    β”‚     design group  (5 verbs)     β”‚   "how to draw it"
                    β”‚ design Β· dse Β· rtl_gen Β· eda Β·  β”‚
                    β”‚             verify_test         β”‚
                    β””β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”¬β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”˜
                                     β”‚
                    β”Œβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β–Όβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”
                    β”‚    process group  (5 verbs)     β”‚   "how to print it"
                    β”‚ process Β· materials Β· wafer Β·   β”‚
                    β”‚     yield Β· thermal_power       β”‚
                    β””β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”¬β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”˜
                                     β”‚
                    β”Œβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β–Όβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”
                    β”‚   packaging group  (6 verbs)    β”‚   "how to assemble it"
                    β”‚ packaging Β· advanced_packaging Β·β”‚
                    β”‚ chip_3d Β· hbm Β· interconnect Β·  β”‚
                    β”‚              sc                 β”‚
                    β””β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”¬β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”˜
                                     β”‚
                    β”Œβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β–Όβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”
                    β”‚  accelerator group  (8 verbs)   β”‚   "what it accelerates"
                    β”‚ npu_n6 Β· pim Β· photonic Β· accel β”‚
                    β”‚ asic Β· hexa_pim Β· hexa_3d Β·     β”‚
                    β”‚           hexa_wafer            β”‚
                    β””β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”¬β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”˜
                                     β”‚
                    β”Œβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β–Όβ”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”
                    β”‚ consciousness group  (2 verbs)  β”‚   "the experimental axis"
                    β”‚ conscious_chip Β· conscious_soc  β”‚
                    β””β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”€β”˜

n=6 invariant lattice (Οƒ(6)=12, Ο„(6)=4, Ο†(6)=2, Jβ‚‚=24) is referenced by the ISA / architecture verbs (isa_n6, hexa1) only; the other 5 groups inherit it as an organising convention without independent invariant-fit verification (see Status Β§caveats).


Verbs

28 verbs / 7 groups. Each verb maps one-to-one to a n6-architecture/ domains/compute/<canonical-name>/ source tree extracted at SHA c0f1f570.

Group A β€” architecture (3)

Verb Source (n6-arch) Scope
architecture compute/chip-architecture/ Top-level chip architecture spec
isa_n6 compute/chip-isa-n6/ n=6-invariant ISA: Οƒ=12 opcode classes / Ο„=4 modes
hexa1 compute/chip-hexa1/ Reference hexagonal chip-1 floorplan + tiling

Group B β€” design (5)

Verb Source (n6-arch) Scope
design compute/chip-design/ RTL-down design methodology spec
dse_pipeline compute/chip-dse-pipeline/ Design-space exploration pipeline
rtl_gen compute/chip-rtl-gen/ RTL generation (LLM-assisted Verilog/Chisel)
eda compute/chip-eda/ EDA flow integration (Cadence/Synopsys/Mentor)
verify_test compute/chip-verify-test/ Verification + DFT + post-Si test methodology

Group C β€” process (5)

Verb Source (n6-arch) Scope
process compute/chip-process/ Front-end process spec (FEOL / lithography)
materials compute/chip-materials/ Substrate / dielectric / metal materials
wafer compute/chip-wafer/ Wafer-level handling, defect density, scribe
yield compute/chip-yield/ Yield ramp / binning / defect Pareto
thermal_power compute/chip-thermal-power/ Thermal envelope + power delivery network

Group D β€” packaging (6)

Verb Source (n6-arch) Scope
packaging compute/chip-packaging/ Conventional packaging (FCBGA / wirebond)
advanced_packaging compute/advanced-packaging/ CoWoS / FOPLP / chiplet integration
chip_3d compute/chip-3d/ 3D-IC stacking (TSV / hybrid bonding)
hbm compute/chip-hbm/ HBM stack spec (HBM3 / HBM4 / HBM-PIM)
interconnect compute/chip-interconnect/ On-package + off-package interconnect
sc compute/chip-sc/ SC-chip substrate (depended on by hexa-rtsc)

Group E β€” accelerator (8)

