GR551x Series SoC

1. Introduction

• The Goodix GR551x family is a single-mode, low-power Bluetooth 5.1 System-on-Chip (SoC). It can be configured as a Broadcaster, an Observer, a Central, a Peripheral, and supports the combination of all the above roles, making it an ideal choice for Internet of Things (IoT) and smart wearable devices.

• Based on ARM® Cortex®-M4F CPU core, the GR551x integrates Bluetooth 5.1 Protocol Stack, a 2.4 GHz RF transceiver, on-chip programmable Flash memory, RAM, and multiple peripherals.

• The GR551x SDK is the software development kit for the GR551x SoC, offering a complete solution that integrates the protocol stacks, application samples and hardware drivers.

2. Key Features

• Bluetooth 5.1 transceiver integrates Controller and Host layers

  • Support these data transmission rates: 1 Mbps, 2 Mbps, LR (500 kbps, 125 kbps)
  • TX power: -20 dBm ~ +7 dBm
  • -96 dBm reception sensitivity (under the 1 Mbps mode)
  • -93 dBm reception sensitivity (under the 2 Mbps mode)
  • -99 dBm reception sensitivity (under the LR 500 kbps mode)
  • -102 dBm reception sensitivity (under the LR 125 kbps mode)
  • TX current: 5.6 mA @ 0 dBm，1 Mbps
  • RX current: 4.8 mA @ 1 Mbps

• Built-in ARM® Cortex®-M4F 32-bit micro-processor, supporting floating-point operation

  • Maximum frequency: 64 MHz
  • Power consumption: 51 μA/MHz

• Memory

  • Flash Configurations for GR5515 series
    • GR5515I0NDA: no embedded Flash
    • GR5515IENDU: embedded with 512 KB Flash
    • All other SoCs: embedded with 1 MB flash
  • Flash Configurations for GR5513 series
    • GR5513 series: embedded with 512 KB Flash

• Power Management

  • On-chip DC-DC Converter
  • On-chip I/O LDO to provide I/O voltage and supply external components
  • Supply voltage: 2.2 V to 3.8 V
  • I/O voltage: 1.8 V to 3.3 V
  • OFF mode: 0.15 µA (Typical), chip in reset
  • Ultra deep sleep mode: 1.8 µA (Typical), no memory retention
  • Sleep mode: 2.7 µA (Typical), 256 KB memory retention

• Peripherals

  • 2 QSPI interfaces, up to 32 MHz
  • 2 SPI interfaces (1 SPI Master Interface with 2 Slave CS pins + 1 SPI Slave Interface), up to 32 MHz
  • 2 I2C interfaces (Supports 100 kHz, 400 kHz, 1 MHz, 2 MHz)
  • 2 I2S interfaces (1 I2S Master Interface + 1 I2S Slave Interface)
  • 2 UART interfaces (One with DMA channel)
  • 13-bit ADC, up to 1 Msps, 8 channels (5 external test channels and 3 internal signal channels), supporting both single-ended and differential inputs
  • ISO 7816 interface
  • Two PWM modules with edge alignment mode and center alignment mode, each with three channels
  • Built-in temperature and voltage sensors
  • 2 general-purpose, 32-bit timer modules
  • 1 dual timer module composed of two programmable 32-bit or 16-bit down counters
  • 1 AON hardware timer
  • 2 watchdog timers (one for the system and one is always-on)
  • 1 real-time counter (RTC), can be used as Calendar
  • Wake-up comparator
  • Supports up to 39 multiplexed GPIO pins

• Security

  • Complete secure computing engine:
    • AES 128-bit/192-bit/256-bit encryption (ECB and CBC)
    • Keyed Hash Message Authentication Code(HMAC)
    • PKC
    • TRNG
  • Comprehensive security operation mechanism:
    • Secure boot
    • Encrypted firmware runs directly from Flash
    • Fuse for encrypted key storage
    • Differentiate application data key and firmware key, supporting one data per device/product

• Packages

  • QFN56: 7 mm * 7 mm * 0.75 mm, 0.40 mm pitch
  • BGA68: 5.3 mm * 5.3 mm * 0.88 mm , 0.50 mm pitch
  • BGA55: 3.5 mm * 3.5 mm * 0.60 mm, 0.40 mm pitch
  • QFN40: 5 mm * 5 mm * 0.75 mm, 0.40 mm pitch

• Operating temperature range: -40°C to +85°C

3. Production Details

		GR5515IGND	GR5515I0NDA	GR5515IENDU	GR5515GGBD	GR5515RGBD	GR5513BENDU
Status		Active	Active	Active	Active	Active	Active
Protocol	Bluetooth LE [1]	5.1	5.1	5.1	5.1	5.1	5.1
	Bluetooth Mesh	●	●	●	●	●	●
Core System	CPU	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F	Cortex®-M4F
	Clocks	64 MHz / 32K Hz	64 MHz / 32 KHz	64 MHz / 32 KHz	64 MHz / 32 KHz	64 MHz / 32 KHz	64 MHz / 32 KHz
	Cache	8 KB	8 KB	8 KB	8 KB	8 KB	8 KB
	RAM	256 KB	256 KB	256 KB	256 KB	256 KB	128 KB
	OTP
	Flash	1 MB	External Flash	512 KB	1 MB	1 MB	512 KB
Security	Root of Trust	●	●	●	●	●	●
	Secure Key Store	4	4	4	4	4	4
	PKC	●	●	●	●	●	●
	RSA	●	●	●	●	●	●
	AES	●	●	●	●	●	●
	ECC	●	●	●	●	●	●
	TRNG	●	●	●	●	●	●
Radio	Frequency	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz	2.4 GHz
	Maximum Tx Power	7 dBm	7 dBm	7 dBm	7 dBm	7 dBm	7 dBm
	Rx Sensitivity	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)	-96 dBm(@1Mbps)
Peripheral	UART	2	2	2	2	2	2
	SPI	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS	1 * SPIM / 1 * SPIS
	I2C	2	2	2	2	2	2
	QSPI	2	2	2	0	2	1
	Timers	4	4	4	4	4	4
	PWM	2	2	2	2	2	2
	RTC	1	1	1	1	1	1
	I2S	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS	1 * I2SM / 1 * I2SS
	ADC	13-bit	13-bit	13-bit	13-bit	13-bit	13-bit
	Comparator	●	●	●	●	●	●
	Temperature Sensor	●	●	●	●	●	●
	GPIO	39	39	39	29	39	22
Packages	Type	QFN56	QFN56	QFN56	BGA55	BGA68	QFN40
	Dimensions	7.0 * 7.0 mm	7.0 * 7.0 mm	7.0 * 7.0 mm	3.5 *3.5 mm	5.3 * 5.3 mm	5.0 * 5.0 mm
Certification		PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)	PSA Level 1 SIG BQB (QDID: 119449)
Operating Temperature		-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃	-40℃ - 85℃
Supply Voltage Range		2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V	2.2 V - 3.8 V
Development Kits		GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit	GR5515 Starter Kit

4. Change Log

• Click to view the change log