Changes for ARM/Qualcomm - #585
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This commit adds complete support for Qualcomm SPEL-based thermal cooling on Qualcomm SOCs. SPEL stands for SoC Power Estimation and Limiting and is a power capping mechanism that allows limiting power consumption at the SOC and SYS domain levels. Changes since v1: - Remove unused dynamic_phy_max_enable member variable - Fix domain-wide "enabled" sysfs being toggled per-constraint in set_curr_state(); power limit writes alone are sufficient for thermal control. - Add thd_cdev_spel_restore.cpp: register an atexit() handler to restore SPEL power limits and time windows on daemon exit, keyed per domain/constraint path (similar to thd_cdev_rapl_restore.cpp) - Wire thd_cdev_spel_restore.cpp into Makefile.am and Android.mk Changes since v2: - Use std::move() when forwarding _domain_type string parameter in the delegating constructor to avoid an unnecessary copy (performance-unnecessary-value-param) - Replace NULL with nullptr in opendir() and readdir() comparisons in thd_engine_default.cpp (modernize-use-nullptr) Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
Add support for platform-specific thermal configuration matching using the device tree model string, enabling thermald to apply the correct thermal rules on ARM/Qualcomm SoCs. A new <SoCModel> XML element is introduced in thermal-conf.xml Platform entries. During platform matching, thermald reads the board model string from /sys/firmware/devicetree/base/model and performs a prefix match against the configured SoCModel value. Changes in v2: - Add XML documentation for SocModel. - Address review comments on logging and code style. Signed-off-by: Priyansh Jain <priyansh.jain@oss.qualcomm.com>
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