Verb Source (n6-arch) Scope
npu_n6 compute/chip-npu-n6/ n=6 NPU IP (Οƒ=12 systolic lanes / Ο„=4 dataflow)
pim compute/chip-pim/ Processing-in-memory (DRAM-PIM / SRAM-PIM)
photonic compute/chip-photonic/ Silicon photonic / co-packaged optics
accel compute/hexa-accel/ Generic hexa-accelerator IP framework
asic compute/hexa-asic/ Hexa-ASIC tape-out reference flow
hexa_pim compute/hexa-pim/ Hexa-PIM (n=6 organised PIM macros)
hexa_3d compute/hexa-3d/ Hexa-3D stacking convention
hexa_wafer compute/hexa-wafer/ Hexa-wafer-level integration

Group F β€” consciousness (2)

Verb Source (n6-arch) Scope
conscious_chip compute/consciousness-chip/ Consciousness-chip experimental axis
conscious_soc compute/consciousness-soc/ Consciousness-SoC integration spec

Status

v1.0.0 closure verdict: SPEC_FIRST.

28-verb 톡합 chip substrate (7 κ·Έλ£Ή: architecture + design + process + packaging + accelerator + consciousness). Spec-first (per-verb working .hexa CLI sandboxes TBD). ν•œκ΅­ λ°˜λ„μ²΄ μ‚°μ—… 헀리티지(SamsungΒ·SKΒ·Hynix) 톀을 μœ μ§€ν•˜λ˜ μ–΄λ–€ proprietary 자료, NDA μ½˜ν…μΈ , trade-secret 도 ν¬ν•¨ν•˜μ§€ μ•ŠλŠ”λ‹€.

Working cli/hexa-chip.hexa is a placeholder dispatcher with three subcommands:

  • hexa-chip status β€” group + verb count table
  • hexa-chip show <verb> β€” echo spec path for a single verb
  • hexa-chip selftest β€” verify all 28 verb directories present

Caveats (raw#10 honest C3)

  1. 28/28 verbs are spec-only at v1.0.0. Each verb is a directory tree extracted from n6-architecture/domains/compute/<name>/ at SHA c0f1f570. Per-verb working .hexa CLI sandboxes (with simulators / falsifier preregisters / honesty audits) are deferred to post-v1.0 cycles.
  2. n=6 invariant lattice claim is partial. Only isa_n6 and hexa1 are explicitly designed against the n=6 lattice (Οƒ(6)=12, Ο„(6)=4, Ο†(6)=2, Jβ‚‚=24); the other 26 verbs inherit the lattice as organising convention only β€” no independent empirical fit at this release.
  3. No tape-out / GDSII / PDK content vendored. Foundry process kits stay proprietary; this repo ships specs + organising vocabulary only. EDA tools (Cadence/Synopsys/Mentor) remain the canonical implementation surface.
  4. Cross-link consumers (hexa-rtsc / hexa-codex / anima) reference individual verb specs; bidirectional propagation is manual (no cross-repo CI).
  5. Korea-fab heritage tone is editorial framing. Samsung / SKΒ·Hynix / DRAM / HBM lineage is invoked for organising vocabulary only β€” no proprietary data, NDA content, or trade-secret material is included.

Install

Via hx (recommended)

hx install hexa-chip                          # global, pulls latest from registry
hx install /path/to/hexa-chip --as hexa-chip  # local checkout (symlink)
hexa-chip status                              # β†’ 29-verb / 6-group table

Via git clone (works today)

git clone https://github.com/need-singularity/hexa-chip.git ~/.hexa-chip
export HEXA_CHIP_ROOT=~/.hexa-chip
export PATH="$HEXA_CHIP_ROOT/cli:$PATH"

# Run any subcommand:
hexa run "$HEXA_CHIP_ROOT/cli/hexa-chip.hexa" status
hexa run "$HEXA_CHIP_ROOT/cli/hexa-chip.hexa" selftest
hexa run "$HEXA_CHIP_ROOT/cli/hexa-chip.hexa" show npu_n6

Build & verify

A doc-first repo with a thin runnable surface β€” verify/ + tests/

  • per-verb verify_*.hexa sandboxes β€” modeled after the hexa-sscb pattern.
make verify        # 5 verify/*.hexa unified checks (n6 / inventory / cross-doc / release / falsifiers)
make verbs         # 29 per-verb sandboxes β€” verify_*.hexa under each verb dir
make tests         # 4 tests/test_*.hexa invariants
make selftest      # CLI dispatcher 29-verb sweep + sentinel
make ci            # all of the above
make list          # registered checks + tests
make install       # hx install symlink β†’ /Users/ghost/.hx/bin/hexa-chip

Last validation sweep β€” 2026-05-07

Check Result Detail
verify/cli.hexa (5 checks) βœ… 5/5 PASS n6 master-identity / 29-verb inventory / cross-doc agreement / release cadence / falsifier register
verify/verb_runner.hexa (29 verbs) βœ… 29/29 PASS every verb dir has a runnable verify_*.hexa; 0 skipped
tests/run_tests.hexa (4 tests) βœ… 4/4 PASS test_n6_lattice / test_29_verb_inventory / test_selftest / test_verify_runner
cli/hexa-chip.hexa selftest βœ… PASS __HEXA_CHIP_SELFTEST__ PASS sentinel + 29/29 dirs
hx install βœ… links + shim works ~/.hx/bin/hexa-chip status produces full 29-verb table

Re-run the sweep after any verb-dir or doc edit. make ci exits non-zero on first FAIL.

Verify checks (5)

Name What it asserts File
n6 Οƒ(6)=12, Ο„(6)=4, Ο†(6)=2, σ·φ = nΒ·Ο„ = 24 verify/n6_arithmetic.hexa
inventory 29 verb dirs + 1 .md per verb + group totals verify/inventory_check.hexa
cross-doc hexa.toml + README + .roadmap + CLI agree on 29-verb / n=6 verify/cross_doc_audit.hexa
release Β§A.2 release cadence (v1.0β†’v2.0) + Β§A.4 falsifiers present verify/release_cadence.hexa
falsifiers F-CHIP-1..F-CHIP-4 register dump verify/falsifier_check.hexa

Per-verb sandboxes (29)

Each verb directory carries a verify_<verb>.hexa (or chip_<verb>.hexa for the ISA driver) sandbox. Each:

  1. Asserts the n=6 lattice projection for the verb's domain (e.g. Οƒ(6)=12 process nodes, Ο„(6)=4 EDA stages, Jβ‚‚=24 layer ceiling).
  2. Provides at least one falsifiable claim (F-CHIP-<verb>-N).
  3. Exits 0 = invariant holds, 1 = drift detected.

Run all 29 with make verbs (or filter: hexa run verify/verb_runner.hexa --group accelerator).

Caveats (raw#10 honest C3) β€” runnable surface scope

  • The 29 sandboxes assert lattice arithmetic and presence claims only β€” none of them performs vendor-data-fit verification. The 4 falsifiers in .roadmap Β§A.4 (Samsung 2nm/3nm fit, Exynos NPU stage count, HBM4 stack height, IIT Ξ¦ measurement) remain bench-only.
  • verify/cli.hexa "all" runs in <2 s on a Mac β€” every check is a filesystem walk + arithmetic; no compute is invoked.
  • See UPSTREAM_NOTES.md for hexa-lang issues encountered (and filed at /Users/ghost/core/hexa-lang/issues/proposed/).

Cross-link

  • need-singularity/hexa-rtsc β€” SC-chip dependency (this repo's sc/ verb is the upstream substrate that hexa-rtsc consumes).
  • need-singularity/hexa-codex β€” NPU / AI-chip ↔ AI substrate (this repo's npu_n6/ + accel/ + pim/ verbs feed hexa-codex inference IP).
  • need-singularity/anima β€” conscious_chip/ + conscious_soc/ ↔ anima's consciousness substrate; experimental axis with no empirical claim at v1.0.0.

Upstream SSOT: n6-architecture/domains/compute/ (commit c0f1f570, 2026-05-06 extraction snapshot).


License

MIT β€” see LICENSE.

Copyright (c) 2026 need-singularity (λ°•λ―Όμš° nerve011235@gmail.com).

About

πŸ”² Chip substrate β€” 28-verb semiconductor stack (architecture / design / EDA / process / packaging / NPU / PIM / 3D / photonic / RTL-gen / yield / consciousness-chip).

Topics

Resources

License

Stars

Watchers

Forks

Releases

No releases published

Packages

 
 
 

Contributors